Electrically conductive adhesives (ECA) are an alternative to tin/lead solders for attaching Surface Mount Devices (SMD) in electronic assemblies. ECAs are mixtures of a polymer binder (for adhesion) and conductive filler (for electrical conductivity). They bring more conductivity, higher strength, less weight and longer durability than metal alloys. ECAs can offer numerous advantages such as fewer processing steps, lower processing temperature and fine pitch capability. Multi walled carbon nanotubes (MWCNT) were used as conductive fillers in this research because of their novel electronic and mechanical properties. The high aspect ratio of the nanotubes makes it possible to percolate at low loadings to obtain good electrical and mechanical properties. Replacing the metal filler with CNTs in the adhesive made the ECA light weight, corrosion resistant, reduced processing temperature, lead free, electrically conductive and high mechanical strength. The MWCNTs at different loadings were mixed with epoxy and epoxy: heloxy to form a composite mixture. Different loadings, additives and mixing methods were used to obtain good electrical and mechanical properties and pot life. Pressure dispensing, screen and stencil printing were the processing techniques used for making the samples. The volume resistivity, contact resistance, die shear and lap shear tests were conducted on different surface finished Printed Circuit Boards (PCB) like silver, tin and Electro less Nickel Immersion Gold (ENIG). The results are summarized and compared with traditional methods.

Data de aprova??o ausente. / Submitted by Jos? Henrique Henrique (jose.neves@ufvjm.edu.br) on 2017-03-29T18:49:58Z No. of bitstreams: 2 license_rdf: 0 bytes, checksum: d41d8cd98f00b204e9800998ecf8427e (MD5) wagner_barbosa_souza.pdf: 2617971 bytes, checksum: 3d7e6b01cafdb0a61d93af504071663c (MD5) / Approved for entry into archive by Rodrigo Martins Cruz (rodrigo.cruz@ufvjm.edu.br) on 2017-04-24T16:36:52Z (GMT) No. of bitstreams: 2 license_rdf: 0 bytes, checksum: d41d8cd98f00b204e9800998ecf8427e (MD5) wagner_barbosa_souza.pdf: 2617971 bytes, checksum: 3d7e6b01cafdb0a61d93af504071663c (MD5) / Made available in DSpace on 2017-04-24T16:36:52Z (GMT). No. of bitstreams: 2 license_rdf: 0 bytes, checksum: d41d8cd98f00b204e9800998ecf8427e (MD5) wagner_barbosa_souza.pdf: 2617971 bytes, checksum: 3d7e6b01cafdb0a61d93af504071663c (MD5) Previous issue date: 2016 / Com o avan?o exponencial da ind?stria de eletr?nicos, o consumo destes produtos tamb?m est? crescendo largamente. Com isso, os descartes destes equipamentos tamb?m crescem na mesma propor??o. Por ano, no mundo, estima-se que mais de 25 milh?es de toneladas de lixo eletr?nico sejam descartadas. Neste trabalho foi desenvolvido um novo m?todo hidrometal?rgico ambientalmente seguro para a extra??o seletiva de cobre, n?quel e prata provenientes de res?duos de placas de circuito impresso (PCI), empregando Sistemas Aquosos Bif?sicos (SAB) como t?cnica de extra??o. O comportamento de extra??o dos ?ons met?licos Cu (II), Ni(II), Fe(III) e Ag(I)em SAB formado por copol?mero tribloco L64 + MgSO4 + H2O foi avaliado para a otimiza??o do m?todo, verificando a influ?ncia dos seguintes par?metros experimentais sobre a extra??o dos analitos: valores de pH do SAB (3,0; 6,0; 9,0 e 11,0); natureza e concentra??o dos agentes extratores 1-(2-piridil-azo)-2-naftol (PAN) para os estudo de extra??o do Cu(II), 1-nitroso-2-naftol (1N2N) e dimetilglioxima (DMG) para a extra??o do ?on Ni(II), tiocianato (SCN) e ditizona (Dz) para a extra??o da Ag(I). A efici?ncia de recupera??o seletiva dos metais foi avaliada por meio da an?lise da porcentagem de extra??o (%E) e do fator de separa??o (S) entre os ?ons de interesse. As melhores condi??es para extra??o seletiva foram: PAN [3,5 mmol.Kg-1] em pH = 6,0 em 6 etapas consecutivas para separa??o do Cu(II), DMG [5,00 mmol.Kg-1] em pH = 9,0 para o Ni(II) e SCN[5,20 mmol.Kg-1] em pH = 9,0 para a Ag(I) . Em todas as situa??es foram obtidos valores de fator de separa??o(S) entre o analito e os concomitantes met?licos maiores que 103. As condi??es ?timas obtidas foram aplicadas ao lixiviado de PCI para a extra??o de cobre, n?quel e prata de forma sequencial, obtendo-se altos valores de S entre o analito e os concomitantes met?licos (SCu,Ni= 1,46 x 103, SCu,Fe= 1,55 x 104, SCu,Ag= 1,59 x 104, SNi,Fe= 3,27 x 104, SNi,Ag= 3,47 x 104 eSAg,Fe= 4,80 x 103).Ap?s a extra??o de cada metal foi realizado um estudo de stripping em uma ?nica etapa, onde 89,5%, 92,5% e 82,5% de Cu(II), Ni(II) e Ag(I), respectivamente foram disponibilizados para a etapa de eletrodeposi??o. Portanto o m?todo utilizando SAB se mostrou eficiente e dentro dos princ?pios da qu?mica verde, pois utiliza componentes at?xicos, biodegrad?veis e recicl?veis e de r?pida separa??o de fases sem a forma??o de emuls?es est?veis. Sendo um m?todo alternativo para a extra??o liquido ? liquido tradicional. / Disserta??o (Mestrado) ? Programa de P?s-Gradua??o em Qu?mica, Universidade Federal dos Vales do Jequitinhonha e Mucuri, [2016]. / With the exponential advancement of electronic industry, the consumption of these products is also growing wide. With this, the drops of this equipment also grow at the same rate. A year in the world, it is estimated that more than 25 million tons of electronic waste are disposed.This work developed a new environmentally safe hydrometallurgical method for the selective extraction of copper, nickel and silver from waste printed circuit board (PCB) using Aqueous Two-Phase Systems (SAB) as extraction technique. The extraction behavior of metal ions Cu (II), Ni (II), Fe (III) and Ag (I) SAB formed by tri-block copolymer L64 + MgSO4 + H2O was evaluated for the optimization of the method by checking the influence of the following experimental parameters on the extraction of analytes: the SAB pH (3.0, 6.0, 9.0 and 11.0); nature and concentration of agents extractors 1- (2-pyridyl-azo) -2-naphthol (PAN) Cu for the extraction method (II), the 1-nitroso-2-naphthol (1N2N) and dimethylglyoxime (DMG) for ion extraction Ni (II), thiocyanate (SCN) and dithizone (Dz) for the extraction of Ag (I).The selective metal recovery efficiency was evaluated by the percentage extraction analysis (% E) and separation factor (S) between the ions of interest. The best conditions for selective extractions were NAP [3,5 mmol.Kg-1] at pH 6.0 in 6 consecutive stages for separation of Cu (II) DMG [5.00 mmol.Kg-1] pH = 9.0 for Ni (II) and SCN [5,20 mmol.Kg-1] at pH = 9.0 for Ag (I). In all cases they were obtained separation factor values (S) between the analyte and the larger metal Concomitant 103. The obtained optimum conditions were applied to the PCI leached copper extraction, nickel and silver sequentially, yielding if high S values between the analyte and the metal concomitant (SCU, Ni = 1.46 x 103, SCU, Fe = 1.55 x 104, SCU, Ag = 1.59 x 104, SNI, Fe = 3.27 x 104, SNI, Ag = 3.47 x 104 and SAg, Fe = 4.80 x 103).After extraction of each metal it was made a study stripping in one step, where 89.5%, 92.5% and 82.5% Cu (II), Ni (II) and Ag (I), respectively, were available for the electroplating step. Therefore, the method using BSA was efficient and within the principles of green chemistry, because it uses non-toxic, biodegradable and recyclable and fast phase separation without the formation of stable emulsions components. As an alternative method for liquid - liquid extraction traditional.

La thèse s’intéresse au comportement thermomécanique des circuits imprimés pour des applications spatiales hyperfréquences. Dans cette étude, les circuits imprimés sont des assemblages multi-matériaux faisant intervenir des substrats diélectriques (composites tissés) et des connexions en cuivre. Les circuits étudiés sont des multicouches et l’information électrique transite d'une couche à l'autre par le biais de trous traversants : des perçages réalisés à travers les différentes couches, recouverts de cuivre par électrodéposition. Tout satellite comporte de l’électronique embarquée dont le circuit imprimé constitue le support et les connexions. Dans le cadre des applications spatiales, le circuit imprimé subira des variations importantes de température. Ces chargements engendrent des déformations qui ne sont pas homogènes dans les différents matériaux, pouvant mener à des contraintes importantes qui seront source de défaillances. En effet, les coefficients d'expansion thermique des substrats diélectriques et du cuivre sont différents. À chaque cycle thermique, le cuivre est alors entrainé sous chargement alterné. Suivant les configurations, le cuivre peut se plastifier et rompre après quelques centaines ou milliers de cycles thermiques (fatigue oligo-cyclique). On remarque que les ruptures sont souvent observées dans les trous traversant. Deux volets sont identifiables dans la thèse : un premier volet de caractérisation du comportement thermomécanique des matériaux présents dans les circuits imprimés hyperfréquences (substrats composites et cuivre), et un second volet concernant les simulations de configurations stratégiques à partir des comportements identifiés / In this thesis, the thermomechanical behavior of Printed Circuit Boards with high frequency space applications is assessed. A printed circuit board is a multi-material assembly, linking dielectric substrates and copper paths. The studied PCBs are multilayers, thus drills are made through these layers with copper electrodeposited on the wall of the hole, allowing the electrical signal to go from one layer to the other. Any satellite carries embedded electronics and the PCB is the link and the support of these electronics. During the life of the PCB in space applications, important temperature changes will drive strains which are inhomogeneous in the different materials and thus will lead to important stresses, root of the observed failures. Indeed, the coefficients of thermal expansion of the dielectric substrates are different than the one of copper. For each thermal cycle, the copper undergoes thus an alternate loading. Depending on the configuration, the copper may endure plastic strain and break after hundreds or a few thousands of cycles (oligo-cyclic fatigue). These failures happen often in the copper barrels linking the different layers.Two phases are distinguishable in the thesis: a first phase in which the thermomechanical behaviors of the materials constituting high frequency printed circuit boards is assessed (composites substrates and copper), and a second phase concerning the simulations of crucial configurations thanks to the identified behaviors of the materials

Fundação de Amparo a Pesquisa no Estado do Rio Grande do Sul / Technological development and intensive marketing support the growth of demand for electrical and electronic equipment (EEE), which have as a primary component printed circuit boards (PCBs). These devices have become obsolete in a shorter period of time, then residual PCBs become a problem, requiring recycling. The PCBs are composed of ceramic, polymers and metals, especially copper, metal present in the highest percentage. In addition they contain toxic substances such as brominated flame retardants and heavy metals. So the PCBs represent a problem and an opportunity at the same time, they require proper treatment and they are composed for materials with economic value. Therefore the aim of this study was to evaluate the application of supercritical CO2 and co-solvents in the recovery of copper and polymers from mobile phone PCBs, for the development of a more efficient and environmentally friendly recycling process. The study involved the mechanical processing of PCBs separated from discarded mobile phones; the characterization of PCBs; copper recovery using the CO2 supercritical leaching and H2O2 and H2SO4 as cosolvents, this method was conducted comparatively with leaching at atmospheric pressure using H2O2 and H2SO4 as leaching agents; Electrowinning of copper supercritical leached; and recovering the polymer fraction contained in the PCBs, using ethanol as cosolvent. The results indicated that mechanical processing in two milling, carried out in a hammer mill and knives mill were important for the reduction of PCBs to particle diameter less than 2 mm. From the leaching with aqua regia, it was determined that the PCBs containing 34.83 wt% copper. The characterization steps have demonstrated that PCBs are composed of 64.02% of metal, 20.51% of ceramics and 15.47% of polymers. The results showed that the supercritical leaching is 9 times faster than the atmospheric leaching. About 90% of copper was extracted from PCBs in 20 min of supercritical leaching, employing a solid:liquid ratio of 1:20, 20% (v/v) H2O2 and H2SO4 (2.5M). From the electrowinning, performed in a current density of 250 A / m², the copper metal form was recovered with 95.97% purity, reaching a current efficiency of 99%. It was extracted 69.53% of the polymers present in the PCBs using supercritical CO2 and ethanol co-solvent at 170 ° C and 7.5 MPa. Therefore the application of supercritical CO2 and co-solvents is a promising method and efficient to PCBs recycling. / O desenvolvimento tecnológico e marketing intenso propiciam o crescimento da demanda por equipamentos elétricos e eletrônicos (EEE), os quais apresentam como componente primário as placas de circuito impresso (PCIs). Como esses equipamentos vêm se tornando obsoletos em um menor intervalo de tempo, as PCIs residuais tornam-se um problema, necessitando de reciclagem. As PCIs são compostas por cerâmicos, polímeros e metais, com destaque para o cobre, metal presente em maior percentual, além de conterem substâncias tóxicas como os retardantes de chama bromados e os metais pesados. De modo que as PCIs representam um problema e uma oportunidade ao mesmo tempo, pois requerem tratamento adequado e são compostas por materiais com valor econômico agregado. Diante disso, o objetivo deste trabalho foi avaliar a aplicação de CO2 supercrítico na presença de cosolventes para a recuperação do cobre e na remoção dos polímeros de PCIs de celulares, visando o desenvolvimento de um processo de reciclagem mais eficiente e ambientalmente aceitável. O estudo compreendeu o processamento mecânico das PCIs separadas manualmente de celulares descartados; a caracterização das PCIs; a recuperação do cobre a partir da lixiviação com CO2 supercrítico e H2O2 e H2SO4 como cosolventes, realizada de forma comparativa com a lixiviação à pressão atmosférica utilizando H2O2 e H2SO4 como agentes lixiviantes; a eletro-obtenção do cobre lixiviado supercriticamente; e a recuperação da fração polimérica contida nas PCIs, empregando etanol como cosolvente. Os resultados obtidos no processamento mecânico indicaram que as duas moagens, realizadas em moinho de martelos, seguido de facas, foram importantes para a redução das PCIs a partículas de diâmetro inferior a 2 mm. A partir das lixiviações com água régia, determinou-se que as PCIs contêm 34,83% em massa de cobre. As etapas de caracterização demonstraram que as PCIs são compostas por 64,02% de metais, 20,51% de cerâmicos e 15,47% de polímeros. Os resultados mostraram que a lixivação supercrítica é 9 vezes mais rápida do que a lixiviação à pressão atmosférica. Extraiu-se, em 20 minutos de lixiviação supercrítica, cerca de 90% do cobre contido nas PCIs, empregando uma razão sólido:líquido de 1:20, 20% (v/v) de H2O2 e H2SO4 (2,5M). A partir da eletro-obtenção, realizada em uma densidade de corrente de 250 A/m², recuperou-se o cobre na forma de depósito metálico com 95,97% de pureza, alcançando uma eficiência de corrente de 99%. Extraiu-se 69,53% dos polímeros presentes nas PCIs, a partir de CO2 supercrítico modificado com etanol, a 170°C e 7,5 MPa. Portanto a aplicação de CO2 supercrítico na presença de cosolventes é um método promissor e eficiente à reciclagem das PCIs.

Made available in DSpace on 2016-12-08T17:19:16Z (GMT). No. of bitstreams: 1 CAPA-INTRO.pdf: 65338 bytes, checksum: 29ebb2d21aacfe78d6df0edf9d832a57 (MD5) Previous issue date: 2012-02-15 / Coordenação de Aperfeiçoamento de Pessoal de Nível Superior / The aim of this work is evaluate the effect of incorporation of waste printed circuit boards (WPCB) in physical and mechanical properties of triaxial ceramics for coating. Through the technique of experiment with mixtures seven formulations were developed with clay (40, 53, 60 e 80%); phyllite (20, 33, 40 e 60%) and waste (0, 14, 20 e 40%). The WPCB was characterized by their particle size, chemical composition and thermal behavior. The mixtures were processed by wet milling, drying, granulation, uniaxial compaction and sintering at 1180 ° C. Properties measured were dried modulus of rupture (DMoR), linear firing shrinkage (LFS), fired modulus of rupture (FMoR) and water absorption (WA). Microstructures were analyzed by SEM and XRD. The thermal behavior was also studied. The WPCB showed melting behavior in the sintering process, but its addition to the material prejudice the DMoR. After firing, the FMoR is improved if are added moderate amounts of waste, but it decreases when there is an excess of waste. Was observed that the interaction between the phyllite and the waste increases the LFS, what is linked to the closing of the pores in the samples, and hence the flux characteristics of these materials. The WA also refers to this conclusion, since the addition of the waste decreases the absorption of 8.0 to 0.5%. Due the found behavior, it is possible to say that there are mixtures of clay-phyllite-WPCB, in certain proportions, that can be classified according to NBR 13818:1997 as stoneware. Microstructural characterization showed that the addition of the waste improves the sinterability of the material, however, in excess are formed glassy phase, not desired, weakening the material. The main phases present, verified by XRD are quartz and mullite, showing that the addition of the waste does not affect the formation of the main phases of interest ceramic. Thermal analysis showed that there is mass loss to 600 ° C, which can be related to the fraction of the polymer in the waste and the loss of water of constitution of the ceramics. In all cases there was an exothermic peak above 950 ° C which is related to the phase transformation of the ceramic material during sintering. / Este trabalho tem como objetivo avaliar o efeito da incorporação de resíduos de placas de circuito impresso (RPCI) nas propriedades físicas e mecânicas de misturas cerâmicas triaxiais para revestimento. Por meio da técnica de experimento com misturas foram desenvolvidas sete formulações com teor de argila de 40, 53, 60 e 80%, teor de filito de 20, 33, 40 e 60% e teor de resíduo de 0, 14, 20 e 40%. O resíduo foi caracterizado quanto à sua granulometria, constituição química e comportamento térmico. As misturas foram processadas por moagem à úmido, secagem, granulação, compactação uniaxial e sinterização a 1180°C. Foram medidas as propriedades de resistência mecânica a seco (RMS), retração linear no sinterizado (RLSi), resistência mecânica do sinterizado (RMSi) e absorção de água (AA). A verificação das microestruturas obtidas foi realizada por MEV, DRX e o comportamento térmico também foi analisado. O RPCI apresentou comportamento fundente no processo de sinterização, mas sua adição ao material prejudica a RMS. Após a sinterização, a RMSi é melhorada desde que sejam adicionadas quantidades moderadas de resíduo, pois este em excesso fragiliza o material. Observou-se que a interação entre o filito e o resíduo aumenta a RLSi, fato ligado ao fechamento dos poros nas amostras, e, portanto, às características fundentes desses materiais. A AA também remete a esta conclusão, pois a adição do resíduo diminui a absorção de 8,0 para 0,5%. Devido ao comportamento encontrado, verificou-se que a mistura de argila-filito- RPCI, em determinadas proporções, pode ser classificada, segundo a NBR 13818 : 1997 como semi-grês ou grês. A caracterização microestrutural mostrou que a adição do resíduo melhora a sinterabilidade do material, no entanto, em excesso, há formação de fase vítrea além do desejado, fragilizando o material. As principais fases presentes, verificadas por DRX, são quartzo e mulita, evidenciando que a adição do resíduo não prejudica a formação das principais fases de interesse cerâmico. A análise térmica mostrou que há perda de massa até 600°C, o que pode estar relacionado à fração polimérica do RPCI e à perda da água de constituição das cerâmicas. Para todos os casos ocorreu um pico exotérmico acima de 950°C, que está relacionado à transformação de fase do material cerâmico durante a sinterização.

Energy Harvesting, also known as power harvesting or ambient power, is the process of obtaining small amounts of power from secondary sources, such as vibrations, light, temperature variations and even radio-frequency emissions. These systems have been uncommon in personal and wearable electronics in the past, however they are slowly gaining traction. With the increasing sophistication of prosthetic limbs and implants, devices that in some cases require a consistent and reliable power source, the potential field of application for energy harvesting grows wider. This thesis project evaluates whether energy harvesting methods could be implemented in future prosthetic limb designs without significantly affecting weight, user comfort, complexity of design etc., and whether the gains of such an implementation would be worth the effort and cost put into it. For reference the project used the RHEO KNEE® by Össur Hf., a microcontroller controlled prosthetic knee, as a device that such a system could be integrated with. Energy harvesting is still an emerging field and is a long time away from being a viable primary power source for most electronic devices. However, it still might have potential as a supplementary source for extending charge cycles or making smaller (and therefore more lightweight) power cells viable. This master’s thesis project was broad in scope and included 3D-design; mechanical, electrical and embedded software design; and setting up a miniature kinetic power generator as well as a photovoltaic harvesting system. No amputees were available for testing the designs so the system was tested with a 3D-printed model that was moved by hand to simulate the generation process. Due to some incorrect inital assumptions, the final electronic design was not optimal for this kind of system. However, a kinetic generator that harvested power from a modeled heel striking the ground 50 times a minute produced about 23mW of power. 53cm2 of photovoltaic panels produced 42μW of power in an ambient light setting. For comparison, a low-power microcontroller needed about 119μW of power on average to do some simple processing and send Bluetooth transmissions once every two seconds. / Energiinsamling (e. Energy Harvesting), är processen för att erhålla små mängder kraft från sekundära källor, såsom vibrationer, ljus, temperaturvariationer och utstrålning i radiofrekvens. Dessa system har varit ovanliga i hemelektronik och bärbar teknik, men de vinner sakta dragkraft. Med den ökande förfining av proteser och implantat, som i vissa fall kräver en jämn och pålitlig strömkälla, växer det potentiella användningsområdet för energiinsamling. Detta examensarbete utvärderar huruvida energiinsamlingsmetoder skulle kunna implementeras i framtida proteskonstruktioner utan att nämnvärt påverka vikt, användarkomfort, komplexitet i design etc., och om vinsterna med en sådan implementering skulle vara värd ansträngningen och kostnaden. Som exempel använde detta projekt en datoriserad knäprotes av Össur HF, RHEO KNEE®, som exempel på ett system som energiinsamling skulle kunna integreras med. Energiinsamling är fortfarande ett växande forskningsområde och är långt ifrån att en strömkälla för det mesta elektronik.. Det kan ändå ha potential som en kompletterande strömkälla som kan förlänga laddningscykler eller göra mindre (och därför lättare) batterier möjliga. Detta examensarbete var brett i omfattning och inkluderade 3D-design; mekanisk-, elektrisk- och mjukvara-design; och inrättning av en kinetisk kraftgenerator i miniatyr samt ett ljusdrivet energiinsamlingssystem. Inga amputerade var tillgängliga för att testa designen, därför så testades systemet med en 3D-printad modell som rördes för hand för att simulera strömförsörjelseprocessen. På grund av några felaktiga initiala antaganden var den slutliga elektroniska designen inte optimal för denna typ av system. Ändå lyckades en kinetisk generator som använde energiinsamlingsprinciper producera cirka 23mW ström genom en simulerad häl som träffade marken cirka 50 gånger i minuten. 53cm2 solcellspaneler producerade 42μW energi i en ljussatt miljö. Som jämförelse behövde en strömsnål styrkrets i genomsnitt cirka 119μW effekt för att genomföra enkla programprocesser och skicka Bluetooth-överföringar en gång varannan sekund. / Hliðarorkuöflun (e. energy harvesting), sem einnig bætti kalla umhverfisöflun, er ferlið við að fá lítið magn af orku frá óbeinum aflgjafa, svo sem frá hristingi, ljósi, hitabreytingum og jafnvel útvarpsbylgjum. Þessi kerfi hafa verið sjaldgæf í raftækjum hingað til, þó þau eru hægt og rólega að fá hlutdeild. Með nýrri og fágaðri gervilimum og ígræðslum, tæki sem í sumum tilvikum þurfa samfellda og áreiðanlega orkjugjafa, víkkar mögulegt notkunarsvið hliðarorkuöflunar. Þetta lokaverkefni metur hvort aðferðir við hliðarorkuöflun gætu verið notaðar í hönnun gervilima framtíðarinnar án þess að hafa neikvæð áhrif á þyngd, þægilegheit, flóknun hönnunar o.þ.h., og hvort hagur sé í samræmi við framlag og kostnað. Þetta verkefni notar RHEO KNEE® frá Össuri Hf. sem viðmið, sem er gervihné stjórnað af örtölvu. Viðmiðinu er ætlað að sýna notagildi kerfisins. Hliðarorkuöflun er ennþá svið í þróun og er nokkuð í að það geti orðið frumorkugjafi fyrir flest raftæki. Hins vegar þá gæti það enn átt möguleika á að vera aukaorkugjafi til að auka tímalengd hverrar hleðslu eða gera minni og léttari rafhlöður raunhæfari. Þetta meistaraverkefni var viðamikið að því leiti að það fól í sér þrívíddarhönnun; vél-, raf- og hugbúnaðarhönnun; og uppsetningu á hreyfirafal ásamt ljósorkuöflunarkerfi. Engir einstaklingar sem misst hafa fót voru til staðar til að prófa hannanir þessa verkefnis. Þ.a.l. voru þær prófaðar með þrívíddarprentuðum líkönum sem hreyfð voru með handafli til að líkja eftir orkuframleiðsluferlinu. Vegna rangrar upprunalegrar forsendu þá var endanleg rafhönnunin ekki ákjósanleg fyrir slíkt kerfi. Hreyfirafall tengdur við gervihæl sem sló jörðu 50 sinnum á mínútu framleiddi þó 23mW af orku. 53cm2 af ljósorkueiningum framleiddu 42μW af afli í meðal herbergisbirtu. Til samanburðar þá eyðir skilvirk örtölva u.þ.b. 119μW af afli í einfaldri tölvuvinnslu ásamt því að senda Bluetooth sendingu á tveggja sekúnda fresti.

Trend towards downsizing the product size and at the same time to bring more functionality in electronic products, demands electrically interconnecting several miniaturized electronic components with high counts of I\Os (Input/Out put) on smaller and smaller size printed wiring boards [PWB]. These miniature components occupy lower foot print area but require higher routing interconnection densities. However, the conventional multilayer board technologies exhibit limitations when there is need to connect very high I\O components such as ball grid arrays, which require blind and buried interconnections within the multilayer mono-block. This limitation has given raise to newer methods of multi layer construction. Build–up multilayer PWB is now the technology of choice for enhanced routing capability including blind and buried interlayer connections. Build up methods are based on making very small vias within dielectric layers followed by metalisation. Typically blind and buried vias are very small, and hence called “micro vias” connecting the layers selectively within the multilayer mono-block. Buried vias make the interconnection between the consecutive layers, and blind vias connect the surface layers to any one of the interior layers in the build up multilayer board. If the blind vias are filled with a dielectric, the entire top and bottom surface area becomes available for high -density component mounting. The crux in build up board technologies is the method of creating micro-holes; a micro hole is a hole, which is less than 150 micro meter in diameter. Efforts are made to replace existing metalising techniques with “paste filling” methodologies, which would result in “SOLID CONDUCTING VIAS” CALLED AS “MICRO -INTERCONNECTS” The work reported in this thesis aims at demonstrating one such innovative ‘solid conducting via’ formation without using any of the known micro-hole formation techniques. Based on the results obtained some useful conclusions have been drawn which will perhaps go a long way in the name of “PRINTED PILLAR TECHNOLOGY” a novel methodology for building multilayer suitable for very high I\O components such as “ball grid arrays.”

This diploma thesis deals with the problems of heat transfer on printed circuit boards. The first part consists of a theoretical analysis of the principles of conduction of heat in different environments, comparing the properties of common type’s base materials for PCBs in terms of thermal properties and focuses on heat transfer from the chip. In the following part they are general information about the program ANSYS ® Workbench ™. Next part consists of the basic designs of PCBs and their improving. PCBs thermal properties for different configurations are verified with calculations, simulations and practical measurements. In the last part there are created design recommendations for PCBs design based on the comparison of the results of initial proposals and proposals to improvements.

This thesis describes the design of a new plant for the production of printed circuit boards with a capacity of 40,000 square meters per year. Describes the basic principles of a new production, production logistics principles and technological design, procedure for application of the method SLP, placement of production areas and capacity calculation of employees and machines. It also describes the technological process of production of printed circuit boards with subtractive method and discusses the different steps of production with regard to the proposed production. The practical part deals with the actual realization of the project, a selection of production technology, machinery, design the layout of the building, capacity calculations, deployment tools, practical application of the method SLP, visualization of production in the Plavis VisTable software, waste management and economic evaluation of project costs.

This Diploma thesis is aimed at various ways of connecting electrical parts in car locks. This part of the thesis includes technologies of electric cables, printed circuit boards, lead frames, 3D-MID technology and technology of electroconductive plastics materials. Listed technologies are compared. The aim of the practical thesis portion is the application of electroconductive plastic materials on the given part. For this purpose necessary changes were designed in the provided small series injection mold. The thesis also includes drawing documentation of the designed construction changes in the injection mold, as well as economic appraisal of the prototype manufacturing fees.