Neste trabalho foram estudadas as etapas de processo envolvidas na tecnologia Pin-in-Paste (PIP) de soldagem por refusão de componentes convencionais (THCs - Through Hole Components ou Componentes de Furo Passante) em placas de circuito impresso (PCIs), utilizando pasta de solda sem chumbo (lead-free) com liga SAC (Sn-Ag-Cu) de forma a atender as novas exigências ambientais para a montagem eletrônica. Inicialmente foi feito o projeto da PCI de teste com três diferentes componentes THCs e três componentes SMD com encapsulamentos distintos, com o objetivo de reproduzir uma PCI comercial. Foram gerados dois diâmetros de furos diferentes para inserir os THCs, possibilitando o estudo da variação de preenchimento com solda no PTH. Foi proposta uma equação para o cálculo do volume de pasta de solda a ser impresso sobre os furos no processo de montagem. A partir desta equação foram calculadas as dimensões dos furos do estêncil para a PCI de teste. Os parâmetros de impressão foram otimizados em função da variação de pressão e da velocidade do rodo. Duas curvas de refusão foram utilizadas, uma convencional e outra otimizada para verificar a variação na geração de defeitos. A impressão de pasta de solda ficou superior ao projetado, o que resultou em todas as amostras terem solda acima do parâmetro mínimo de aceitabilidade de volume de 75% de preenchimento do PTH. Esta sobre impressão ocasionou defeitos em boa parte dos componentes, excesso de solda nos filetes e resíduos de fluxo na solda nos PTHs. Tais defeitos foram expressivos para todos os THCs, mostrando que o excesso de pasta impressa foi decisivo na geração de defeitos para todas as combinações das variáveis estudadas. Os SMDs tiveram solda aceitável, apresentando apenas alguns casos de excesso de fluxo ou pouca solda em alguns QFPs devido ao uso de ilhas com dimensões maiores que o exigido em norma. O processo de Pin In Paste se mostra viável como substituto da solda onda em linhas de montagem para placas com SMDs e THCs, mas estudos posteriores deverão ser realizados para a geração de um modelo confiável de projeto de PCIs e estêncil com solda lead-free para que tal processo seja utilizado em grande escala na indústria. / This study describes the process steps involved in Pin-in-Paste (PIP) reflow soldering technology in printed circuit boards (PCBs) using lead-free solder paste with SAC alloy (Sn-Ag-Cu) in order to attend new environmental requirements for the electronics assembly. Initially it was designed a PCB test with three different THCs (Through Hole Component) and three different SMD (Surface Mount Device) packages in order to reproduce a commercial board. It was generated two different diameters of holes to insert the THCs, aiming to study the solder fill variation in PTH. An equation was proposed for calculating the volume of solder paste to be printed over the holes in the assembly process. From this equation it was calculated the dimensions of the holes of the stencil. The printing parameters were optimized according to the variation of pressure and speed of the squeegee. Two reflow curves were used in the process, a conventional one and an optimized one to determine the variations in the generation of soldering defects. The printed solder paste volume was higher than projected, which resulted in solder excess, causing defects in most of the components, such as excess solder in the fillet and solder flux residues in PTHs. Such defects were significant for all THCs, showing that the excess paste that was printed caused critical defects for all combinations of variables. Regarding that all samples were above the reflow minimum acceptable volume of 75% coverage of PTH. The SMDs solders were acceptable, with only few cases of solder flux excess. The Pin in Paste process was observed as a good option to replace the wave soldering thermal process for mixed PCBs. Further studies should be conducted to generate a reliable model of PCB and stencil design.

This thesis aims to prove the concept of replacing traditional electrical cabinets with PCBs on a fully electric boat. The existing solution with two electrical cabinets is considered expensive and believed to be replacable by PCBs.  Means of protections for PCBs are evaluated with regard to moisture, salt and vibrations. Two PCBs are designed to carry a current up to 60 ampere for a longer period of time. A cost analysis of 1, 10 and 100 PCBs are made to compare the cost of the proposed design to the existing solution. The result is a functioning prototype, a proposed design, cost analysis and suggested means of protections for withstanding the elements that the PCBs are exposed to at sea.Verification of the design is done by PDN Analysis and load testing with thermal imaging to monitor the temperature rise. Soley this is not enough to fully validate the design as further tests are needed and the local juristrictions has to be met before implementing these PCBs in consumer equipment.

The aim of the diploma thesis is to study the possibilities of creating a monitoring system for older production facilities already in operation. Select the necessary components for the nature of the equipment to create a system that is able to capture and provide information about activities on the equipment. The second goal is to design a suitable communication model for clear information about the operation, sending and storing data. The third goal is to analyze the dual-core ESP32 microprocessor against its predecessors in the role of system control unit.

This master thesis introduces the problematics of multilayer printed circuit boards. Theoretical part is focused on materials used for production of multilayer PCB and their parameters. At the same time, it focuses on the pressing process of multi-layered PCB, the types of presses used and their advantages and disadvantages. Practical part describes the methodology and testing of the PCB to identify the reliability of chosen electrical parameters. Testing is aimed to simulate thermal stress during machine soldering and during thermal stress in the target environment.

The main aim of this master’s thesis is to get acquainted with the theory of the current segmentation methods, that use deep learning. Segmentation neural network that will be capable of segmenting individual instances of the objects will be proposed and created based on theoretical knowledge. The main focus of the segmentation neural network will be segmentation of electronic components from printed circuit boards.

Printed Circuit Boards (PCBs) are a ubiquitous element of virtually every electronic system manufactured world-wide. It is not a stretch of the imagination to say that if it’s electronic, there is a PCB in it. PCBs are necessary tools for electronics work, and tools need to have instructions. For better or worse, PCB knowledge is a deep and wide ocean. There is much to cover for even a surface level understanding, and there are deep areas rich in technical expertise. Navigating the ocean of knowledge is treacherous; common knowledge of yore can be downright dubious now. PCB manufacturing and electronics as a whole have seen incredible developments in the past few decades, and knowledge once true may be outdated. At the same time there is a downpour of new techniques to use and challenges to face. The storm of information deepens the sea and can make it seem impossible to get anywhere without getting utterly lost. There are islands of knowledge out there hiding in books and papers and websites, but no guide to get anywhere. This thesis aims to guide the reader through the sea of information and provides a map that charts the shallows of beginner knowledge, into the deep depths of advanced design, of how and where to learn more. This thesis serves as an aiding means through the exciting and vast world of PCB design and layout.

M. Tech. (Department of Metallurgical Engineering, Faculty of Engineering and Technology), Vaal University of Technology. / Dust generated during comminution of end of life printed circuit boards (PCB), typically having d80 of 212 μm, contains copper and gold up to 6.32 % and 635 g/ton, respectively. The dust particles being highly diverse in material makeup, an hydrometallurgical processing scheme able to selectively recover target values was studied. Use of mineral acids will result in multiple metal dissolution which will complicate subsequent solution treatments. Detailed characterization of the dust was first carried out, and leaching scheme were thereafter investigated to selectively recover gold and copper from the dust, in three leaching stages. Different conditions of ammonia and thiourea leaching were investigated to optimize agitation speed, reagents concentration, temperature and leaching time. The leaching kinetics of these elements from the dust under different prevailing leaching conditions were studied. Elemental composition of the dust size fractions indicates metal contents generally increase with decreasing dust particle size, down to – 53 μm size, which contains up to 635 g/ton Au, 25.43 % Fe, and 1.40 % Cu, compared to 51 g/ton Au, 3.07 % Fe and 6.32 % Cu in the 150–212 μm fraction. Thermodynamically, under oxidative ammonia leaching, zinc and copper ammine complex is feasible, yet zinc recovery is low. For 75 – 106 μm dust size, 2 M NH4OH, 17.5 M H2O2, 1 atm. pressure and 400 rpm in Parr reactor, Cu and Zn recoveries were 92 % and 50 %, while the activation energies evaluated within 283 – 313 K gave 47.39 kJ/mol and 33.12 kJ/mol. The kinetic analysis for copper leaching gave best correlation coefficient (R2) of 0.9804 when fitted into the chemical control model, and the rate constant was 4.4 x 10-3 at 313 K. The presence of base metals frustrates direct gold recovery from the dust using thiourea with sulphuric acid and hydrogen peroxide. Therefore, the residue obtained from the first stage copper leach was acid washed to remove iron and other residual base metal contents with 5 M H2SO4, at 333 K, 400 rpm for 2 hours. Recovery analysis shows that about 75-98 % Fe, 54-65 % Zn and 96-98 % Ni were recovered under this condition while Cu was less than 7 % at all PSDs; copper having been selectively removed at the first stage. Using 75 – 106 μm dust fraction, gold recovery was optimum when the acid wash residue was leached with 0.5 M thiourea (SC(NH2)2), 0.5 M sulphuric acid (H2SO4), 0.1 M hydrogen peroxide (H2O2) under 1 atm. pressure, 298 K and 400 rpm for 4 hours. The recovery was 98 % Au. Using this optimum for other size fractions, over 98 % gold was recovered from 150–212 μm, 106 – 150 μm and 75 – 106 μm dust while 71 % and 68 % Au were recovered from 53 – 75 μm and – 53 μm respectively. The lower recovery at the finest sizes can be due to the quantity of the gold contents deported in this particle size, which will require higher reagent dosage. The kinetic analysis gave best correlation coefficient (R2) of 0.99 when fitted to the chemical control leaching model. From this data, a process flowsheet was proposed to give separate streams rich in copper and gold values from the processed dust, with detailed processing parameters. This is considered a readily scalable process solution for retrieving gold and copper from PCB dust.

[pt] O crescimento da produção de resíduos sólidos devido a evolução tecnológica, principalmente nos países em desenvolvimento, vem apresentando-se de maneira acelerada. Esta evolução acarreta na produção de novos produtos eletrônicos mais atualizados e, cada vez mais sofisticados quanto à composição química, com novas funcionalidades, tornando os antigos dispositivos obsoletos. O consumo exarcebado destes novos produtos contribui para um problema que ganha cada vez mais relevância no cenário mundial, o acúmulo de lixo eletrônico de origem urbana. O presente estudo contemplará como matéria prima amostras de placas de circuito impresso de computadores, conhecidas como PCIs, que são um padrão de barramentos, destinado a conectar periféricos à placa-mãe. Tendo em vista que nestes resíduos os teores de metais são tipicamente superiores àqueles de reservas naturais, torna-se interessante buscar rotas que viabilizem a reciclagem desses resíduos com a concomitante recuperação de constituintes de interesse ou concentração de precursores em distintos grupos para a posterior recuperação de metais. Nesta abordagem, foram realizadas análises termogravimétricas para acompanhar as melhores condições de processo e caracterização do material e produtos através de MEV/EDS. Assim, este material, tipicamente constituído por material orgânico (ex: plásticos como PVC) e constituintes inorgânicos (ex: metais e ligas metálicas), será submetido a um processamento térmico em forno tubular a 350 graus C em atmosfera inerte, seguido de etapas de concentração. A partir de 300 graus C a perda de massa se mantém constante, em torno de 30 por cento, e nas seguintes etapas aplicadas, 15 por cento da amostra total em constituintes metálicos com alto valor agregado, no caso Cu, Ni e Au, podem seguir para recuperação. / [en] The production of solid residues due to technological development has been increasing fast, mainly in developing countries. This growth leads to the manufacture of improved electronic products with varied functions, which not only are better versions of the old ones but also more sophisticated in their chemical compounds. The excessive consumption of the new devices contributes to an issue which has been increasing internationally: the accumulation of electronic waste. The raw material used in this study are samples of computer printed circuit boards (PCBs), which are a bus pattern that connects peripherals to the motherboard. Since the metal content in these residues are typically more elevated than in the ones located in natural reserves, it is interesting to find ways to recycle those residues while recovering components of interest or precursor concentrations in distinct groups for later metal recovery. Thermogravimetric analysis were performed on this approach in order to observe the best conditions of the process and the characterization of material and products was through SEM/EDS. Thus, this material, typically composed by organic material (such as plastic or PVC) and inorganic constituents (such as metals and alloys), undergoes a thermal processing in tubular furnace at 350 C degrees in inert atmosphere, followed by the concentration steps. The mass loss is constant from 300 C degrees on, around 30 percent. In the following steps, 15 percent of the total sample presents metallic components with high added value, such as Cu, Ni and Au, may be recovered.

[pt] O aumento do consumo de eletroeletrônicos e o desenvolvimento da tecnologia, proporcionou o surgimento de uma gama de produtos com diferentes funcionalidades, cada vez mais complexos e menores. As placas de circuito impresso (PCIs) são consideradas a parte principal dos dispositivos eletrônicos, sendo o cobre o seu componente elementar. O desenho e espessura das trilhas do circuito são determinantes para caracterizar a passagem de corrente elétrica nos equipamentos eletroeletrônicos e seu funcionamento está diretamente ligado a qualidade da confecção das trilhas do circuito. Este trabalho tem como objetivo estudar o processo de lixiviação do cobre, mediante a reação do ácido clorídrico, cloreto de cobre II e fluxo de ar. Além de investigar as condições experimentais ótimas do processo, que tem como principal característica a possibilidade de regeneração e reutilização da solução. Modelos para avaliar o efeito da concentração de ácido e fluxo de ar na corrosão das placas de circuito impresso foram desenvolvidos através da aplicação do planejamento experimental (pelo método clássico e por algoritmo genéticos em modelos polinomiais) e redes neurais artificiais. Visando encontrar as melhores condições experimentais para o sistema proposto, além de investigar a melhor técnica de predição do mesmo. Os resultados obtidos pelas previsões foram comparados com os resultados experimentais reais. As modelagens foram comparadas pela análise dos coeficientes de correlação (R2) e índices de erro (SSE, MSE e RMSE). Constatando-se que o modelo polinomial foi o mais adequado para prever a resposta. Através da investigação da superfície de resposta e curvas de contorno, foram identificadas as condições otimizadas para o processo. Das quais as concentrações ótimas de ácido clorídrico, cloreto de cobre II e fluxo de ar foram 1 mol.L-1, 0.3 mol.L-1 e 0.5 L/ min, respectivamente. / [en] The increased consumption of consumer electronics and the development of technology has led to the emergence of a range of products with different features, increasingly complex and smaller. Printed circuit boards (PCIs) are considered the main part of electronic devices, with copper being their elementary component. The design and thickness of the circuit tracks are crucial to characterize the passage of electric current in electronic equipment and its operation is directly linked to the quality of the circuit tracks. This work aims to study the copper leaching process through the reaction of hydrochloric acid, copper chloride II and airflow. In addition to investigating the optimal experimental conditions of the process, which has as its main feature the possibility of regeneration and reuse of the solution. Models to evaluate the effect of acid concentration and airflow on PCB corrosion were developed by applying experimental design (by the classical method and by the genetic algorithm in polynomial models) and artificial neural networks. Aiming to find the best experimental conditions for the proposed system, besides investigating the best prediction technique. The results obtained by the predictions were compared with the actual experimental results. The modeling was compared by analysis of correlation coefficients (R2) and error indices (SSE, MSE, and RMSE). Noting that the polynomial model was the most appropriate to predict the response. Through investigation of the response surface and contour curves, the optimized conditions for the process were identified. Of which the optimal concentrations of hydrochloric acid, copper chloride II and airflow were 1 mol.L-1, 0.3 mol.L-1 and 0.5 L / min, respectively.

Rising fuel costs and concerns about air pollution have significantly increased interest in electric vehicles (EVs). EVs are equipped with rechargeable batteries that can be fully recharged by connecting to an external electrical source. However, the wider adoption of EVs is hindered by the need for an on-board charger system that is both lightweight and efficient. EVs utilize two main charging methods: on-board chargers (OBC) for regular charging and off-board (fast) chargers for quick refills of battery pack. Most EVs currently use 400V battery packs paired with 6.6kW or 11kW OBCs, while larger vehicles with over 100 kWh battery packs employ 16.5kW or 19.2kW OBCs, constrained by household voltage and current limits. Some manufacturers are transitioning to 800V battery packs to lower costs and enhance fast charging capabilities, necessitating the development of 800V OBCs with high efficiency and power density. For household use, EVs can charge via OBC in a grid-to-vehicle transfer and can supply energy back to the home or grid (vehicle-to-grid) for emergency use or to support smart grid functionalities, requiring bidirectional OBCs. Advanced power semiconductor devices have been instrumental in advancing power conversion technology. The introduction of power semiconductor devices based on wide bandgap (WBG) materials marks a revolutionary shift, offering potential improvements over silicon-based devices. These WBG devices are capable of achieving higher efficiency, and higher power density in power conversion at higher operation frequency. Elevating the switching frequency diminishes the voltage-second across the transformer, facilitating the utilization of printed-circuit-board (PCB) technology for the windings as opposed to Litz wire implementations. Compared to traditional Litz wire-based transformers, the manufacturing process is significantly streamlined, and the management of parasitic is considerably more straightforward. Furthermore, the integration of resonant inductors with PCB-based transformer results in a reduction in the overall number of magnetic components and improved power density. This dissertation focuses on the DC/DC conversion stage of a bi-directional battery charger. It aims to achieve high power density and high efficiency using a PCB-based integrated transformer, enhancing manufacturing processes. The dissertation details the specific accomplishments in this area: Firstly, a two-stage on-board charger structure for 800 V battery EVs is proposed. The first stage is a four-phase bridgeless totem pole AC/DC converter working at critical conduction mode (CRM) so that soft switching can be achieved for all the fast switches. The second stage is single phase CLLC (1PCLLC) converter which is attractive due to its less component counts of devices and driver circuits. A novel matrix integrated transformer with controllable built-in leakage inductance for bi-directional 1PCLLC converter was proposed. Integrating three UI-core-based (1UI-based) elemental transformers with non-perfectly interleaved winding structures into one 3UI-based integrated transformer can reduce the core loss significantly with a smaller footprint compared with three EI-core-based integrated transformers. The proposed integrated magnetics can be scalable for higher voltage and higher power converters by assembling more 1UI-based elemental transformers. A SiC-based 1PCLLC converter prototype operating at 250-kHz switching frequency for 11-kW OBC applications was built with the proposed integrated transformer, and it can achieve a power density of 250 W/in3 with maximum efficiency of 98.4%. Secondly, the challenge of increased common mode (CM) noise after adopting PCB-based windings in the design was discussed. The inter-winding capacitors between the primary and secondary windings act as a conduction path for high dv/dt CM noise, which can lead to electromagnetic interference (EMI) issues. To address this, a winding cancellation method for an integrated matrix transformer in a 1PCLLC converter was proposed and validated. This approach was tested in an 11-kW 1PCLLC converter. The EMI measurement results align with the analysis, confirming the effectiveness of the proposed method, which achieved a reduction in CM noise by 17dB. Furthermore, the 1PCLLC converter, incorporating the proposed planar matrix integrated transformer and winding cancellation technique, attained a power density of 420 W/in³ and a peak efficiency of 98.5%. Thirdly, to enhance efficiency further, the 1PCLLC converter is substituted with the proposed three-phase CLLC (3PCLLC) resonant converter equipped with three-phase rectifiers. The 3PCLLC converter becomes more promising for high power applications as its lower RMS current stress and automatic current sharing capabilities. It can achieve soft switching under all conditions. In addition, due to the symmetrical resonant tank, it is more suitable for bi-directional operation. Variable DC-link voltage is adopted so that the DC/DC stage can always work at its optimized point, providing best efficiency for the entire battery voltage. An improved core structure for the three-phase integrated transformer was proposed to reduce the core loss and simplify the magnetic components by integrating three primary resonant inductors, three secondary resonant inductors and three transformers into one magnetic component. A systematic method of converter design which includes the design of integrated transformer, converter loss optimization was adopted to design an 11kW 3PCLLC resonant converter. A SiC-based 3PCLLC converter prototype operating at 250-kHz switching frequency for 11-kW OBC applications was built with the proposed integrated transformer, and it can achieve a power density of 330 W/in3 with peak efficiency of 98.7%. Fourthly, the power level of OBC continues to increase to make up the large capacitance battery pack inside the EVs to relief the concern of mileage range. To address this challenge of higher power, a scalable matrix integrated transformer for multi-phase CLLC converter was proposed. A universal method of integrating magnetizing inductance with built-in leakage inductance based on multiple perfectly coupled transformers (PCTs). The integration of built-in leakage inductance can be achieved by connecting several PCTs using a standardized core type for cost considerations or can be further integrated into a customized core with interleaved magnetomotive force polarities across transformer legs to achieve better flux distribution and smaller core loss. The proposed concept can be applied to single-input single-output, and multiple-inputs multiple-outputs integrated transformer applications. A 3x3 PCTs-based integrated transformer built with PCB windings was designed for a 3PCLLC resonant converter, which integrates three primary resonant inductors, three secondary resonant inductors, and three transformers into one magnetic core to simplify the complexity of the converter. The effectiveness of the proposed concept was demonstrated through a high-efficiency, high-power density 3PCLLC DC/DC converter for an 800V 16.5kW OBC. The designed converter can achieve a power density of 500 W/in3 and a peak efficiency of 98.8%. / Doctor of Philosophy / Rising fuel costs and concerns about air pollution have significantly increased interest in electric vehicles (EVs). EVs are equipped with rechargeable batteries that can be fully recharged by connecting to an external electrical source. However, the wider adoption of EVs is hindered by the need for an on-board charger system that is both lightweight and efficient. The dissertation presents advances in OBC technology to address these challenges, focusing on the development of efficient, high-power density OBCs suitable for various EV applications. EVs utilize two main charging methods: on-board chargers (OBC) for regular charging and off-board (fast) chargers for quick refills of battery pack. Most EVs currently use 400V battery packs paired with 6.6kW or 11kW OBCs, while larger vehicles with over 100 kWh battery packs employ 16.5kW or 19.2kW OBCs, constrained by household voltage and current limits. Some manufacturers are transitioning to 800V battery packs to lower costs and enhance fast charging capabilities, necessitating the development of 800V OBCs with high efficiency and power density. For household use, EVs can charge via OBC in a grid-to-vehicle transfer and can supply energy back to the home or grid (vehicle-to-grid) for emergency use or to support smart grid functionalities, requiring bidirectional OBCs. Advanced power semiconductor devices have been instrumental in advancing power conversion technology. The introduction of power semiconductor devices based on wide bandgap (WBG) materials marks a revolutionary shift, offering potential improvements over silicon-based devices. These WBG devices are capable of achieving higher efficiency, and higher power density in power conversion at higher operation frequency. Elevating the switching frequency diminishes the voltage-second across the transformer, facilitating the utilization of printed circuit board (PCB) technology for the windings as opposed to Litz wire implementations. Compared to traditional Litz wire-based transformers, the manufacturing process is significantly streamlined, and the management of parasitic is considerably more straightforward. Furthermore, the integration of resonant inductors with PCB-based transformer results in a reduction in the overall number of magnetic components and improved power density. Addressing cost concerns, a novel, cost-effective single-phase converter design was proposed, achieving high efficiency with integrated magnetics. Additionally, the research tackled the challenge of electromagnetic interference (EMI) through a winding cancellation technique, significantly reducing common-mode noise and further improving the converter's performance. The research introduces an improved core structure for a three-phase integrated transformer, significantly reducing core loss and simplifying the design by combining multiple components into a single unit. This approach facilitated the creation of a high-efficiency, SiC-based converter prototype, demonstrating remarkable power density and peak efficiency compared with state-of-the-art solutions. To accommodate the increasing power requirements of OBCs, a scalable, matrix integrated transformer design was developed for multi-phase converters, optimizing cost and performance. This design simplifies the converter architecture, enhancing efficiency and power density, and is adaptable to both single and multiple output applications. These advancements offer promising solutions to the challenges hindering the wider adoption of EVs. The dissertation underscores the potential of advanced power conversion technologies, including the application of WBG devices, integrated magnetics to streamline converter design and enhance both the efficiency and power density of battery chargers.