abstract: Ordered buckling of stiff films on elastomeric substrates has many applications in the field of stretchable electronics. Mechanics plays a very important role in such systems. A full three dimensional finite element analysis studying the pattern of wrinkles formed on a stiff film bonded to a compliant substrate under the action of a compressive force has been widely studied. For thin films, this wrinkling pattern is usually sinusoidal, and for wide films the pattern depends on loading conditions. The present study establishes a relationship between the effect of the load applied at an angle to the stiff film. A systematic experimental and analytical study of these systems has been presented in the present study. The study is performed for two different loading conditions, one with the compressive force applied parallel to the film and the other with an angle included between the application of the force and the alignment of the stiff film. A geometric model closely resembling the experimental specimen studied is created and a three dimensional finite element analysis is carried out using ABAQUS (Version 6.7). The objective of the finite element simulations is to validate the results of the experimental study to be corresponding to the minimum total energy of the system. It also helps to establish a relation between the parameters of the buckling profile and the parameters (elastic and dimensional parameters) of the system. Two methods of non-linear analysis namely, the Newton-Raphson method and Arc-Length method are used. It is found that the Arc-Length method is the most cost effective in terms of total simulation time for large models (higher number of elements).The convergence of the results is affected by a variety of factors like the dimensional parameters of the substrate, mesh density of the model, length of the substrate and the film, the angle included. For narrow silicon films the buckling profile is observed to be sinusoidal and perpendicular to the direction of the silicon film. As the angle increases in wider stiff films the buckling profile is seen to transit from being perpendicular to the direction of the film to being perpendicular to the direction of the application of the pre-stress. This study improves and expands the application of the stiff film buckling to an angled loading condition. / Dissertation/Thesis / M.S. Mechanical Engineering 2010

The development of wearable devices to monitor biosignals and collect real-time data from biological systems at all scales from cellular to organ level has played a significant role in the field of medical engineering. The current coronavirus disease 2019 (COVID-19) pandemic has further increased the demand for remote monitoring and smart healthcare where patient data can be also be accessed from a remote distance. Recent efforts to integrate wearable devices with artificial intelligence and machine learning have transformed conventional healthcare into smart healthcare, which requires reliable and robust recording data. The biomedical devices that are mechanically stretchable and compliant have provided the capability to form a seamless interface with the curvilinear, soft surface of tissues and body, enabling accurate, continuous acquisition of physical and electrophysiological signals. This dissertation presents a comprehensive set of functional materials, design principles, and fabrication strategies to develop mechanically stretchable and compliant biomedical devices tailored for various applications, including (1) a stretchable sensor patch enabling the continuous monitoring of swallowing function from the submental/facial area for the telerehabilitation of patients with dysphagia, (2) a human hand-like sensory glove for advanced control of prosthetic hands, (3) a mechanically compliant manipulator for the non-invasive handling of delicate biomaterials and bioelectronics, and (4) a stretchable sensors embedded inside a tissue scaffold enabling the continuous monitoring of cellular electrophysiological behavior with high spatiotemporal resolution.<br>

The proposed study develops a framework that can accurately capture and model input and output variables for multidisciplinary systems to mitigate the computational cost when uncertainties are involved. The dimension of the random input variables is reduced depending on the degree of correlation calculated by relative entropy. Feature extraction methods; namely Principal Component Analysis (PCA), the Auto-Encoder (AE) algorithm are developed when the input variables are highly correlated. The Independent Features Test (IndFeaT) is implemented as the feature selection method if the correlation is low to select a critical subset of model features. Moreover, Artificial Neural Network (ANN) including Probabilistic Neural Network (PNN) is integrated into the framework to correctly capture the complex response behavior of the multidisciplinary system with low computational cost. The efficacy of the proposed method is demonstrated with electro-mechanical engineering examples including a solder joint and stretchable patch antenna examples.

Electronic platforms that are able to re-shape and assume different geometries are attractive for the advancing biomedical technologies, where the re-shaping feature increases the adaptability and compliance of the electronic platform to the human body. In this thesis, we present a serpentine-honeycomb reconfigurable electronic platform that has the ability to reconfigure into five different geometries: quatrefoil, ellipse, diamond, star and one irregular geometry. We show the fabrication processes of the serpentine-honeycomb reconfigurable platform in a micro-scale, using amorphous silicon, and in a macro-scale using polydimethylsiloxane (PDMS). The chosen materials are biocompatible, where the silicon was selected due to its superior electrical properties while the PDMS was selected due to its unique mechanical properties. We study the tensile strain for both fabricated-versions of the design and we demonstrate their reconfiguring capabilities. The resulting reconfiguring capabilities of the serpentine-honeycomb reconfigurable platform broaden the innovation opportunity for wearable electronics, implantable electronics and soft robotics.

abstract: Gallium-based liquid metals are of interest for a variety of applications including flexible electronics, soft robotics, and biomedical devices. Still, nano- to microscale device fabrication with these materials is challenging because of their strong adhesion to a majority of substrates. This unusual high adhesion is attributed to the formation of a thin oxide shell; however, its role in the adhesion process has not yet been established. In the first part of the thesis, we described a multiscale study aiming at understanding the fundamental mechanisms governing wetting and adhesion of gallium-based liquid metals. In particular, macroscale dynamic contact angle measurements were coupled with Scanning Electron Microscope (SEM) imaging to relate macroscopic drop adhesion to morphology of the liquid metal-surface interface. In addition, room temperature liquid-metal microfluidic devices are also attractive systems for hyperelastic strain sensing. Currently two types of liquid metal-based strain sensors exist for inplane measurements: single-microchannel resistive and two-microchannel capacitive devices. However, with a winding serpentine channel geometry, these sensors typically have a footprint of about a square centimeter, limiting the number of sensors that can be embedded into. In the second part of the thesis, firstly, simulations and an experimental setup consisting of two GaInSn filled tubes submerged within a dielectric liquid bath are used to quantify the effects of the cylindrical electrode geometry including diameter, spacing, and meniscus shape as well as dielectric constant of the insulating liquid and the presence of tubing on the overall system's capacitance. Furthermore, a procedure for fabricating the two-liquid capacitor within a single straight polydiemethylsiloxane channel is developed. Lastly, capacitance and response of this compact device to strain and operational issues arising from complex hydrodynamics near liquid-liquid and liquid-elastomer interfaces are described. / Dissertation/Thesis / Masters Thesis Materials Science and Engineering 2015

Stretchable Electronics is an emerging class of electronics that allow electronics to be bent, conform, ex and stretch while still retaining its full functionality. Other than bending, existing and conforming, adding stretchability to electronic systems can open up a new frontier for a myriad of applications. Especially in the medical sector, these stretchable devices can increase the scope of monitoring and ease and comfort of the patient. All kinds of wearable devices can be based on these technologies to augment our daily lives. With the kind of state of art technology available to the common man today, the bar has already been set for the performance of such devices. Hence, its imperative that these stretchable devices perform at this level and should be capable of adapting to the market to serve the mass requirement. Hence, it becomes inevitable to use metal interconnects to provide very low resistance and easy adhesion to commercial electronic components. Another aspect of such devices is an adhesion ability with which we can attach it to various kinds of surfaces. In this thesis, we propose a new multi-layered PDMS structure approach to bring stretchability in the device. For all kinds of adhesion requirements, various ratios of PDMS: Cross-linker have been used. These different ratios of PDMS: Cross-linker changes the mechanical and adhesive properties of the cured PDMS. Hence, the same material can be used as the stretchable substrate as well as to serve various adhesion requirements. A soft adhesion allows us to attach it to the human body/other surfaces. The adhesion can be tailored to be quite conformal and strong, yet its removal is quite gentle to the skin. A higher curing ratio makes the PDMS very sticky and soft. Aluminum/Copper foils can be directly stuck upon it and tracks can be then etched out to get a printed circuit. Since this adhesive layer is quite soft, it acts as a cushion and reduces the amount of stress transferred to the metal interconnects. Hence, stretchable circuits with metal interconnects can be realized. The electronic components can be then attached upon it via normal soldering techniques/using conductive ink. Various devices that can be built with the proposed techniques have been coined the term CAS (Conformal Active Sheets) to allow easy reference to such kind of devices. Since the substrate is soft, physical handling of such devices becomes an issue as one tries to transfer the circuit pattern. Hence, direct etching of the metal foil was explored via high pulsed current discharge technique. A CNC machine was also designed to try various ways of direct etching of the metal foil in an accurate and repeatable fashion.

With the advancement of silicon electronics under threat from physical limits to dimensional scaling, the International Technology Roadmap for Semiconductors (ITRS) released a white paper in 2008, detailing the ways in which the semiconductor industry can keep itself continually growing in the twenty-first century. Two distinct paths were proposed: More-Moore and More-than-Moore. While More-Moore approach focuses on the continued use of state-of-the-art, complementary metal oxide semiconductor (CMOS) technology for next generation electronics, More-than-Moore approach calls for a disruptive change in the system architecture and integration strategies. In this doctoral thesis, we investigate both the approaches to obtain performance improvement in the state-of-the-art, CMOS electronics. We present a novel channel material, SiSn, for fabrication of CMOS circuits. This investigation is in line with the More-Moore approach because we are relying on the established CMOS industry infrastructure to obtain an incremental change in the integrated circuit (IC) performance by replacing silicon channel with SiSn. We report a simple, low-cost and CMOS compatible process for obtaining single crystal SiSn wafers. Tin (Sn) is deposited on silicon wafers in the form of a metallic thin film and annealed to facilitate diffusion into the silicon lattice. This diffusion provides for sufficient SiSn layer at the top surface for fabrication of CMOS devices. We report a lowering of band gap and enhanced mobility for SiSn channel MOSFETs compared to silicon control devices. We also present a process for fabrication of vertically integrated flexible silicon to form 3D integrated circuits. This disruptive change in the state-of-the-art, in line with the More-than-Moore approach, promises to increase the performance per area of a silicon chip. We report a process for stacking and bonding these pieces with polymeric bonding and interconnecting them using copper through silicon vias (TSVs). We report a process for fabricating through polymer vias (TPVs) facilitating the fabrication of sensor arrays and control electronics on the opposite sides of the same flexible polymer. Finally, we present a process to fabricate stretchable metallic thin films with up to 800% stretchability, and report two distinct applications for these devices which cannot be done using current techniques.

Next-generation soft robots, wearable health monitoring devices, and human-machine interfaces require electronic systems that can maintain their performance under deformations. Thus, researchers have been developing materials and methods to enable high-performance soft electronic systems in diverse applications. While a variety of solutions have been presented, development of stretchable materials with a combination of high stretchability, electrical conductivity, cyclic stability, and manufacturability is still an open challenge. Throughout this dissertation, gallium-based<br>liquid metal alloy is used as the conductive material, leveraging its high conductivity and intrinsic stretchability for maintained performance under deformations. This dissertation presents both new liquid metal-based conductive materials and scalable manufacturing methods for the development of a diverse range of flexible and stretchable electronic circuits. First, a laser sintering method was developed to coalesce liquid metal micro/nanoparticles into soft, conductive structures enabled by oxide rupturing. The fast, non-contact, and maskless laser sintering technique, in combination with large-area spray-printing deposition, and high-throughput emulsion processing, provided a methodology to create different physical manifestations of liquid metal-based soft, stretchable, and reconfigurable electronics. Second, a liquid metal-based biphasic material was created using a thermal processing technique, yielding a printable, mechanically stable, and extremely stretchable conductor. This material’s compatibility with existing scalable manufacturing methods, robust interfaces with off-the-shelf electronic components, and electrical/mechanical cyclic stability enabled direct conversion of established circuit board assemblies to stretchable forms. The work presented in this dissertation paves the way for future mass-manufacturing of<br>soft, stretchable circuits for direct integration into smart garments or soft robots. <br>

Significant developments in flexible/stretchable electronics are needed due to the increasing demand for stretchable sensors in soft robotics, prostheses, and human-machine interfaces. Stretchable strain sensors must be extremely sensitive to the applied strain in order to be used in monitoring human movement, tracking pulses, and identifying sounds. Percolated networks based on nanomaterials with intrinsic stretchability are primarily used to create large stretchable strain sensors with high sensitivity and stretchability. However, sensitivity and stretchability are two opposite faces of a coin, and these sensors face limited sensitivity both in tension and compression.The aforementioned drawbacks limit application such as large-scale deformable surface monitoring and effective e-skins for monitoring complex strain states. Pollution from strain, on the other hand, is a problem that must be avoided for other types of stretchable sensors. Strain-insensitive sensors are mostly based on the geometrical design with a complicated fabrication. New methods for developing strain-insensitive sensors based on percolated networks are urgently needed to simplify the fabrication process. Four objectives are listed to solve the problems as mentioned above: to develop a method to balance the stretchability and sensitivity; to design a stretchable strain sensor with whole range working ability; to create a strain insensitivity sensor different from the geometry design; to investigate the physical mechanism of the new method. In Chapter 2, a laser engraving method was used to increase the crack density in CNT paper, which successfully improved the stretchability while maintaining the high sensitivity. Then, in Chapter 3, a pre-stretching/releasing method was used to partially open the cracks in CNT paper in order to achieve sensitivity in both positive and negative strain. The Seebeck effect of percolated networks was then used to develop a strain-insensitive temperature sensor in Chapter 4. Finally, in Chapter 5, we performed a theoretical analysis to reveal the physical mechanism of the Seebeck coefficient’s stability in percolated networks.

A stretchable silver ink was screen printed to TPU sheets, then tensile coupons of the TPU, both bare and laminated to cotton, Denim and spandex fabric, were subjected to 1000 cycles of 20% uniaxial strain. In-situ resistance measurements of printed traces were processed to generate datasets of maximum and minimum resistance per cycle. A mechanistic fit model was used to predict the resistance behavior of the ink across TPU/fabric levels. The results show that traces strained on TPU laminated to spandex (polyester) fibers had an average rate of increase in resistance significantly lower than that of traces strained on bare TPU. The variation in predicted resistance was significantly lower in the spandex group than in the TPU group. Trace width was not found to have a significant effect on the resistance behavior across TPU/fabric groups. More testing is required to understand the effect of lamination to high elasticity fabrics on resistance behavior as it relates to the viscoelastic properties of the fibers and weave structure.