- About
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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 21 to 30 of 56 (0.087 seconds)Spelling suggestions: "subject:"burface count technology"" "subject:"1surface count technology""
| 21 |
High throughput flip chip assembly process and reliability analysis using no-flow underfill materialsThorpe, Ryan 05 1900 (has links)
No description available.
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| 22 |
Design and integration of a large area warpage measurement systemPetriccione, Gregory James 05 1900 (has links)
No description available.
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| 23 |
Solder paste inspection based on phase shift profilometryHui, Tak-wai. January 2007 (has links)
Thesis (M. Phil.)--University of Hong Kong, 2008. / Also available in print.
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| 24 |
Investigations on damage mechanics and life prediction of fine-pitch electronics in harsh environmentsIslam, Mohd Nokibul, LAll, Pradeep. January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
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| 25 |
Scheduling batch processing machines in a flow shopManjeshwar, Praveen Kumar. January 2005 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2005. / Includes bibliographical references.
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| 26 |
Solution to a bay design and production sequencing problemCreswell, Steven Howard, 1961- January 1989 (has links)
This thesis addresses the problem of setting up a surface mount placement machine for production. The objective is to minimize the number of machine changeovers made during a production run consisting of a number of circuit cards. The solution to the problem involves two separate decisions. The first decision considers determining how to combine feeders together in "bays" or groups of feeders, and how to assign the bays to the circuit cards. The second decision considers the circuit card production sequence. A mathematical programming formulation is given, however, its solution is very difficult for problems of a realistic size. Several heuristic approaches are suggested and used to solve actual and test problems. The heuristic for bay design uses clustering techniques used in Group Technology while the sequencing problem is solved using heuristics based on solution techniques for the Traveling Salesman problem.
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| 27 |
Analysis of the solder paste release in fine pitch stencil printing processesRodriguez, German Dario 08 1900 (has links)
No description available.
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| 28 |
Reworkable high temperature adhesives for Multichip Module (MCM-D) and Chip-on-Board (COB) applicationsPike, Randy T. 08 1900 (has links)
No description available.
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| 29 |
Modeling and experiments of underfill flow in a large die with a non-uniform bump patternZheng, Leo Young. January 2008 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2008. / Includes bibliographical references.
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| 30 |
Advanced process window design for 01005 assembliesRamasubramanian, Arun Shrrivats. January 2008 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, Thomas J. Watson School of Engineering and Applied Science, 2008. / Includes bibliographical references.
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