- About
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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 11 to 20 of 56 (0.059 seconds)Spelling suggestions: "subject:"burface count technology"" "subject:"1surface count technology""
| 11 |
An intelligent sensor fusion approach to pattern recognition with an application to bond validation of surface-mount componentsDar, Iqbal Mahmud 12 1900 (has links)
No description available.
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| 12 |
Prediction of thermally induced printed wiring board warpageGarratt, Jeffery David 12 1900 (has links)
No description available.
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| 13 |
High yield flip chip processing and failure mode analysis for surface mount applicationsTsai, Wen-Kai Mike 08 1900 (has links)
No description available.
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| 14 |
Improved prediction modeling with validation for thermally-induced PWB warpagePolsky, Yarom 05 1900 (has links)
No description available.
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| 15 |
Testing methodology for reflow soldering process : compatibility evaluation of surface mount technology /Guo, Weiqing, January 2001 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 2001. / Vita. Includes bibliographical references (leaf 235). Available also in a digital version from Dissertation Abstracts.
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| 16 |
Solder paste inspection based on phase shift profilometryHui, Tak-wai., 許德唯. January 2007 (has links)
published_or_final_version / abstract / Electrical and Electronic Engineering / Master / Master of Philosophy
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| 17 |
A simulation model to analyze post reflow processes at an electronics manufacturing facilityGeorge, Gikku J. January 2006 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2006. / Includes bibliographical references.
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| 18 |
Implementation and qualification of a prototype tester for reflow soldering process compatability evaluation of surface mount technology componentsWong, Anthony Yin-bong 23 June 2011 (has links)
Not available / text
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| 19 |
Application of the integral equation asymptotic phase method to penetrable scatterersHidle, Frederick B. 05 1900 (has links)
No description available.
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| 20 |
Analysis of interconnect yield for a high throughput flip chip assembly processMcGovern, Lawrence P. 12 1900 (has links)
No description available.
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