The Wire and Cable industry is the medium of consuming industry to offer for electricity, communication, electronics, information, electrical home appliances and national defense, etc. Such categories include heavy industry, light industry and consuming industry. It is also the connection of national infrastructure and of folk construction. The impact of external environments, such as global depression, unemployment rate increasing, deflation and the changes of the inherent environment on the vibration of political and economical situation make the demand slowed down, and profit fell. Because various in style and wide use range, the Wire and Cable industry should set about from the analysis of the industrial structure, strategies, the wire & cable market of Taiwan at present. At the same time, The Wire & Cable industry is a skill-intensive industry too, containing machinery, organization, electronics, electrical machinery, chemical industry, physics as well as the knowledge of optics, photo-electricity, so it needs systematic integration to construct the skill that the industry can compete continuously. It is a competitive environment of chasing meager profit. Technology has become the key resources of enterprises, and it has already become the important issue how to create and utilize new knowledge for managing modern companies. At the beginning when manage enterprises, how to make the positioning, build the necessity and urgency of resources management, produce the systematic operation model and construct the core competencies from external management to internal activities. Owning to the lack of profundity and reference of the core flow about the Wire and Cable industry, especially technical construction, the research used literature review and case study to discover the technical construction model concerning enterprise's strategies, views of knowledge management and technological resource management with interview and questionnaire, This research plans to achieve the following items: 1.offer to understand the platform of management strategies for the Wire and Cable industry. 2.offer the workflow model of technology construction for the Wire and Cable industry.

As the IC assembly technology fast developing in the modern electrical industries. Demand of high performance electric product is glowing up day by day. New generation of the hybrid IC assembly package has become the major role recently. In order to prevent the package defects occurring in end customer sites, in this paper we try to improve the IC assembly method by using a totally different process to fix the passive component on a BGA substrate. We found that the passive component can be proceeded the current gold wire bonding process. In case of the Hybrid BGA with the current passive component attaching process, we can find the thermal effect during the surface mount process. Since the solder can be melt every time during each heating process. Therefore, we plan to improve it without solder attachment. The new improvement is to fix the passive component by a non-conductive thermal cure glue. The glue can be done in one time cure, thus the further process would not influence the quality of passive component. However in the evaluation experiment, the component coated by Gold is the best choice, but we intend to just put it in a comparison model because of the cost consideration. Both works on passive component coated by Gold and Solder were proved. The customer support for the further study on the real products is suggested.

The increasing use of electronic components in today&rsquo / s automobiles demands more powerful in-vehicle network communication protocols. FlexRay protocol, which is expected be the de-facto standard in the near future, is a deterministic, fault tolerant and fast protocol designed for in vehicle communication. In the near future, safety critical X-by-Wire applications will be available in the automobiles and FlexRay networks can be used to provide communication for the Electronic Control Units (ECUs) that perform related functions of X-by-Wire applications. In this thesis the performance of the FlexRay networks with various communication scenarios is evaluated in a real time environment and the results are presented. Communication scenarios investigate both static and dynamic segment of the FlexRay and allow evaluating the capabilities of the protocol. Several performance metrics such as utilization, static slot allocation, jitter are defined for the evaluation of the results.

No description available.

No description available.

Wire Bonder and Molding are the most costive equipments in the investment of IC packaging; and the packaging quality, cost and delivery are concerned most in the assembly processes. An inappropriate process scheduling may result in the wastes of resources and assembly bottleneck. Manager must allocate the resources appropriately to adapt the changeable products and production lines. We would introduce several heuristic search methods, especially the Tabu search. Tabu search is one of the most popular methods of heuristic search. We also use Tabu list to record several latest moves and avoid to the duplication of the paths or loops. It starts from an initial solution and keep moving the solution to the best neighborhood without stock by Tabu. The iterations would be repeated until the terminating condition is reached. At last of the report, an example will be designed to approach the best wire bonding and molding scheduling by Tabu search; and verify the output volume is more than those with FIFO in the same period of production time. Tabu search will be then confirmed to be effective for flexible flow shop.

Wire mesh vibration dampers have been the subject of some very encouraging experiments at the Texas A&M Turbomachinery laboratories for the past several years and have emerged as an excellent replacement for squeeze film dampers. Their capability to provide damping for a wide range of temperatures (even cryogenic), fluid free operation and ability to perform even when soaked with lubricants makes them a suitable option as a bearing damper. Experiments were conducted to investigate the effect of design parameters like axial thickness and axial compression that influence the characteristics of wire mesh as a bearing damper. Two groups of wire mesh were tested to show that the stiffness and damping are directly proportional to the axial thickness, if all the other parameters are kept constant. Tests on four wire mesh donuts of different radial thickness showed that stiffness and damping vary inversely with radial thickness. Rigorous tests were also conducted to quantify the effects of axial compression, radial interference and displacement amplitude on stiffness and damping of the wire mesh. Another novel kind of mesh damper tested was comprised of two small segments instead of a whole donut. The results showed that wire mesh exhibited good damping characteristics even when used in small segments. Empirical expressions were developed using MathCADTM worksheets, and an existing ExcelTM design worksheet was modified to include these factors. The effect of frequency variation was also included to give a comprehensive design tool for wire mesh. A new design worksheet was developed that can predict rotordynamic coefficients for a wire mesh bearing damper having a different size as well as different installation and operational conditions.

Optics has the inherent advantages of parallelism and wide bandwidths in processing information. However, the need to interface with electronics creates a bottleneck that eliminates many of these advantages. The proposed research explores novel optical devices and techniques to overcome some of these bottlenecks. To address parallelism issues we take a specific example of a content-addressable memory that can recognize images. Image recognition is an important task that in principle can be done rapidly using the natural parallelism of optics. However in practice, when presented with incomplete or erroneous information, image recognition often fails to give the correct answer. To address this problem we examine a scheme based on free-space interconnects implemented with diffractive optics. For bandwidth issues, we study possible ways to eliminate the electronic conversion bottleneck by exploring all-optical buffer memories and all-optical processing elements. For buffer memories we examine the specific example of slow light delay lines. Although this is currently a popular research topic, there are fundamental issues of the delay-time-bandwidth product that must be solved before slow light delay lines can find practical applications. For all-optical processing we examine the feasibility of constructing circuit elements that operate directly at optical frequencies to perform simple processing tasks. Here we concentrate on the simplest element, a sub-wavelength optical wire, along with a grating coupler to interface with conventional optical elements such as lenses and fibers. Even such a simple element as a wire has numerous potential applications. In conclusion, information processing by all-optical devices are demonstrated with an associative memory using diffractive optics, an all-optical delay line using room temperature slow light in photorefractive crystals, and a subwavelength optical circuit by surface plasmon effects.

This dissertation aims to evaluate the package effects on the performance of radio frequency integrated circuits (RFICs) for wireless applications. A model-based study is presented to compare the effects between flip-chip and wire-bond packages on a front-end cascode low-noise amplifier (LNA) in a 2.45 GHz CMOS wireless local area network (WLAN) receiver. To construct the package electrical models, specific modeling dies are designed to help extract the equivalent-circuit elements from measured S-parameters for chip-package interconnects. Furthermore, the ground-proximity effect on on-chip spiral inductors in a flip-chip package is first observed and presented in this modeling study. Excellent agreement between modeling and measurement is obtained by up to 20 GHz for a 64-pin flip-chip ball grid array (FC-BGA) package and a 64-pin wire-bond quad flat nonlead (WB-QFN) package. For practical applications, the established package models are used to predict the degradation of the figure of merit for the cascode LNA under packaged condition. Chip-package co-simulations can achieve good agreement with measurements, and thus can persuasively account for the complete effects caused by the two different packages on the cascode LNA. To simultaneously consider the package and board interconnect effects on RFICs, this dissertation also designs and implements a 1.95 GHz upconverter for the wideband code-division multiple-access (W-CDMA) transmitter. Specific ground wire-bonding and board connection are designed to minimize the linearity degradation due to package and board interconnects. Nonlinear analysis technique is also used to evaluate the nonlinear distortion of the upconverter in the chip-package-board co-design phase. The final measurement results have successfully verified the co-design predictions and simulations for this upconverter.

Der Kontakt Fahrdraht - Schleifleiste hat die Aufgabe, elektrischen Strom zwischen der Oberleitung und dem Stromabnehmer des Triebfahrzeuges mittels eines Gleitkontaktes zu übertragen. Das Kontaktverhalten und der dabei entstehende Verschleiß sind von einer Vielzahl von Parametern und Einflussfaktoren sowie deren Verknüpfungen abhängig. Der Verschleiß lässt sich in elektrischen und mechanischen Verschleiß unterteilen. Die vorliegende Arbeit beschreibt erstmals zusammenhängend und umfassend das Kontakt- und Verschleißverhalten von Fahrdraht und Schleifleiste. Daraus geht hervor, dass der Kontaktwiderstand eine herausragende Bedeutung für den elektrischen Verschleiß besitzt. Zur Berechnung des Kontaktwiderstandes existieren für einen stationären Kontakt mehrere Modelle, die jedoch auf einer Vielzahl von Annahmen und Vereinfachungen beruhen. Die Messung des Kontaktwiderstandes zwischen dem Fahrdraht und der Schleifleiste ist somit zwingend erforderlich. Dafür wurde an der TU Dresden ein Versuchsstand errichtet, mit dem der Kontaktwiderstand unter möglichst realen Bedingungen gemessen werden kann. Untersucht wurde die Kontaktpaarung Kupferfahrdraht und Kohlenstoffschleifleiste. Die durchgeführten Messungen des Kontaktwiderstandes und der Temperaturen von Fahrdraht und Schleifleiste im Stillstand und bei Fahrt werden beschrieben und ausgewertet. Dabei zeigt sich, dass die Kontaktkraft und der Kontaktstrom den größten Einfluss auf den Kontaktwiderstand besitzen. Der Kontaktwiderstand bzw. die Kontaktspannung bilden die Grundlage zur Berechnung der Erwärmung des Kontaktbereiches. Es wird ein Verfahren vorgestellt, mit welchem die maximalen Temperaturen in Fahrdraht und Schleifleiste ermittelt werden können. Die auf diese Weise ermittelten Temperaturen erlauben tendenzielle Aussagen zum elektrischen Verschleiß.