Novel fabrication technologies for high performance electrical and optical chip-to-substrate input/output (I/O) interconnections were developed. This research is driven by the long term performance and integration requirements of high performance chip-to-substrate I/Os, as well as the package reliability demands from semiconductor manufacturing. An electroless copper plating and annealing process was developed to join copper structures to achieve chip-to-substrate assembly by all copper pillar interconnects. The developed copper pillar interconnects provide much higher current carrying capability for chip-to-substrate power/ground input/output distributions and have low electrical parasitic characteristics for high frequency electrical signal communications. This copper bonding process also demonstrates the capability to compensate for misalignments and height variations of bonded structures. A finite element generalized plane deformation model was employed to design fully compliant copper pillars to eliminate the need of underfill. Electrical parasitics of copper pillar chip-to-substrate interconnects were studied by the derived formulas for low parasitic requirements. An optimized dimension space for all the criteria was provided on the pillar dimension chart. A novel nanoimprint lithography was developed to combine with photolithography in one process to create high quality features on a macrostructure for chip-to-substrate optical I/O applications. This fabrication process also demonstrated the capability to produce off-angle complex structures.

Current microfabrication materials include silicon, a wide variety of metals, dielectrics, and some polymers. Because of the low cost and high processing flexibility that polymers generally have, expanding the use of polymers in microfabrication would benefit the microfabrication community, enabling new routes towards goals such as low-cost 3D microfabrication. This work describes two main unconventional uses of polymers in microfabrication. The first unconventional use is as a carrier material in the self-assembly (SA) of millimeter-scale parts in which functional electronic components and electrical interconnects were cast into 5 mm cubes of Polymethylmethacrylate (PMMA). The second unconventional use is as a non-flat micromold for an alumina ceramic and as transfer material for multiple layers of micropatterned carbon nanotubes (CNTs). Both of these uses demonstrate 3D low-cost microfabrication routes. In the SA chapter, surface forces induced both gross and fine alignment of the PMMA cubes. The cubes were bonded using low-melting temperature solder, resulting in a self-assembled 3D circuit of LEDs and capacitors. The PMMA-encasulated parts were immersed in methyl methacrylate (MMA) to dissolve the PMMA, showing the possibility of using MEMS devices with moving parts such as mechanical actuators or resonators. This technique could be expanded for assembly of systems having more than 104 components. The ultimate goal is to combine a large number of diverse active components to allow the manufacture of systems having dense integrated functionality. The ceramic micromolding chapter explores micromolding fabrication of alumina ceramic microstructures on flat and curved surfaces, transfer of carbon nanotube (CNT) micropatterns into the ceramic, and oxidation inhibition of these CNTs through ceramic encapsulation. Microstructured master mold templates were fabricated from etched silicon, embossed thermally sacrificial polymer, and flexible polydimethylsiloxane (PDMS). The polymer templates were themselves made from silicon masters. Thus, once the master is produced, no further access to a microfabrication facility is required. Using the flexible PDMS molds, ceramic structures with mm-scale curvature were fabricated having microstructures on either the inside or outside of the curved macrostructure. It was possible to embed CNTs into the ceramic microstructures. To do this, micropatterned CNTs on silicon were transferred to ceramic via vacuum molding. Multilayered micropatterned CNT-ceramic devices were fabricated, and CNT electrical traces were encapsulated with ceramic to inhibit oxidation. During oxidation trials, encapsulated CNT traces showed an increase in resistance that was 62% less than those that were not encapsulated.

In this thesis we synthesize discotic liquid crystal materials. After demonstrating the molecular structures by 1H-NMR of Acid-6, we measure the properties of this material. We use discotic liquid crystal Acid-6 and measure its¡¦ properties. It shows the properties of Acid-6 which is having the ability of absorbing visible light. By UV-Vis spectrum, we can realize the absorption band is located at 400 nm and confirm that it is able to be a photo-sensitized dye. Besides, the property of discotic liquid crystal is the self-assembly ability, the molecular can assemble into hexagonal columnar structure by themselves, which enable discotic liquid crystal to have better mobility. The DSSCs have good power conversion efficiency with using discotic liquid crystals Acid-6. We can measure its¡¦ mobility to know the component with which the most appropriate.

A series of immiscible crystalline-crystalline diblock copolymers, poly(ethylene oxide)-b-(£`-caprolactone) (PEO-b-PCL), were blended with (3-phenyl-3,4-dihydro-2H-1,3-benzoxazin-6-yl) methanol (Pa-OH). FT-IR analyses provide that the ether group of PEO is a stronger hydrogen bond acceptor than the carbonyl group of PCL with the hydroxyl group of Pa-OH. Pa-OH after curing results in the excluded and confined PCL phase based on differential scanning calorimeter (DSC) analyses. In addition, the mesoporous structure was proved with the increasing the ratio of PCL to PEO in block copolymers by small angle X-ray scattering (SAXS), transmission electron microscopy (TEM) analyses and N2 adsorption-desorption isotherms (BET) The poly(styrene-b-4-vinyl pyridine) diblock copolymer was blended with Pa-OH monomer. FT-IR analyses demonstrate the intermolecular hydrogen bonding interaction between the pyridine group of P4VP and the hydroxyl group of Pa-OH. After curing, the block copolymers were incorporated into polybenzoxazine resin to access the nanostructure through the reaction induced microphase separation mechanism by TEM and SAXS analyses.

The fabrication of one-dimensional (1-D) polymeric photonic crystals from the self-assembly of ultra-high-Mw polystyrene-b-polyisoprene (PS-PI) block copolymers (BCPs) were conducted in this study. Well-ordered microphase-separated lamellar structures can be observed in the ultra-high-Mw PS-PI BCPs in the bulk by transmission electron microscopy (TEM) and ultra-small angle X-ray scattering (USAXS). To fabricate large-area and well-oriented lamellar microstructures with parallel orientation to the substrate, substrate-induced microstructural orientation with the accompanying solvent annealing method (i.e., solvent-induced orientation) was carried out in the PS-PI film. By grazing-incidence ultra-small angle X-ray scattering (GIUSAXS), scanning probe microscope (SPM) and cross-sectional TEM morphological observation, identification of the microstructural orientation in the PS-PI film can be achieved. A disordered wormlike morphology is observed in the as-spun PS-PI thin film from toluene on the PS-grafting substrate and on neat glass or wafer. This is attributed to the fast solidification of the disordered microstructure due to fast evaporation rate of the toluene solvent. After solvent annealing by the PS-selective or PI-selective solvents such as divinylbenzene (DVB) (neutral but highly PS-selective), benzene (PS-selective) and cyclohexane (PI-selective), parallel lamellar microstructures can be obtained in the PS-PI films on the PS-grafting substrate. By contrast, the coexistence of parallel and perpendicular lamellar microstructures is obtained in the PS-PI film from toluene after solvent annealing by neutral toluene on the PS-grafting substrate or by PS-selective benzene on the neat glass or wafer. This indicates that the formation of the parallel lamellar microstructures is mainly determined by both solvent-induced and substrate-induced orientation. In contrast to the as-spun disordered morphology from toluene, well-ordered parallel lamellar microstructures with few defects was found in the as-spun PS-PI film from DVB on the PS-grafting substrate, whereas parallel lamellar microstructures with many defects was observed in the as-spun PS-PI film from DVB on the neat glass or wafer. This further demonstrates that the PS-grafting substrate indeed plays an important role on the fabrication of well-ordered parallel lamellar microstructures. Interestingly, once the initial morphology of the PS-PI BCP reaches a relative stable state (i.e., parallel lamellar microstructures versus disordered wormlike morphology), it is hardly to trigger the microstructural reorientation by the subsequent solvent annealing. We suggest that the stable initial morphology in the PS-PI film may create high energy barrier for microstructural reorientation. With the controllable microstructural orientation, a PS-PI thick film having large-area and well-oriented parallel lamellar microstructures can be successfully carried out. Therefore, 1-D polymeric photonic crystals from the self-assembly of the lamella-forming PS-PI BCPs can be achieved. The in-situ UV reflectance spectra show that the reflective band shifts from ultraviolet wavelength to visible wavelength was observed in the lamella-forming PS-PI thick film with elapse of time by solvent annealing. Notably, the band gap can be recovered to the initial state once the solvent is removed, indicating the reversible process. As the results, the solvatochromic BCP photonic crystals can be successfully carried out by the manipulation of the solvent swelling in the large-area and well-oriented lamella-forming PS-PI BCP film.

Conductive thin films of poly(3,4-ethylenedioxythiophene)-polystyrenesulfonate (PEDOT-PSS) were created via layer-by-layer assembly. The PEDOT-PSS was used in an aqueous solution as an anionic polyelectrolyte, with both linear and branched polyethylenimine (PEI) and poly(allylamine hydrochloride) (PAH) in the positive aqueous solution. The electrical conductivity was varied by altering pH, concentration, polyelectrolyte, and doping the PEDOT with dimethylsulfoxide (DMSO). The most conductive 12BL samples were doped with 1wt% DMSO and have a sheet resistance of approximately 8kΩ/□. Despite exhibiting good initial conductivity, these PEDOT based thin films degrade under ultraviolet (UV) exposure. UV absorbing nanoparticles were added into the cationic solution in an effort to reduce UV sensitivity. The final bilayers of the films contained either colloidal titanium dioxide (TiO2) or carbon black (CB) and the films were exposed to a 365nm UV-light with an intensity of 2.16mW/cm2 for 9 days. The UV light at this intensity correlates to approximately four years of sunlight. The initial sheet resistances for all samples were similar, but the UV-degradation was reduced by a factor of 5 by utilizing TiO2 and CB in the final bilayers. In addition to being the most conductive after UV exposure, the TiO2 containing film was also 27% more optically transparent than the pure PEDOT films. These additional UV-absorbing nanoparticles extend the operational life of the PEDOT films and, in the case of TiO2, do so without any reduced transparency.

Optimization methods have been developed and refined throughout many scientific fields of study. This work utilizes one such developed technique of optimization called simulated annealing to produce optimal operation parameters for a 15x15 fuel assembly to be used in an operating nuclear power reactor. The two main cases of optimization are: one that finds the optimal 235U enrichment layout of the fuel pins in the assembly and another that finds both the optimal 235U enrichments where gadolinium burnable absorber pins are also inserted. Both of these optimizations can be performed by coupling Adaptive Simulated Annealing to TransLAT which successfully searches the optimization space for a fuel assembly layout that produces the minimized pin power peaking factor. Within given time constraints this package produces optimal layouts within a given set of assumptions and constraints. Each layout is forced to maintain the fuel assembly average 235U enrichment as a constraint. Reductions in peaking factors that are produced through this method are on the order of 2% to 3% when compared to the baseline results. As with any simulated annealing approach, families of optimal layouts are produced that can be used at the engineer’s discretion.

Layer-by-layer (LbL) assembly based on ionic interactions has proven to be a versatile route for surface modification and construction of ultrathin nanocomposites. Covalent LbL assembly based on facile ‘click’ covalent bond formation is an effective alternative, especially for the applications where a more robust ultrathin films or nanocomposites is desired. The subject of this dissertation focuses on the design of three different covalent LbL assemblies and their applications on conductive thin films, superhydrophobic surfaces, and solute responsive surfaces, respectively. Surface modification of PE substrates using covalent LbL assembly with PEI and Gantrez is a successful route to prepare a surface graft. The procedure is relative easy, fast and reproducible. Grafting multiple layers of PEI/Gantrez to the PE powder surface provided excellent coverage and promoted stable LbL film growth and excellent adhesion. This carbon black (CB) coated powder was compression molded into films, and their conductivity was measured, which revealed a percolation threshold below 0.01 wt % CB for the PEI-grafted system. Electrical conductivity of 0.2 S/cm was achieved with only 6 wt % CB, which is exceptional for a CB-filled PE film. Direct amination of MWNTs with PEI is a convenient and simple method leading to highly functionalized product that contains 6-8 % by weight PEI. Superhydrophobic PE films can be formed either from ionic LbL self-assembly of MWNT-NH-PEIs and poly(acrylic acid) or from covalent LbL self-assembly of MWNTNH- PEIs and Gantrez when the final graft is acrylated with octadecanoic acid. While the ionically assembled nanocomposite graft is labile under acid, the covalently assembled graft is more chemically robust. Responsive surfaces with significant, reversible, reproducible wettability changes can be prepared by covalent LbL grafting using PNIPAM-c-PNASI and aminated silica nanoparticles. A 65º ΔΘ value was observed with water vs. 1.4 M Na2SO4. The prepared film shows a high surface roughness of ~300 nm, which contributes to the large solute responsive ΔΘ values. The surfaces are reconfigurable in different solute conditions and that the changes in water contact angle are likely due to combination of change in surface roughness along with swell and intercalation of the solute ions into the PNIPAM surface.

The article reports the lattice pattern self-assemble formation of polystyrene thin films. According to a simple observing device which using dark-field microscope, we collect a series of dynamitic image that air bubbles form a two-dimensionally or three-dimensionally ordered array in polymer film with Marangoni convection effect. In order to explain the array formation, we also provide two new models to discuss the phenomenon about 2D & 3D structure in this paper.

Both position and angular errors during the insertion process, which cannot be easily predicted because of indeterminate collision situations, may cause failure of the assembly. One of the frequently applied strategies is to use a passive remote center compliance. We break the insertion problem down in to two phases: chamfer-crossing, and inserting (after chamfer-crossing)phase. In this article, the relationship between the position and angular errors during chamfer-crossing with different chamfer size and locality are thoroughly analysis. We also try to design a technological processes of minimizing the angular errors during chamfer-crossing. Besides single round peg insertion, two dimensional dual peg-in-hole insertion problems are briefly analysis.