Cylindrical shells are widely used in civil engineering. Examples include cooling towers, pipelines, nuclear containment vessels, steel silos and tanks for storage of bulk solids and liquids, and pressure vessels. The loading condition for these shells is quite varied depending on the function of the shell. Axial compression, global bending, external or internal pressure and wind loading are some of the most common loading forms for realistic structures. The failure of these cylindrical shell structures is often controlled by elastic or elastic-plastic buckling failure. Yield failure may occur in thick cylinders in some situations. A cylindrical shell under different loading conditions may display quite different buckling behaviour. The objective of this thesis is to investigate the characteristics of different buckling behaviours of cylindrical shell structures under axial compression, global bending, uniform external pressure and wind pressure. Some challenging practical problems in the design of these shell structures are explored. This thesis is expected to have some far-reaching impacts in defining how to design cylindrical shell structures to give them adequate strength to resist extreme events. Many aspects will be based on the latest Eurocode (EN 1993-1-6, 2007) and Recommendations (ECCS EDR5, 2008). The results show both some strength and some weaknesses in the Eurocode in design of shell structures. New methods are proposed for some practical problems. Some new conclusions and suggestions are derived and are expected to provide some useful knowledge for the improvement of the Eurocode in cylindrical shell design in general.

An Analytical Strip Method (ASM) for the analysis of stiffened and non-stiffened antisymmetric laminated composite plates is derived by considering the bending-extension coupling effect for bending, free vibration and buckling. A system of three equations of equilibrium, governing the general response of arbitrarily laminated composite plates, is reduced to a single eighth order partial differential equation in terms of a displacement function. The displacement function is solved in a single series form to determine the displacement, fundamental frequency, and buckling load of antisymmetric cross-ply and angle-ply laminated composite plates. The solution is applicable to rectangular plates with two opposite edges simply supported, while the other edges are simply supported, clamped, free, beam supported, or any combinations of these boundary conditions. This method overcomes the limitations of other analytical methods (Navier’s and Lévy’s), and provides an alternative to numerical, semi-numerical, and approximate methods of analysis. Numerical examples of bending, free vibration, and buckling of antisymmetric laminated composite plates are presented in tabular and graphical form. Whenever possible, the results of the present study are compared with those published in the literature and/or ANSYS solutions. The comparison firmly establishes that this method could be used for the analysis of antisymmetric laminated composite plates. Future research needs are identified for the aspects that have not been reached by the present study and others.

The considerable progress in the research and development of thin-walled beam structures responds to their growing use in engineering construction and to their increased need for efficiency in strength and cost. The result is a structure that exhibits large shear strains and important non uniform warping under different loadings, such as non uniform torsion, shear bending and distortion... A unified approach is formulated in this thesis for 3D thin walled beam structures with arbitrary profile geometries, loading cases and boundary conditions. A single warping function, defined by a linear combination of longitudinal displacements at cross sectional nodes (derived from Prokic work), is enhanced and adapted in order to qualitatively and quantitatively reflect and capture the nature of a widest possible range of behaviors. Constraints are prescribed at the kinematics level in order to enable the study of arbitrary cross sections for general loading. This approach, differing from most published theories, has the advantage of enabling the study of arbitrary cross sections (closed/opened or mixed) without any restrictions or distinctions related to the geometry of the profile. It generates automatic data and characteristic computations from a kinematical discretization prescribed by the profile geometry. The amount of shear bending, torsional and distortional warping and the magnitude of the shear correction factor is computed for arbitrary profile geometries with this single formulation. The proposed formulation is compared to existing theories with respect to the main assumptions and restrictions. The variation of the location of the torsional center, distortional centers and distortional rotational ratio of a profile is discussed in terms of their dependency on the loading cases and on the boundary conditions. A 3D beam finite element model is developed and validated with several numerical applications. The displacements, rotations, amount of warping, normal and shear stresses are compared with reference solutions for general loading cases involving stretching, bending, torsion and/or distortion. Some examples concern the case of beam assemblies with different shaped profiles where the connection type determines the nature of the warping transmission. Other analyses –for which the straightness assumption of Timoshenko theory is relaxed– investigate shear deformation effects on the deflection of short and thin beams by varying the aspect ratio of the beam. Further applications identify the cross sectional distortion and highlight the importance of the distortion on the stresses when compared to bending and torsion even in simple loading cases. Finally, a non linear finite element based on the updated lagrangian formulation is developed by including torsional warping degrees of freedom. An incremental iterative method using the arc length and the Newton-Raphson methods is used to solve the non linear problem. Examples are given to study the flexural, torsional, flexural torsional and lateral torsional buckling problems for which a coupling between the variables describing the flexural and the torsional degrees of freedom occurs. The finite element results are compared to analytical solutions based on different warping functions and commonly used in linear stability for elastic structures having insufficient lateral or torsional stiffnesses that cause an out of plane buckling.

Electrospinning is a method of producing nano structured material from a polymer solution or melt using high strength electric fields. It is a process that has yet to find extensive industrial application yet shows promise if obstacles such as low rate of production overcome perhaps by more complete theoretical modelling. This work examines the effects of adding an ionic salt to a solution of poly(vinyl alcohol) in water. The direct effect was an increase the charge density and electric current. It was found that an increase in charge density decreases the mass deposition rate and forms a thinner initial jet. When the sign of the charge on the polymer solution was changed from positive to negative the charge density increased and the initial jet diameter and mass deposition rate also decreased. It was proposed that a smaller radius of curvature is formed by the Taylor cone at higher charge densities resulting in a smaller “virtual orifice”. The extent of the bending instability was explored and it was found that adding ionic salt results in a decrease in the bending instability resulting in thicker fibres. Changing the sign of the charge on the polymer solution from positive to negative resulted in an increase in the bending instability and resulted in thinner fibres. The charge transfer mechanisms used in different electrospinning models are explored and some assumptions not explicitly stated are discussed. From this discussion a generalized equation describing the charge transport mechanisms is proposed.

Šiame darbe yra nagrinėjamos kukurūzų burbuolių ir grūdų fizikinės-mechaninės savybės, jų svarba iškūlimui, valymui bei tolesniam perdirbimui. Literatūros apžvalgoje atlikta kukurūzų burbuolių ir grūdų fizikinių-mechaninių savybių bei grūdo atsistatymo koeficiento mokslinių tyrimų analizė. Eksperimentiniais tyrimais nustatytas kukurūzų grūdų atsistatymo koeficientas. Tirtas kukurūzų burbuolių atsparumas lenkimui, gniuždymui ir radialiniam spaudimui. Atlikti grūdo atskyrimo jėgos nustatymo spaudžiant juos eilutėje specialiu antgaliu tyrimai. Nustatytas vieno grūdo atskyrimo jėgos dydis priklausomai nuo spaudžiamų grūdų eilutėje skaičiaus. Švytuokline daužykle atlikti kuliamos kukurūzo burbuolės, imituojant judėjimą pobūgnio paviršiumi, bandymai. Nustatyta spragilo smūgio impulso dydžio įtaka grūdų atskyrimui nuo šerdies. Taip pat nustatyta spragilo smūgio į burbuolę trukmė ir burbuolės sąlyčio su spragilu trukmės priklausomybė nuo spragilo greičio smūgio metu. Darbą apibendrina 9 išvados, jo pabaigoje pateiktas informacijos šaltinių sąrašas. / Physical-mechanical properties of corn cobs and grain and their influence for the thrashing, cleaning and conversion in this work are discussed. The review of the sciential researches of physical-mechanical properties of corn cobs and grain is done, also the researches of the set-factor of corn grain is reviewed. The results of the researches of the set-factor of corn grain is represented, the resistance for bending, vertical and horizontal compression are done. Researches of corn grain detaching from cob compressing few grains in the line are done and the results are presented. The experiment of the corn cob movement through the gap between the concave and the raspbar in the pendulum striker is made, the continuance of the impact impulse of the raspbar is determinated, also the influence of the strike impulse for the grain detaching from the corn cob is presented. It is also presented the results of the research of the continuance of contact between the corn cob and raspbar depending on the raspbar velocity before the impact. 8 conclusions summarize this work and, finally, the list of references is presented.

This dissertation details the study of band bending in n- and p-type GaN samples with a Kelvin probe utilizing different illumination geometries, ambients (air, oxygen, vacuum 10-6 mbar), and sample temperatures (77 – 650 K). The Kelvin probe, which is mounted inside an optical cryostat, is used to measure the surface potential. Illumination of the GaN surface with band-to-band light generates electron-hole pairs, which quickly separate in the depletion region due to a strong electric field caused by the near-surface band bending. The charge that is swept to the surface reduces the band bending and generates a surface photovoltage (SPV). Information about the band bending can be obtained by fitting the SPV measurements with a thermionic model based on the emission of charge carriers from bulk to surface and vice versa. The band bending in freestanding n-type GaN templates has been evaluated. The Ga-polar and N-polar surfaces exhibit upward band bending of about 0.74 and 0.57 eV, respectively. The surface treatment also plays a major role in the SPV behavior, where the SPV for mechanical polished surfaces restores faster than predicted by a thermionic model in dark. When measuring the photoluminescence (PL) signal, the PL from mechanically polished surfaces was about 4 orders of magnitude smaller than the PL from chemically mechanically polished surfaces. The PL and SPV behaviors were explained by the presence of a large density of defects near the surface, which quench PL and aid in the restoration of the SPV via electron hopping between defects. Temperature-dependent SPV studies have also been performed on doped n- and p-type GaN samples. In Si-doped n-type GaN, the estimated upward band bending was about 1 eV at temperatures between 295 and 500 K. However, in p-type GaN, the downward band bending appeared to increase with increasing temperature, where the magnitude of band bending increased from 0.8 eV to 2.1 eV as the temperature increased from 295 to 650 K. It appears that heating the p-type GaN samples allows for band bending values larger than 1 eV to fully restore. Pre-heating of samples was of paramount importance to measure the correct value of band bending in p-type GaN. The slope of the dependence of the SPV on excitation intensity at low temperatures was larger than expected; however, once the temperature exceeded 500 K, the slope began to reach values that are in agreement with a thermionic model.

The development of gallium nitride (GaN) light emitting devices has reached extraordinary echelons. As such, the characterization and analysis of the behavior of GaN materials is essential to the advancement of GaN technology. In this thesis, the effect of temperature on the optical and electrical properties of p-type GaN is investigated. The GaN samples used in this work were grown by various methods and studied by Kelvin probe and photoluminescence (PL) techniques. Specifically, the surface photovoltage (SPV) behavior and PL data were analyzed at different temperatures and illumination intensities. Using the SPV results, we show that p-type GaN exhibits n-type conductivity at low temperatures (80 K). If the sample is heated beyond a characteristic temperature, TC, the conductivity reverts to p-type. This temperature of conversion can be tuned by varying the illumination intensity. We explain this conductivity conversion using a simple, one-acceptor phenomenological model. Temperature-dependent PL measurements taken on Mg-doped p-type GaN layers show abrupt and tunable thermal quenching of the PL intensity. This effect is explained by a more complex model but with the same assertions, that the system must undergo a change in conductivity at low temperatures and under UV illumination. It is necessary to understand the observed behaviors, since the implications of such could have an effect on the performance of devices containing p-type GaN materials.

There is an understanding of surface photovoltage (SPV) behavior for GaN, yet little is known about the SPV behavior for AlGaN. In this work, a Kelvin probe was used to measure the SPV for p-type AlGaN. Very slow SPV transients were found in AlGaN, which could not be explained with a simple thermionic model. A possible explanation of this behavior is the segregation of impurities to the surface, which causes significant reduction of the depletion region width (down to 2 nm), with carrier tunneling and hopping becoming the dominant mechanisms responsible for the SPV transients. To verify this assumption, the near-surface defective region (about 40 nm) has been removed through the ICP-RIE process. After the etching, the SPV transients became fast and increased in magnitude by about 0.6 eV. By using the thermionic model, band bending was estimated to be -1 eV.

Steady-state and transient surface photovoltages in undoped GaN are studied in various environments (air, nitrogen, oxygen, vacuum) at room temperature and 400 K with a Kelvin probe attached to an optical cryostat. The results are explained within a phenomenological model accounting for the accumulation of photo-generated holes at the surface, capture of free electrons from the bulk over the near-surface potential barrier, and emission of electrons from surface states into the bulk. Mechanisms of surface photovoltage are discussed in detail. Photoadsorption and photodesorption of negatively charged species will either increase or decrease the surface potential and thus band bending. Oxygen is the assumed species responsible for the SPV changes in air ambient during continuous UV illumination. This variation in SPV will be confirmed with photoluminescence measurements.

Sn-based solder alloys are extensively used in electronic devices to form interconnects between different components to provide mechanical support and electrical path. The formation of a reliable solder interconnects fundamentally relies on the metallurgic reaction between the molten solder and solid pad metallization in reflowing. The resultant IMC layer at the solder/pad metallization interface can grow continuously during service or aging at an elevated temperature, uplifting the proportion of IMCs in the entire solder joint. However, the essential mechanical properties of interfacial IMC (i.e. Cu6Sn5, Cu3Sn) layers, such as Young s modulus and hardness, are drastically different in comparison with Sn-based solder and substrate. Therefore, the increasing fraction of interfacial IMCs in the solder joint can lead to significant deformation incompatibility under exterior load, which becomes an important reliability concern in the uses of solder joints for electronic interconnects. In the past decades, extensive research works were implemented and reported regarding the growth of interfacial IMC layers and its effect on the mechanical integrity of solder joints. But, the following fundamental issues in terms of mechanical and microstructural evolution in the uses of solder joints still remain unclear, demanding further research to elaborate: (1) The protrusion of IMCs: Though the growth of interfacial IMC layers along the diffusion direction in solder joints were studied extensively, the growth of IMCs perpendicular to the diffusion direction were reported in only a few papers without any further detailed investigation. This phenomena can crucially govern the long-term reliability of solder interconnects, in particular, in the applications that require a robust microstructural integrity from a solder joint. (2) Fracture behaviour of interfacial IMC layers: The fracture behaviour of interfacial IMC layers is a vital factor in determining the failure mechanism of solder joints, but this was scarcely investigated due to numerous challenges to enable a potential in-situ micro-scale tests. It is therefore highly imperative to carry out such study in order to reveal the fracture behaviour of interfacial IMC layers which can eventually provide better understanding of the influence of interfacial IMC layers on the mechanical integrity of solder joints. (3) Volume shrinkage: The volume shrinkage (or solder joint collapse) induced by the growth of interfacial IMC layers was frequently ascribed as one of the main causes of the degradation of mechanical reliability during aging due to the potentially resulted voids and residual stress at the solder/substrate interface. However, very few experimental works on the characterisation of such type of volume shrinkage can be found in literatures, primarily due to the difficulties of observing the small dimensional changes that can be encountered in the course of IMCs growth. (4) Residual stress: The residual stress within solder joints is another key factor that contributes to the failure of solder joints under external loads. However, the stress evolution in solder joints as aging progresses and the potential correlation between the residual stress and the growth of interfacial IMC layers is yet to be fully understood, as stress/strain status can fundamentally alter the course of total failure of a solder joint. (5) Crack initiation and propagation in solder joints: Modelling on the mechanical behaviour of solder joints is often undertaken primarily on the stress distribution within solder joints, for instance, under a given external loading. But there is lack of utilising numerical analysis to simulate the crack initiation and propagation within solder joints, thus the effect of interfacial IMC layers on the fracture behaviour of the solder joints can be elaborated in further details. In this thesis, the growth of interfacial IMCs in parallel and perpendicular to the interdiffusion direction in the Sn99Cu1/Cu solder joints after aging was investigated and followed by observation with SEM, with an intention of correlating the growth of IMCs along these two directions with aging durations based on the measured thickness of IMC layer and height of perpendicular IMCs. The mechanism of the protrusion of IMCs and the mutual effect between the growth of IMCs along these two directions was also discussed. The tensile fracture behaviour of interfacial Cu6Sn5 and Cu3Sn layers at the Sn99Cu1/Cu interface was characterised by implementing cantilever bending tests on micro Cu6Sn5 and Cu3Sn pillars prepared by focused ion beam (FIB). The fracture stress and strain were evaluated by finite element modelling using Abaqus. The tensile fracture mechanism of both Cu6Sn5 and Cu3Sn can then be proposed and discussed based on the observed fracture surface of the micro IMC pillars. The volume shrinkage of solder joints induced by the growth of interfacial IMC layers in parallel to the interdiffusion direction in solder joint was also studied by specifically designed specimens, to enable the collapse of the solder joint to be estimated by surface profiling with Zygo Newview after increased durations of aging. Finite element modelling was also carried out to understand the residual stress potentially induced due to the volume shrinkage. The volume shrinkage in solder joints is likely to be subjected to the constraint from both the attached solder and substrate, which can lead to the build-up of residual stress at the solder/Cu interface. Depth-controlled nanoindentation tests were therefore carried out in the Sn99Cu1 solder, interfacial Cu6Sn5 layer, Cu3Sn layer and Cu with Vickers indenter after aging. The residual stress was then evaluated in the correlation with aging durations, different interlayers and the locations in the solder joint. Finally, finite element models incorporated with factors that may contribute to the failure of solder joints, including microstructure of solder joints, residual stress and the fracture of interfacial IMC, were built using Abaqus to reveal the effect of these factors on the fracture behaviour of solder joints under applied load. The effect of growth of IMC layer during aging on the fracture behaviour was then discussed to provide a better understanding of the degradation of mechanical integrity of solder joints due to aging. The results from this thesis can facilitate the understanding of the influence of interfacial IMC layers on the mechanical behaviour of solder joints due to long-term exposure to high temperatures.