111 |
Advanced encapsulation processing for low cost electronics assemblyPascarella, Nathan William 12 1900 (has links)
No description available.
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112 |
Mechanical behavior characterization of some new materials for high density interconnect substratesRao, Yang 12 1900 (has links)
No description available.
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113 |
Enhanced thermal conductivity of liquid encapsulants for electronic packagingBollampally, Raja Sheker 12 1900 (has links)
No description available.
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114 |
Evaluation of low stress dielectrics for board applicationsBrownlee, Kellee Renee 12 1900 (has links)
No description available.
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115 |
Local convective heat transfer from heated flat plates using synthetic air jetsGillespie, Mark B. 08 1900 (has links)
No description available.
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116 |
Die stress analysis in plastic encapsulated electronic packages an experimental and numerical approach /Chaparala, Satish Chandra. January 2006 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2006. / Includes bibliographical references (leaves 121-136).
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117 |
CMOS stress sensor circuitsChen, Yonggang, Suhling, J. C. Jaeger, Richard C. January 2006 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references.
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118 |
Characterization of lead-free solders for electronic packagingMa, Hongtao, Johnson, R. Wayne, Suhling, J. C. January 2007 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references.
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119 |
Mechanical properties and microstructure invesitigation of SN-AG-CU lead free solder for electronic package applicationsWang, Qing, Johnson, R. Wayne, Gale, W. F. January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
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120 |
Processing of photosensitive PDMS for biosensingMurali, Vinodh. January 2007 (has links)
Thesis (M.S.)--University of Missouri-Columbia, 2007. / The entire dissertation/thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file (which also appears in the research.pdf); a non-technical general description, or public abstract, appears in the public.pdf file. Title from title screen of research.pdf file (viewed on April 14, 2008) Includes bibliographical references.
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