NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 111 to 120 of 210 (0.106 seconds)
111

Advanced encapsulation processing for low cost electronics assembly

Pascarella, Nathan William 12 1900 (has links)
No description available.
Electronic packaging
Multichip modules (Microelectronics)
Surface mounting (Electronics)
112

Mechanical behavior characterization of some new materials for high density interconnect substrates

Rao, Yang 12 1900 (has links)
No description available.
Electronic packaging
Electric connectors
Electronic contacts
Electronics Materials
113

Enhanced thermal conductivity of liquid encapsulants for electronic packaging

Bollampally, Raja Sheker 12 1900 (has links)
No description available.
Electronic packaging
Heat Conduction
114

Evaluation of low stress dielectrics for board applications

Brownlee, Kellee Renee 12 1900 (has links)
No description available.
Dielectrics
Polymer liquid crystals
115

Local convective heat transfer from heated flat plates using synthetic air jets

Gillespie, Mark B. 08 1900 (has links)
No description available.
Heat Convection
Electronic packaging Coding
Jets Fluid dynamics
116

Die stress analysis in plastic encapsulated electronic packages an experimental and numerical approach /

Chaparala, Satish Chandra. January 2006 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2006. / Includes bibliographical references (leaves 121-136).
117

CMOS stress sensor circuits

Chen, Yonggang, Suhling, J. C. Jaeger, Richard C. January 2006 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references.
118

Characterization of lead-free solders for electronic packaging

Ma, Hongtao, Johnson, R. Wayne, Suhling, J. C. January 2007 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references.
119

Mechanical properties and microstructure invesitigation of SN-AG-CU lead free solder for electronic package applications

Wang, Qing, Johnson, R. Wayne, Gale, W. F. January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
120

Processing of photosensitive PDMS for biosensing

Murali, Vinodh. January 2007 (has links)
Thesis (M.S.)--University of Missouri-Columbia, 2007. / The entire dissertation/thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file (which also appears in the research.pdf); a non-technical general description, or public abstract, appears in the public.pdf file. Title from title screen of research.pdf file (viewed on April 14, 2008) Includes bibliographical references.

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