Global ETD Search

71	Analysis-enhanced electronic assembly Scholand, Andrew Joseph 12 1900 (has links) No description available. Electronic packaging Process control Decision support systems
72	Local-and system-level thermal management of a single level integrated module (SLIM) using synthetic jet actuators Russell, Griffith B. 08 1900 (has links) No description available. Heat Transmission Electronic packaging Cooling Air flow
73	Superhydrophobic surfaces for electronic packaging and energy applications Liu, Yan 27 August 2014 (has links) Superhydrophobic surfaces, which display water contact angles of larger than 150°, have attracted more and more attention due to their importance in both fundamental research and practical applications. This dissertation is mainly focused on the fundamental understanding and exploring applications of superhydrophobic surfaces. First, some specific examples of superhydrophobic surface fabrication were given, which include superoleophobic Si surface, robust superhydrophobic SiC surface, and reversible wettability nanocomposite films. Based on the study of superhydrophobic surfaces, the application of superhydrophobic surfaces in electronic packaging were explored. Superhydrophobic silica/epoxy nanocomposite coating serves as an encapsulant to improve the electronic device reliability. Such superhydrophobic coating showed good stability under humidity at elevated temperatures and was applied on the triple track resistors test coupons. In addition, the applications of superhydrophobic surfaces in solar cells were studied. Two multi-functional hierarchical structure solar cells with self-cleaning, low reflection and high efficiency properties were built up by coating or etching methods. Superhydrophobic surfaces Electronic packaging Solar cells
74	Experimental characterization of the temperature dependence of the piezoresistive coefficients of silicon Cho, Chun Hyung, Jaeger, Richard C. Suhling, J. C. January 2007 (has links) (PDF) Dissertation (Ph.D.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references (p.222-231).
75	Development of a knowledge model for the computer-aided design for reliability of electronic packaging systems Kim, Injoong. January 2007 (has links) Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Co-Chair: Peak, Russell; Committee Co-Chair: Sitaraman, Suresh; Committee Member: Paredis, Christiaan; Committee Member: Pucha, Raghuram; Committee Member: Wong, C.
76	Carbon nanotube thermal interface material and its application in high brightness LED packages / Zhang, Kai. January 2008 (has links) Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2008. / Includes bibliographical references. Also available in electronic version.
77	Characterization of die stresses in large area array flip chip packages Roberts, Jordan Christopher, Jaeger, Richard C., Suhling, J. C. January 2008 (has links) (PDF) Thesis (M.S.)--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (p. 134-144).
78	Experimental and numerical study of solder ball joints' reliability at package level & board level / Xu, Zhengjian. January 2009 (has links) Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2009. / Includes bibliographical references (leaves 99-110).
79	Design of electrically and thermally conductive polymer composites for electronic packaging / Kim, Woo-Jin, January 1998 (has links) Thesis (Ph. D.)--University of Washington, 1998. / Vita. Includes bibliographical references (leaves [148]-161 ).
80	Overmolded substrate on aluminum metal backing for harsh environment applications Ridenour, Joshua David, Evans, John L., January 2008 (has links) (PDF) Thesis (M.S.)--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (p. 107-109).

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