NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 61 to 70 of 210 (0.063 seconds)
61

Control of run-by-run processes with applications to large-area material deposition

Krauss, Alan 12 1900 (has links)
No description available.
Electronic packaging
Manufacturing processes
Production engineering
62

Multiwire microstrip interconnects for high-frequency integrated circuit packaging

Cafaro, Nicholas Giovanni, Jr. 05 1900 (has links)
No description available.
Wire bonding (Electronic packaging)
Microwave circuits
63

System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques

Liu, Sheng 05 1900 (has links)
No description available.
Electronic packaging
Solder and soldering
Lasers in engineering
64

Fundamentals of solder interconnect wetting

Kang, Suk Chae 05 1900 (has links)
No description available.
Solder and soldering
Wettings
65

An automated system for measuring PWB/PWBA warpage during simulation of the infrared reflow and wave soldering processes, and during operational thermal cycling

Stiteler, Michael Ross 05 1900 (has links)
No description available.
Printed circuits
Electronic circuits
Electronic packaging
66

Observation and modeling of heterogeneous microstructural evolution in Sn-Pb solder

Woodmansee, Michael W. 08 1900 (has links)
No description available.
Solder and soldering
67

An integrated process modeling methodology and module for sequential multilayered high-density substrate fabrication for microelectronic packages

Dunne, Rajiv Carl 12 1900 (has links)
No description available.
Electronic packaging Design
68

Characterization of temperature variation during the wire bonding process

Suman, Shivesh K. 08 1900 (has links)
No description available.
69

Asymmetric thermal cycles : a different approach to accelerated reliability assessment of microelectronic packages

Classe, Francis Christopher 08 1900 (has links)
No description available.
Chip scale packaging Reliability
Electronic packaging Reliability
70

Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill

Park, Ji Eun 08 1900 (has links)
No description available.
Electronic packaging
Integrated circuits Fault tolerance

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