NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 101 to 110 of 210 (0.098 seconds)
101

A selective encapsulation solution for packaging an optical micro electro mechanical system

Bowman, Amy Catherine. January 2002 (has links)
Thesis (M.S.)--Worcester Polytechnic Institute. / Keywords: packaging; micro electro mechanical systems; MEMS; electronics; die warpage; die bow; encapsulant; encapsulate; electrochemical migration; corrosion; wirebonds. Includes bibliographical references (p. 94-99).
102

Thermoreversible gelation of aromatic hydrocarbons

Goldmann, Edward Louis 09 June 2011 (has links)
Not available / text
Aromatic compounds
Polymers--Synthesis
103

Compliant Wafer Level Package (CWLP)

Patel, Chirag Suryakant 05 1900 (has links)
No description available.
Electronic packaging
Semiconductor wafers
104

Modeling of package and board power distribution networks using transmission matrix and macro-modeling methods

Kim, Joong-Ho 12 1900 (has links)
No description available.
Electronic packaging
Electric power distribution
Microelectronic packaging
Electric networks
105

Modeling and simulation of planes in electronic packages

Na, Nanju 05 1900 (has links)
No description available.
Electronic packaging
Switching circuits
Electronic circuits
Electronic noise
106

Accurate, high speed predictive modeling of passive devices

Poddar, Ravi 05 1900 (has links)
No description available.
Electronic circuits
Electronic packaging
107

Predictive statistical analysis of embedded meander resistors via measurement of canonical building blocks

Carastro, Lawrence A. 05 1900 (has links)
No description available.
Electronic packaging
Integrated circuits Passivation
Analog-to-digital converters
108

Fundamentals of area array solder interconnect yield

Kim, Chunho 12 1900 (has links)
No description available.
Solder and soldering
Electronic packaging Materials
109

Flip chip on flex for low cost electronics assembly

Venton, Jennifer Lynne 12 1900 (has links)
No description available.
Electronic packaging
Multichip modules (Microelectronics)
110

Fixturing analysis and synthesis for flexible circuit board assembly

Chen, Ruijun 05 1900 (has links)
No description available.
Evaporation

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