NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 1 to 7 of 7 (0.152 seconds)
1

Evaluation of nondestructive x-ray techniques for electronic packaging materials

Dollar, Laura Lucio 08 1900 (has links)
No description available.
Electronic packaging
Electronic packaging Materials
2

Study of thermally reworkable epoxy materials and thermal conductivity enhancement using carbon fiber for electronics packaging

Li, Haiying 01 December 2003 (has links)
No description available.
Electronic packaging Materials
Epoxy resins
Electric conductivity
3

Thermal deformation of electronic packages and packaging effect on reliability for copper/low-k interconnect structures

Wang, Guotao 28 August 2008 (has links)
Not available / text
Electronic packaging--Materials
Copper
Semiconductors--Junctions
4

Thermoreversible gelation of aromatic hydrocarbons

Goldmann, Edward Louis 09 June 2011 (has links)
Not available / text
Aromatic compounds
Polymers--Synthesis
5

Fundamentals of area array solder interconnect yield

Kim, Chunho 12 1900 (has links)
No description available.
Solder and soldering
Electronic packaging Materials
6

High throughput flip chip assembly process and reliability analysis using no-flow underfill materials

Thorpe, Ryan 05 1900 (has links)
No description available.
Electronic packaging Materials
Electronic packaging Reliability
Surface mount technology
7

ADDITIVE MANUFACTURING BASED DISSOLVABLE CHIP PACKAGING

Dhiya eddine Belkadi (19200505) 26 July 2024 (has links)
<p dir="ltr">Electronics have contributed to the advancement of healthcare, wellness, security, and mobility, resulting in a higher standard of living. However, these ever-accelerating advancements and widespread application come at the cost of a shortened product life cycle and increase in produced E-waste which poses a significant environmental challenge. Recycling E-waste is challenging due to the complexity of electronics and packaging, hindering component retrieval for reuse. While sustainable materials for electronics have been researched, sustainable integrated circuit (IC) packaging for conventional electronics remains unexplored. This study introduces a method involving dissolvable additively manufactured packaging materials to recover commercial-off-the-shelf (COTS) chips from used electronics, which would alleviate supply-chain stress, reduce the need for manufacturing similar chips, and minimize environmental impact. In this work, Polyvinyl alcohol (PVA) and Acrylonitrile butadiene styrene (ABS), are explored as potential dissolvable semiconductor packaging materials. Optimal dissolving conditions allow chip recovery in less than 11 minutes for PVA and 2 minutes for ABS. This approach offers a sustainable packaging method for commercial electronic chips that matches conventional packaging performance with the added functionality of recoverable and recyclable components, contributing to the gap in sustainability and recycling for conventional electronics.</p>
Microelectronics
Polymers and plastics
Additive manufacturing (3D printing), Ti
electronic packaging materials
Electronic packaging.

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