This letter investigates the impact of self-heating on the post-cycling functionality of a scaled hafnium oxide-based ferroelectric field-effect transistor (FeFET). The full recovery of FeFET switching properties and data retention after the cycling endurance failure is reported. This is achieved by damage annealing through localized heating, which is intentionally induced by a large current flow through the drain (source)-body p-n junctions. The results highlight that the local thermal treatments could be exploited to extend the cycling endurance of FeFETs.

Inspired by neurobiological systems, Spiking Neural Networks (SNNs) are gaining an increasing interest in the field of bio-inspired machine learning. Neurons, as central processing and short-term memory units of biological neural systems, are thus at the forefront of cutting-edge research approaches. The realization of CMOS circuits replicating neuronal features, namely the integration of action potentials and firing according to the all-or-nothing law, imposes various challenges like large area and power consumption. The non-volatile storage of polarization states and accumulative switching behavior of nanoscale HfO₂ - based Ferroelectric Field-Effect Transistors (FeFETs), promise to circumvent these issues. In this paper, we propose two FeFET-based neuronal circuits emulating the Integrate-and-Fire (I&F) behavior of biological neurons on the basis of SPICE simulations. Additionally, modulating the depolarization of the FeFETs enables the replication of a biology-based concept known as membrane leakage. The presented capacitor-free implementation is crucial for the development of neuromorphic systems that allow more complex features at a given area and power constraint.

The electric-field-driven and reversible polarization switching in ferroelectric materials provides a promising approach for nonvolatile information storage. With the advent of ferroelectricity in hafnium oxide, it has become possible to fabricate ultrathin ferroelectric films suitable for nanoscale electronic devices. Among them, ferroelectric field-effect transistors (FeFETs) emerge as attractive memory elements. While the binary switching between the two logic states, accomplished through a single voltage pulse, is mainly being investigated in FeFETs, additional and unusual switching mechanisms remain largely unexplored. In this work, we report the natural property of ferroelectric hafnium oxide, embedded within a nanoscale FeFET, to accumulate electrical excitation, followed by a sudden and complete switching. The accumulation is attributed to the progressive polarization reversal through localized ferroelectric nucleation. The electrical experiments reveal a strong field and time dependence of the phenomenon. These results not only offer novel insights that could prove critical for memory applications but also might inspire to exploit FeFETs for unconventional computing.

Hafnium oxide (HfO₂)-based ferroelectric field-effect transistor (FeFET) is an attractive device for nonvolatile memory. However, when compared to the well-established flash devices, the memory window (MW) of FeFETs reported so far is rather limited, which might be an obstacle to practical applications. In this article, we report on FeFETs fabricated in the 28-nm high-𝑘 metal gate (HKMG) bulk technology with 90 and 80 nm for the channel length and width, respectively, which show a large MW of nearly 3 V. This is achieved by adopting 20-nm-thick HfO₂ films in the gate stack instead of the usually employed 10-nm-thick films. We show that such a thickness increase leads to only a moderate increase of the switching voltages, and to a significantly improved resilience of the memory characteristics upon the parasitic charge trapping. The devices display a good retention at high temperatures and endure more than 10⁵ bipolar cycles, thus supporting this technology for a future generation of FeFET memories.

Ferroelectric field effect transistor (FeFET) memories based on a new type of ferroelectric material (silicon doped hafnium oxide) were studied within the scope of the present work. Utilisation of silicon doped hafnium oxide (Si:HfO2) thin films instead of conventional perovskite ferroelectrics as a functional layer in FeFETs provides compatibility to the CMOS process as well as improved device scalability. The influence of different process parameters on the properties of Si:HfO2 thin films was analysed in order to gain better insight into the occurrence of ferroelectricity in this system. A subsequent examination of the potential of this material as well as its possible limitations with the respect to the application in non-volatile memories followed. The Si:HfO2-based ferroelectric transistors that were fully integrated into the state-of-the-art high-k metal gate CMOS technology were studied in this work for the first time. The memory performance of these devices scaled down to 28 nm gate length was investigated. Special attention was paid to the charge trapping phenomenon shown to significantly affect the device behaviour.

Ferroelectric field effect transistor (FeFET) memories based on a new type of ferroelectric material (silicon doped hafnium oxide) were studied within the scope of the present work. Utilisation of silicon doped hafnium oxide (Si:HfO2) thin films instead of conventional perovskite ferroelectrics as a functional layer in FeFETs provides compatibility to the CMOS process as well as improved device scalability. The influence of different process parameters on the properties of Si:HfO2 thin films was analysed in order to gain better insight into the occurrence of ferroelectricity in this system. A subsequent examination of the potential of this material as well as its possible limitations with the respect to the application in non-volatile memories followed. The Si:HfO2-based ferroelectric transistors that were fully integrated into the state-of-the-art high-k metal gate CMOS technology were studied in this work for the first time. The memory performance of these devices scaled down to 28 nm gate length was investigated. Special attention was paid to the charge trapping phenomenon shown to significantly affect the device behaviour.:1 Introduction 2 Fundamentals 2.1 Non-volatile semiconductor memories 2.2 Emerging memory concepts 2.3 Ferroelectric memories 3 Characterisation methods 3.1 Memory characterisation tests 3.2 Ferroelectric memory specific characterisation tests 3.3 Trapping characterisation methods 3.4 Microstructural analyses 4 Sample description 4.1 Metal-insulator-metal capacitors 4.2 Ferroelectric field effect transistors 5 Stabilisation of the ferroelectric properties in Si:HfO2 thin films 5.1 Impact of the silicon doping 5.2 Impact of the post-metallisation anneal 5.3 Impact of the film thickness 5.4 Summary 6 Electrical properties of the ferroelectric Si:HfO2 thin films 6.1 Field cycling effect 6.2 Switching kinetics 6.3 Fatigue behaviour 6.4 Summary 7 Ferroelectric field effect transistors based on Si:HfO2 films 7.1 Effect of the silicon doping 7.2 Program and erase operation 7.3 Retention behaviour 7.4 Endurance properties 7.5 Impact of scaling on the device performance 7.6 Summary 8 Trapping effects in Si:HfO2-based FeFETs 8.1 Trapping kinetics of the bulk Si:HfO2 traps 8.2 Detrapping kinetics of the bulk Si:HfO2 traps 8.3 Impact of trapping on the FeFET performance 8.4 Modified approach for erase operation 8.5 Summary 9 Summary and Outlook