Carbon nanotubes (CNTs) are known for their exceptional electrical, thermal, mechanical, optical, and chemical properties. With the significant progress in recent years on synthesis, purification and integration challenges, CNT network/array based thin-film transistors (TFTs) are likely to play a critical role as the building blocks of future electronics. CNT-TFTs can find applications in flexible, transparent and energy-efficient circuits, e-displays, solar cells, RFID tags, e-paper, touch screens, implantable medical devices and chemical/bio/optical sensors. CNTs in CNT-TFTs are deposited on low thermal conductivity substrates which can impede the heat dissipation resulting in high temperature. The excessive self-heating in CNT-TFTs can degrade the electrical and thermal performance and could potentially lead to failure of the devices. Therefore, the issues related to operational reliability of CNT-TFTs arising from the self-heating effects need to be examined and studied. In the present work, a computational approach is developed and employed to study the electrical and thermal transport in CNT-TFTs. The modeling framework can predict the current and temperature profile of CNT network/array and the supporting structure. The model is validated against the experimental results. In case of CNT network TFTs, the computational method allows us to examine the role of various device parameters such as network morphology (i.e., network density, CNT junction topology, and CNT length and alignment distribution) and channel geometry (i.e., channel length and width) on heat dissipation and thermal reliability. The simulation results help interpret experimental data and provide the quantitative information about the thermal boundary conductances at CNT junctions and CNT-substrate interfaces in CNT-TFTs. The findings suggest that the structure of CNT junctions on substrate can become very critical in CNT network TFTs as the lack of contact with the substrate at these junctions can lead to junction temperatures hundreds of degrees higher than the rest of the device, which will severely deteriorate the performance of these devices. High-field breakdown study of CNT network TFTs is also conducted which provides guidelines for the design and optimization with respect to aforementioned parameters in order to enhance the performance and reliability. Dense CNT arrays are preferred for better electrical performance in CNT array TFTs, but they also experience electrostatic and thermal cross-talk which can adversely affect the device performance. These effects have been studied in details. The role of trap charges in CNT array TFTs is also investigated to understand and mitigate hysteresis. Lastly, CNT-liquid crystal composites are studied using dissipative particle dynamics (DPD) technique with the aim to understand how the CNT concentration in composite affects the alignment of liquid crystals and to explore the method of CNT alignment using liquid crystals.

Introduction One of the products made by SAAB Avionics Systems in Jönköping was in need of a better cooling solution. The product, a Head-Up Display, holds a LED that was overheating when run at desired input power. The purpose of this thesis was to identify the design weaknesses in the current solution regarding heat dissipation and produce new design proposals that fulfill the requirements. The parts analyzed consist of a LED light source, adjustment plates and a heat sink. The adjustment plates and heat sink where covered in a surface treatment. Theoretical framework A simulation of a finite element model was set up of the current solution in order to identify the influence of the different parts and their thermal properties. The simulation was set up as a steady state thermal model. The FEM and steady state equations used during this are mentioned and shortly explained. The state of modern research was found in order to find new innovative ways of solving the heat problem. Method In order to understand the current solution, experimentswere carried out. Interviews were used in order to get the correct information easily. A literature study was preformed to understand the different theories. Reverse engineering was applied to get a detailed understanding of the functionality both mechanically and thermally. Brainstorming was used to generate new solutions, which was followed by a feasibility evaluation and Pugh’s method to sort out the best concepts. Implementation and Result Based on the simulations it can be concluded that some of the developed solutions pass the requirements and can be implemented right away. Some need some more work in order to fully pass the demands. Conclusions The thermal flow was greatly affected by the properties of the aluminum in the adjustment plates and heat sink, though there was not much room for thickness reduction. However, the oxide layer and the surface roughness also had a great impact on the high junction temperature. The requirements where therefore met when adjustment plates and interfaces were removed, to lower the amount of oxide and air between the LED and the heat sink. But the oxide layers needed to be thinner and the surface roughness needed to be reduced in order to meet requirements. If the oxide layers need to stay at current thickness or the surface roughness cannot be changed, the heat sink needs to be redesigned. The recommended concepts were smaller than the current solution. If this space is utilized with a bigger heat sink, the goals can be met with greater ease. There is also room for improvement when it comes to heat sink heat spreader pattern. Discussion The discussion covers what knowledge which was needed to write this thesis and how different problems that occurred along its path were solved. Sustainability in different ways was also discussed.

In the age of Knowledge-based Economy, knowledge will become the main motive power of economic growth. Patent, as one of the indicators of intellectual properties, is suitable for measuring the competition potential, technology capabilities, and innovation performance of corporations. In the model of mass production and fast manufacturing, the price of goods decrease acutely and getting the Taiwanese corporations into the low margin age. How to make the most of intellectual properties and patents to increase the additional value is the key to success. Taiwanese companies had starting to apply for patents in many countries, but the licensing fee and litigation are still in high level. That express that the qualities and quantities of the patents are still not enough to cover the technologies and products of Taiwanese companies. This study takes computer heat dissipation industry for example, and using the patent analysis, Logistic curve, and patent strategy matrix to discuss the patent application and patent strategy. The research result shows that the computer heat dissipation industry is in the mature stage, the degree of patent is crowded, and the rate of change is slow. Most of the Taiwanese companies are small scale and not good at inventing in the most advanced technologies. Especially in this mature industry, this study suggest Taiwanese corporations should take licensing, avoiding existing patents, and improvement development as basic patent strategies. Not to apply lots of patents in small scope to suit each other, but should establish patent alliance or co-development, even join or make the industry standard to earn competition advantages.

abstract: Gallium Nitride (GaN) based microelectronics technology is a fast growing and most exciting semiconductor technology in the fields of high power and high frequency electronics. Excellent electrical properties of GaN such as high carrier concentration and high carrier motility makes GaN based high electron mobility transistors (HEMTs) a preferred choice for RF applications. However, a very high temperature in the active region of the GaN HEMT leads to a significant degradation of the device performance by effecting carrier mobility and concentration. Thus, thermal management in GaN HEMT in an effective manner is key to this technology to reach its full potential. In this thesis, an electro-thermal model of an AlGaN/GaN HEMT on a SiC substrate is simulated using Silvaco (Atlas) TCAD tools. Output characteristics, current density and heat flow at the GaN-SiC interface are key areas of analysis in this work. The electrical characteristics show a sharp drop in drain currents for higher drain voltages. Temperature profile across the device is observed. At the interface of GaN-SiC, there is a sharp drop in temperature indicating a thermal resistance at this interface. Adding to the existing heat in the device, this difference heat is reflected back into the device, further increasing the temperatures in the active region. Structural changes such as GaN micropits, were introduced at the GaN-SiC interface along the length of the device, to make the heat flow smooth rather than discontinuous. With changing dimensions of these micropits, various combinations were tried to reduce the temperature and enhance the device performance. These GaN micropits gave effective results by reducing heat in active region, by spreading out the heat on to the sides of the device rather than just concentrating right below the hot spot. It also helped by allowing a smooth flow of heat at the GaN-SiC interface. There was an increased peak current density in the active region of the device contributing to improved electrical characteristics. In the end, importance of thermal management in these high temperature devices is discussed along with future prospects and a conclusion of this thesis. / Dissertation/Thesis / Masters Thesis Electrical Engineering 2016

The continuing requirement for computational processing power, multi-functional devices and component miniaturization have emphasised the need for thermal management systems able to maintain the temperature at safe operating condition. The thermal management industry is constantly seeking for new cutting edge, efficient, cost effective heat transfer enhancement technologies. The aim of this study is to utilize the electron beam treatment for the improvement of the heat transfer area in liquid cooled plates and experimentally evaluate the performance. Considering the complexity of the technology, this thesis focuses on the design and production of electron beam enhanced test samples, construction of the test facility, testing procedure and evaluation of thermal and hydraulic characteristics. In particular, the current research presented in this thesis contains a number of challenging and cutting edge technological developments that include: (1) an overview of the semiconductor industry, cooling requirements, the market of thermal management systems, (2) an integral literature review of pin-fin enhancement technology, (3) design and fabrication of the electron beam enhanced test samples, (4) upgrade and construction of the experimental test rig and the development of the test procedure, (5) reduction of the experimental data and analysis to evaluate thermal and hydraulic performance. The experimental results show that the capability of the electron beam treatment to improve the thermal efficiency of current untreated liquid cooled plates is approximately three times. The highest heat transfer rate was observed for the sample S3; this is attributed to the irregularities of the enhanced structure, which improves the heat transfer area, mixing, and disturbs the thermal and velocity boundary layers. Enhancement of heat transfer for all three samples was characterised by an increase of pressure drop. The electron beam enhancement technique is a rapid process with zero material waste and cost effective. It allows thermal management systems to be produced smaller and faster, reduce material usage, without compromising safety, labour cost or the environment.

O presente trabalho apresenta a análise térmica do fenômeno de fermentação de cerveja com o objetivo de quantificar a energia liberada durante o processo e avaliar o comportamento do campo de temperaturas do fermentando. É adotada uma metodologia que reúne abordagens teóricas e experimentais, aplicadas a um processo completo de fermentação. O calor dissipado durante a fermentação é calculado por equações presentes na literatura, tendo como entrada a taxa de conversão de glicose e produção de CO2. Essas taxas são calculadas pelas concentrações de glicose medidas de amostras retiradas durante ensaios planejados. A dissipação é usada como entrada em dois modelos térmicos para o cálculo do campo de temperaturas do fermentando. As temperaturas calculadas são superiores àquelas monitoradas experimentalmente, com diferenças de até 78%. Esse comportamento embasa a proposta de uma equação de ajuste do calor liberado durante a fermentação. A equação proposta indica que é liberado 38 kJ por mol de glicose convertido, neste estudo a taxa de dissipação térmica atinge valor máximo de 11,41 Wm-3 e a energia total dissipada é de 385 kJ para produzir 40 litros de cerveja. O ajuste mostrou-se satisfatório, as temperaturas máximas e os campos de temperaturas calculados apresentaram valores equivalentes aos valores experimentais. / The present study carry out a thermal analysis of beer fermentation process which aims to quantify the energy released during the process and evaluate the temperature field, using a methodology that brings together theoretical and experimental approaches. The heat dissipated during the fermentation is calculated by equations reported in the literature, with the conversion rates of glucose and CO2 production as input. These rates are calculated using the glucose concentrations measured of samples taken during tests. The dissipation is used as input in two thermal models for the calculation of temperature field. The calculated temperatures are higher than those monitored experimentally, with differences up to 78%. It supports the proposal of an adjusted equation for heat release of beer fermentation. The proposed equation indicates that 38 kJ per mol of converted glucose is released. In this study, the thermal dissipation rate reaches a maximum value of 11.41 Wm-3 and the total energy dissipated is 385 kJ for producing 40 liters of beer. The adjustment is satisfactory, the maximum temperatures and the temperature fields calculated are equivalent to the experimental values.

Hot rolling process is heat input process. The heat energy in hot rolled steel coils can be utilized. At SSAB Strip Product Borlänge when the hot rolled steel coils came out of the hot rolling mill they are at the temperature range of 500°C to 800°C. Heat energy contained by the one hot rolled steel coil is about 1981Kwh whereas the total heat energy for the year 2008 is 230 GWh/year.The potential of heat is too much but the heat dissipation rate is too slow. Different factors on which heat dissipation rate depends are discussed.Three suggestions are proposed to collect the waste heat from hot rolled steel coils.The 2nd proposal in which water basin is suggested would help not only to collect the waste heat but to decrease in the cooling time.

It is the objective of this work to focus on heat dissipation in gallium nitride based solid-state logic devices as well as optoelectronic devices, a major technical challenge. With a direct band gap that is tunable through alloying between 0.7-3.8 eV, this material provides an enabling technology for power generation, telecommunications, power electronics, and advanced lighting sources. Previously, advances in these areas were limited by the availability of high quality material and growth methods, resulting in high dislocation densities and impurities. Within the last 40 years improvements in epitaxial growth methods such as lateral epitaxial overgrowth (LEO), hydride vapor phase epitaxy (HVPE), molecular beam epitaxy (MBE), and metal organic chemical vapor deposition (MOCVD), has enabled electron mobilities greater than 1600 cm2V/s, with dislocation densities less than 109/cm2. Increases in device performance with improved materials have now been associated with an increase in power dissipation (>1kW/cm2) that is limiting further development. In the following work thermophysical material of III-V semiconducting thin films and associated substrates are presented. Numerical modeling coupled with optical (micro-IR imaging and micro-Raman Spectroscopy) methods was utilized in order to study the heat carrier motion and the temperature distribution in an operating device. Results from temperature mapping experiments led to an analysis for design of next generation advancements in electronics packaging.

O presente trabalho apresenta a análise térmica do fenômeno de fermentação de cerveja com o objetivo de quantificar a energia liberada durante o processo e avaliar o comportamento do campo de temperaturas do fermentando. É adotada uma metodologia que reúne abordagens teóricas e experimentais, aplicadas a um processo completo de fermentação. O calor dissipado durante a fermentação é calculado por equações presentes na literatura, tendo como entrada a taxa de conversão de glicose e produção de CO2. Essas taxas são calculadas pelas concentrações de glicose medidas de amostras retiradas durante ensaios planejados. A dissipação é usada como entrada em dois modelos térmicos para o cálculo do campo de temperaturas do fermentando. As temperaturas calculadas são superiores àquelas monitoradas experimentalmente, com diferenças de até 78%. Esse comportamento embasa a proposta de uma equação de ajuste do calor liberado durante a fermentação. A equação proposta indica que é liberado 38 kJ por mol de glicose convertido, neste estudo a taxa de dissipação térmica atinge valor máximo de 11,41 Wm-3 e a energia total dissipada é de 385 kJ para produzir 40 litros de cerveja. O ajuste mostrou-se satisfatório, as temperaturas máximas e os campos de temperaturas calculados apresentaram valores equivalentes aos valores experimentais. / The present study carry out a thermal analysis of beer fermentation process which aims to quantify the energy released during the process and evaluate the temperature field, using a methodology that brings together theoretical and experimental approaches. The heat dissipated during the fermentation is calculated by equations reported in the literature, with the conversion rates of glucose and CO2 production as input. These rates are calculated using the glucose concentrations measured of samples taken during tests. The dissipation is used as input in two thermal models for the calculation of temperature field. The calculated temperatures are higher than those monitored experimentally, with differences up to 78%. It supports the proposal of an adjusted equation for heat release of beer fermentation. The proposed equation indicates that 38 kJ per mol of converted glucose is released. In this study, the thermal dissipation rate reaches a maximum value of 11.41 Wm-3 and the total energy dissipated is 385 kJ for producing 40 liters of beer. The adjustment is satisfactory, the maximum temperatures and the temperature fields calculated are equivalent to the experimental values.

O presente trabalho apresenta a análise térmica do fenômeno de fermentação de cerveja com o objetivo de quantificar a energia liberada durante o processo e avaliar o comportamento do campo de temperaturas do fermentando. É adotada uma metodologia que reúne abordagens teóricas e experimentais, aplicadas a um processo completo de fermentação. O calor dissipado durante a fermentação é calculado por equações presentes na literatura, tendo como entrada a taxa de conversão de glicose e produção de CO2. Essas taxas são calculadas pelas concentrações de glicose medidas de amostras retiradas durante ensaios planejados. A dissipação é usada como entrada em dois modelos térmicos para o cálculo do campo de temperaturas do fermentando. As temperaturas calculadas são superiores àquelas monitoradas experimentalmente, com diferenças de até 78%. Esse comportamento embasa a proposta de uma equação de ajuste do calor liberado durante a fermentação. A equação proposta indica que é liberado 38 kJ por mol de glicose convertido, neste estudo a taxa de dissipação térmica atinge valor máximo de 11,41 Wm-3 e a energia total dissipada é de 385 kJ para produzir 40 litros de cerveja. O ajuste mostrou-se satisfatório, as temperaturas máximas e os campos de temperaturas calculados apresentaram valores equivalentes aos valores experimentais. / The present study carry out a thermal analysis of beer fermentation process which aims to quantify the energy released during the process and evaluate the temperature field, using a methodology that brings together theoretical and experimental approaches. The heat dissipated during the fermentation is calculated by equations reported in the literature, with the conversion rates of glucose and CO2 production as input. These rates are calculated using the glucose concentrations measured of samples taken during tests. The dissipation is used as input in two thermal models for the calculation of temperature field. The calculated temperatures are higher than those monitored experimentally, with differences up to 78%. It supports the proposal of an adjusted equation for heat release of beer fermentation. The proposed equation indicates that 38 kJ per mol of converted glucose is released. In this study, the thermal dissipation rate reaches a maximum value of 11.41 Wm-3 and the total energy dissipated is 385 kJ for producing 40 liters of beer. The adjustment is satisfactory, the maximum temperatures and the temperature fields calculated are equivalent to the experimental values.