In order to apply to S-Band (1-4.5 GHz) of wireless communication system, we designed and fabricated a high-insolating RF-MEMS switch by surface micromachining technology in this study. In terms of the micro switch, we performed the structural design, high frequency simulation, components process integration and high-frequency measurement in this study. Especially for making components be high-isolation, low-loss and low-driving voltage, we proposed the following three methods: (i) adjusting the space and width of the transmission lines to improve the RF performance; (ii) applying the stress imbalance, by using dual metal composite top electrode, to form a arched contact electrode and reduce the drive voltage efficiently; (iii) using non-isometric spring structure to stabilize the electrode movement of the components. Besides, we did the optimizing simulation for this study, which were supported by Ansoft-HFSS and ADS, in terms of the micro switch which has different structural design as mentioned above. The size of the optimized RF micro-switch which we developed for this study is only 145 £gm ¡Ñ 205 £gm. Switched from on-state to off-state, the component needs 36.5V drive voltage only. According to the result of the commercial network analyzer in 1-4.5GHz frequency range, the isolation rate of the components reaches -59.721dB while off-state; the insert los reaches -1.625dB while on-state.

Yes / This paper presents the results of a study on developing an effective technique to increase the performance characteristics of antenna arrays for sub-THz integrated circuit applications. This is essential to compensate the limited power available from sub-THz sources. Although conventional array structures can provide a solution to enhance the radiation-gain performance however in the case of small-sized array structures the radiation properties can be adversely affected by mutual coupling that exists between the radiating elements. It is demonstrated here the effectiveness of using SIW technology to suppress surface wave propagations and near field mutual coupling effects. Prototype of 2 × 3 antenna arrays were designed and constructed on a polyimide dielectric substrate with thickness of 125 μm for operation across 0.19-0.20 THz. The dimensions of the array were 20 × 13.5 × 0.125 mm3. Metallization of the antenna was coated with 500 nm layer of Graphene. With the proposed technique the isolation between the radiating elements was improved on average by 22.5 dB compared to a reference array antenna with no SIW isolation. The performance of the array was enhanced by transforming the patch to exhibit metamaterial characteristics. This was achieved by embedding the patch antennas in the array with sub-wavelength slots. Compared to the reference array the metamaterial inspired structure exhibits improvement in isolation, radiation gain and efficiency on average by 28 dB, 6.3 dBi, and 34%, respectively. These results show the viability of proposed approach in developing antenna arrays for application in sub-THz integrated circuits. / Ministerio de Ciencia, Innovación y Universidades, Gobierno de España (MCIU/AEI/FEDER, UE) under Grant RTI2018-095499-B-C31, in part by the Innovation Programme under Grant H2020-MSCA-ITN-2016 SECRET-722424, and in part by the U.K. Engineering and Physical Sciences Research Council (EPSRC) under Grant EP/E022936/1.

Yes / In this work, a new prototype of the eight-element MIMO antenna system for 5G communications, internet of things, and networks has been proposed. This system is based on an H-shaped monopole antenna system that offers 200 MHz bandwidth ranges between 3.4-3.6GHz, and the isolation between any two elements is well below -12dB without using any decoupling structure. The proposed system is designed on a commercially available 0.8mm-thick FR4 substrate. One side of the chassis is used to place the radiating elements, while the copper from the other side is being removed to avoid short-circuiting with other components and devices. This also enables space for other systems, sub-systems, and components. A prototype is fabricated and excellent agreement is observed between the experimental and the computed results. It was found that ECC is 0.2 for any two radiating elements which is consistent with the desirable standards, and channel capacity is 38 bps/Hz which is 2.9 times higher than 4x4 MIMO configuration. In addition, single hand mode and dual hand mode analysis are conducted to understand the operation of the system under such operations and to identify losses and/or changes in the key performance parameters. Based on the results, the proposed antenna system will find its applications in modern 5G handheld devices and internet of things with healthcare and high rate delivery. Besides that, its design simplicity will make it applicable for mass production to be used in industrial demands.

Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to switch, modulate, filter or tune electrical signals from DC to microwave frequencies. The micromachining techniques used to fabricate these components are based on the standard clean-room manufacturing processes for high-volume integrated semiconductor circuits. RF~MEMS switches are characterized by their high isolation, low insertion loss, large bandwidth and by their unparalleled signal linearity. They are relatively simple to control, are very small and have almost zero power consumption. Despite these benefits, RF~MEMS switches are not yet seen in commercial products because of reliability issues, limits in signal power handling and questions in packaging and integration. Also, the actuation voltages are typically too high for electronics applications and require additional drive circuitry. This thesis presents a novel MEMS switch concept based on an S-shaped film actuator, which consists of a thin and flexible membrane rolling between a top and a bottom electrode. The special design makes it possible to have high RF isolation due to the large contact distance in the off-state, while maintaining low operation voltages due to the zipper-like movement of the electrostatic dual-actuator. The switch comprises two separately fabricated parts which allows simple integration even with RF circuits incompatible with certain MEMS fabrication processes. The two parts are assembled by chip or wafer bonding which results in an encapsulated, ready-to-dice package. The thesis discusses the concept of the switch and reports on the successful fabrication and evaluation of prototype devices. Furthermore, this thesis presents research results in wafer-level packaging of (RF) MEMS devices by full-wafer bonding with an adhesive intermediate layer, which is structured before bonding to create defined cavities for housing MEMS devices. This technique has the advantage of simple, robust and low temperature fabrication, and is highly tolerant to surface non-uniformities and particles in the bonding interface. It allows cavities with a height of up to many tens of micrometers to be created directly in the bonding interface. In contrast to conventional wafer-level packaging methods with individual chip-capping, the encapsulation is done using a single wafer-bonding step. The thesis investigates the process parameters for patterned adhesive wafer bonding with benzocyclobutene, describes the fabrication of glass lid packages based on this technique, and introduces a method to create through-wafer electrical interconnections in glass substrates by a two-step etch technique, involving powder-blasting and chemical etching. Also, it discusses a technique of improving the hermetic properties of adhesive bonded structures by additional passivation layers. Finally, it presents a method to substantially improve the bond strength of patterned adhesive bonding by using the solid/liquid phase combination of a patterned polymer layer with a contact-printed thin adhesive film. / QC 20100617

RF switches are an essential building block in numerous applications, including tactical radar systems, satellite communications, global positioning systems (GPS), automotive radars, wireless communications, radio astronomy, radar transceivers, and various instrumentation systems. For many of these applications the circuits have to operate reliably under extreme operating conditions, including conditions outside the domain of commercial military specifications. The objective of this thesis is to present the design procedure, simulation, and measurement results for Radio Frequency (RF) switches in 130 nm Silicon Germanium (SiGe) BiCMOS process technology. The novelty of this work lies in the proposed new topology of an ultrahigh-isolation single-pole, single-throw (SPST) and a single pole, four-throw (SP4T) nMOS based switch for multiband microwave radar systems. The analysis of cryogenic temperature effects on these circuits and devices are discussed in this work. The results shows that several key-figures-of-merits of a switch, like insertion loss, isolation, and power handling capability (P1dB) improve at cryogenic temperatures. These results are important for several applications, including space-based extreme environment application where FET based circuits would need to operate reliably across a wide-range of temperature.

The ability to control the path a signal takes through microwave circuitry is crucial when designing RF systems. The component that allows for the control of the signal path is called a switch, and it is the microwave component that this thesis will focus on. Switches are widely used in the growing defense and space industries, both of which have strict requirements on their systems. This thesis aims to investigate four switch topologies and compare them to establish which topology is most suitable in high-performance systems where high isolation and wide bandwidths are essential parameters. The different topologies were simulated using Cadence AWR Microwave Studio to evaluate the parameters of interest. Built-in models for PIN diodes were employed to capture the nonlinear nature of the diodes and quantify the linearity of the switches. Measurements of PIN diodes using a spectrum analyzer and a vector network analyzer were used to confirm that the models of the PIN diode resembled the actual characteristics of PIN diodes. Out of the four topologies investigated, the series, shunt, series-shunt and double shunt, it was concluded that the series-shunt topology was most suitable for wideband multiple-throw switches. The double shunt topology was more suitable for SPST switches and narrowband SPDT switches. From this thesis, it will be possible to conclude which topology is most suitable for a particular need and what key design parameters will impact the switch’s performance. / Förmågan att styra vägen en signal tar genom mikrovågskretsar är en avgörande förmåga i konstruktionen av de flesta RF-system. Komponenten som tillåter styrning av signalvägen kallas en omkopplare och är den mikrovågskomponent som detta examensarbete kommer att fokusera på. RFomkopplare kan realiseras på många olika sätt och kan integreras i flera typer av vågledande strukturer såsom mikrostrips, striplines och vågledare. Omkopplingselementen kan realiseras på många sätt, med användning av transistorer och dioder är de mest etablerade sätten. Sådana omkopplare används i stor utsträckning inom försvars- och rymdindustrin som båda har strikta krav på dess komponenter. Avhandlingen syftar därför till att undersöka ett antal switchtopologier och jämföra dessa för att fastställa vilken topologi som är mest lämplig i högpresterande system där hög isolering och breda bandbredder är viktiga parametrar. De olika topologierna simulerades med hjälp av Cadence AWR Microwave Studio för att utvärdera parametrarna av intresse. Den inbyggda modellen för PIN-dioder användes också för att fånga diodernas olinjära natur för att kvantifiera omkopplarnas linjäritet. Mätningar av PIN-dioder med användning av en spektrumanalysator och en Nätverksanalysator gjordes för att bekräfta att modellerna av PIN-dioderna efterliknade PIN-diodernas faktiska beteende. Det fastslogs att series-shunt-topologin var mest lämpad för bredbandsomkopplare med flera utgångar. Dubbel-shunt-topologin var mer lämplig i SPSTomkopplare och i smalbandiga SPDT-omkopplare. Från detta examensarbete kommer det att vara möjligt att dra slutsatser kring vilken topologi som är mest lämplig för ett särskilt behov tillsammans med vilka designparametrar som kommer att påverka omkopplarens prestanda.