• Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 3386
  • 1330
  • 516
  • 299
  • 274
  • 183
  • 158
  • 158
  • 158
  • 158
  • 158
  • 157
  • 101
  • 82
  • 54
  • Tagged with
  • 7695
  • 1929
  • 1467
  • 889
  • 776
  • 770
  • 748
  • 655
  • 553
  • 543
  • 527
  • 505
  • 404
  • 393
  • 368
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
491

Mass spectroscopy of the etching of Si and SiO←2 in CF←4/O←2 plasmas and X-ray photoelectron spectroscopy of plasma deposited borophosphosilicate glasses

Thomas, David John January 1989 (has links)
No description available.
492

The design and application of an optical demultiplexer

Bainbridge, John David January 2000 (has links)
No description available.
493

Application of formal methods to digital system design

Herbert, J. M. J. January 1986 (has links)
No description available.
494

Integrated Pest Management: The Most Effective Way to Manage Pests in Your School!

Gouge, Dawn, Green, Tom, Lame, Marc, Shour, Mark, Hurley, Janet, Braband, Lynn, Glick, Sherry, Graham, Fudd, Murray, Kathy 09 1900 (has links)
4 pp. / Revised
495

The effect of die attach voiding on the thermal resistance of integrated circuit package

Chang, Li-hsin, 1946- January 1987 (has links)
The effect of die attach voiding on the thermal resistance of a hybrid integrated circuit package has been investigated. Voids with precisely controlled geometry, morphology, distribution, and different volume percentages are fabricated in the backside of the silicon chips by modern micro-photolithographic techniques. A large thin film resistor over the entire chip surface area served as a uniform heat generating source. A TO-3 steel package with beryllia substrate is used for chip packaging. Correlation of thermal resistance to power dissipation in the range studied is presented and discussed. The dependence of thermal resistance on void characteristics and total void area are demonstrated through infrared mapping of chip surface temperature; and the correlations are qualitatively analyzed. A brief discussion on die bond void reduction is also given.
496

A design study for gallium arsenide operational transconductance amplifiers

Barclay, Duncan McL. January 1996 (has links)
No description available.
497

Possible tritrophic consequences of high levels of host plant resistance (as in transgenic resistance) to aphids in Brassicaceae

Ganguly, Subhendu January 1999 (has links)
No description available.
498

Bigger and smaller pictures : identifying the factors influencing training effectiveness

Birdi, Kamaljit Singh January 2000 (has links)
No description available.
499

Analysis of approaches for evaluating the success of coastal management in Europe

Humphrey, Sarah January 2003 (has links)
The study draws on experience in coastal management globally, and in particular in Europe where the recent demonstration programme in integrated coastal zone management has promoted coastal management initiatives at the local scale, to examine the applicability of different coastal management evaluation techniques for assessing the role of coastal management as a tool for achieving sustainable development; and for determining the success of European pilot projects in coastal management; identify and assess factors which influence “successful” ICM in the European context; and determine whether international guidance relating to good practice in coastal management is relevant in the European context. An analysis of different approaches to evaluation showed that these are based on largely untested assumptions of validity - in particular of internal validity (causality) in the case of outcome based evaluation and of external validity (generalisability) in the case of process evaluations. In view of their early stage of development and differing goals but common institutional challenges, a process based evaluation is most appropriate for the demonstration project. In this study, a triangulation approach is used to test the assumption of external validity which underlies process based evaluations in ICM. Using independently derived results from the European demonstration projects, the study examines the applicability in the European context of international experience relating to good practice in co-ordination and in ensuring viability of ICM projects. The results are particularly relevant in the light of new European legislation which is designed to move coastal management in Europe from the current project-by-project approach to a more strategic approach by the promotion of a better enabling environment at national level.
500

Object-oriented information modelling for computer-aided control engineering

Varsamidis, Thomas January 1998 (has links)
No description available.

Page generated in 0.2751 seconds