Lasers find a wide range of applications in many areas including photo-biology, photo-chemistry, materials processing, imaging and telecommunications. However, the practical use of such sources is often limited by the bulky nature of existing systems. By fabricating channel waveguides in solid-state laser-gain materials more compact laser systems can be designed and fabricated, providing user-friendly sources. Other advantages inherent in the use of waveguide gain media include the maintenance of high intensities over extended interaction lengths, reducing laser thresholds. This thesis presents the development of Yb:tungstate lasers operating around 1μm in waveguide geometries. An Yb:KY(WO₄)₂ planar waveguide laser grown by liquid phase epitaxy is demonstrated with output powers up to 190 mW and 76 % slope efficiency. This is similar to the performance from bulk lasers but in a very compact design. Excellent thresholds of only 40 mW absorbed pump power are realised. The propagation loss is found to be less than 0.1 dBcm⁻¹ and Q-switched operation is also demonstrated. Channel waveguides are fabricated in Yb:KGd(WO₄)₂ and Yb:KY(WO₄)₂ using ultrafast laser inscription. Several of these waveguides lase in compact monolithic cavities. A maximum output power of 18.6 mW is observed, with a propagation loss of ~2 dBcm⁻¹. By using a variety of writing conditions the optimum writing pulse energy is identified. Micro-spectroscopy experiments are performed to enable a fuller understanding of the induced crystal modification. Observations include frequency shifts of Raman lines which are attributed to densification of WO₂W bonds in the crystal. Yb:tungstate lasers can generate ultrashort pulses and some preliminary work is done to investigate the use of quantum dot devices as saturable absorbers. These are shown to have reduced saturation fluence compared to quantum well devices, making them particularly suitable for future integration with Yb:tungstate waveguides for the creation of ultrafast, compact and high repetition rate lasers.

La thèse porte sur l’étude de la cinétique de Smart Cut™ dans du silicium après implantation hydrogène, pour des températures de recuit comprises entre 500°C et 1300°C. Ainsi, la cinétique de séparation de couches (splitting) est caractérisée en considérant des recuits dans un four à moufle ainsi que des recuits laser. Sur la base de cette caractérisation, un modèle physique, basé sur le comportement de l’hydrogène implanté durant le recuit, est proposé. Le modèle s’appuie sur des caractérisations SIMS de l’évolution de la concentration d’hydrogène durant le recuit, ainsi que sur des simulations numériques. Le modèle propose une explication aux propriétés des films obtenus en fonction des conditions de recuit et mesurées par microscopie optique, AFM ainsi que par des mesures des énergies d’interfaces. Sur la base du modèle de splitting obtenu, deux procédés de fabrication de films de silicium sont proposés pour l’élaboration de matériaux de silicium sur saphir et verre par recuit laser ainsi que pour l’élaboration de feuilles de silicium monocristallin par épitaxie en phase liquide sur substrat silicium implanté. L’étude de premier procédé prouve pour la première fois la possibilité d’appliquer le procédé Smart Cut™ sur des substrats de silicium implanté. Les films ainsi obtenus présentent des grandes surfaces de transfert (wafer de 200 mm), ce qui présente un grand intérêt industriel. L’étude propose différentes caractérisations des films obtenus (AFM, profilométrie optique, mesure 4 pointe). Le deuxième procédé est démontré en utilisant des bancs d’épitaxie en phase liquide de silicium (température supérieure à 1410°C) afin d’effectuer des dépôts sur des substrats de silicium implantés. Les films obtenus montrent un grand degré de croissance épitaxiale (jusqu’à 90% du film déposé mesuré par EBSD) et présentent une épaisseur aussi faible que 100 µm. D’autre part, le détachement par Smart Cut™ des films ainsi déposés est démontré. / At first, the thesis studies the kinetics of Smart Cut™ in silicon implanted with hydrogen ions for annealing temperature in the range 500°C-1300°C. The kinetics is characterized by using a specially-dedicated furnace and by considering laser annealing. Based on the related characterization and observations, a physical model is established based on the behavior of implanted hydrogen during annealing. The model is strengthened by SIMS characterization focused on the evolution of hydrogen during annealing and on numerical calculations. Additionally, the model proposes an explanation for the properties of the obtained films as a function of the annealing conditions, based on optical microscope and AFM observations and bonding energy characterization. Based on this splitting model, two innovative processes for fabrication of silicon films are proposed. The first process allows to produce films of silicon on sapphire and films of silicon on glass by considering a laser annealing. The second produces foils of monocrystalline silicon by liquid phase epitaxial growth on implanted silicon substrate. The study of the first process proves for the first time the possibility to apply the Smart Cut™ for substrates of implanted silicon. The resulting films present large surface of transferred films (up to 200 mm wafers), which is very interesting in an industrial perspective. The study proposes different characterization of the films obtained by this process (AFM, optical profilometry and 4 probe measurement). The second process is demonstrated by using a chamber of liquid phase epitaxial growth of silicon (deposition temperature superior to 1410°C) in order to deposit liquid silicon on implanted silicon substrates. The obtained films show a high degree of epitaxial growth (up to 90% of the film as characterized by EBSD) and show a thickness as low as 100µm. Additionally the detachment by Smart Cut of the deposited films is demonstrated.