La fonctionnalisation des surfaces permet d’en modifier leur comportement vis-à-vis des propriétés physico-chimiques de fluides. Nous avons restreint notre étude à la caractérisation par méthode acoustique des interfaces microstructurées silicium-fluide pour lesquelles une gravure physique d’un réseau de piliers de petites dimensions a été réalisée. Les propriétés de ces interfaces vis-à-vis des liquides dépendent de la géométrie des gravures, des propriétés du fluide et des conditions d’interaction du fluide avec la surface. Notre objectif a été de confronter des modèles de comportement en terme de mouillabilité de ces surfaces aux mesures des coefficients de réflexion des ondes ultrasonores. Une première étape du travail a consisté à modéliser le coefficient de réflexion d’une onde ultrasonore incidente sur une surface microtexturée en fonction de l’état du liquide sur la surface. Deux états physiques caractéristiques ont étés étudiés : l’état où le liquide reste au sommet des piliers (état Cassie) et celui où le liquide pénètre dans le réseau de piliers (état Wenzel). Deux modèles numériques ont été développés : le premier repose sur la modélisation par éléments finis utilisant COMSOL MULTIPHYSICS et le second modèle numérique utilise une méthode explicite aux différences finies.La technique expérimentale est fondée sur une méthode de mesure du coefficient de réflexion électrique d’un transducteur ultrasonore haute fréquence à l’aide d’un analyseur de réseau, qui permet après traitement d’en déduire le coefficient de réflexion à l’interface.Les résultats originaux obtenus démontrent qu’une onde acoustique de compression est sensible à l’état d’un liquide sur une surface microtexturée. / Surfaces functionalization can change the wetting properties of the surface depending on the physico-chemical properties of fluids. We restricted our study to the characterization by acoustic method of microstructured silicon-fluid interfaces for which a physical etching of a network of small pillars was achieved. The properties of these interfaces depend on the geometry of the etched microtextures, the fluid properties and the interaction between the fluid and the surface. Our objective was to compare modeling and measurements of reflection coefficients of ultrasonic waves at theses interfaces. A first stage of work was to model the reflection coefficient of an ultrasonic wave incident on a microtextured surface depending on the state of the liquid on the surface. Two specific physical states have been studied: The state where the liquid remains at the top of the pillars (Cassie state) and when the liquid penetrates in the network of pillars (Wenzel state). Two numerical models were developed: one basedon finite element modeling using COMSOL Multiphysics and the second numerical model uses an explicit finite difference method. The experimental technique is based on a method measuring the electrical reflection coefficient ofan ultrasonic transducer according to the frequency using a high frequency network analyzer. Signal processing allows deducing the reflection coefficient at the interface. The original results obtained demonstrate that an acoustic compression wave is sensitive to the state of a liquid on a surface microtextured.

L'intérêt et le développement des microsystèmes aujourd'hui sont basés sur les mêmes principes qui ont fait le succès des circuits intégrés. Comme dans la microéléctronique, le silicium est le matériau le plus utilisé parmi les microsystèmes. Malgré cette hégémonie, il existe d'autres alternatives pour les applications où le silicium n'est pas très performant. L'arséniure de gallium (AsGa) se montre prometteur car des effets comme la piézo­électricité, la piézo­resistivité et l'émission de rayonnement lumineux peuvent efficacement être exploités. <br />La fabrication des microstructures suspendues (mécaniques) compatibles avec des <br />technologies standards des circuits intégrés en AsGa est présentée dans cette thèse. Ces <br />microstructures sont obtenues à travers le micro­usinage en volume par la face avant et ne demandent <br />aucune modification du procédé si ce n'est une étape post­process de gravure destinée à libérer les <br />structures devant être suspendues. Ce principe permet la fabrication collective en grandes quantités et <br />à bas coût puisque s'insérant dans une filière industrielle stabilisée. <br />Dans ce travail, plusieurs solutions de gravure ont été étudiées et caractérisées. Les vitesses de <br />gravure et les éventuels dégâts dans les couches diélectriques et de métallisation des plots ont été <br />vérifiés. A partir de ces résultats, deux applications potentielles pour les microsystèmes en AsGa ont <br />été considérées : les composants thermiques qui tirent parti du coefficient Seebeck de l'AsGa et de <br />l'isolation thermique des structures suspendues, et les composants électroniques passifs micro­usinés <br />pour les circuits micro­ondes, comme les lignes micro­rubans et les inductances planaires. <br />Finalement, un ensemble d'outils de CAO pour les microsystèmes a été développé. Des modules <br />spécifiques ont été assemblés à l'environnement Mentor Graphics, comme par exemple la vérification <br />des règles de dessins pour les microsystèmes, des outils pour la visualisation du layout en coupe et en <br />trois dimensions, et des simulateurs de gravure. <br />Mots clés microsystèmes, arséniure de gallium, micro­usinage, thermocouple, inductance <br />planaire, outils de CAO.

<p>This thesis explores the potential of multifunctional silicon-based microsystems for advanced integrated nanospacecraft (AIN). Especially, multifunctional microsystems with the coexistant functions of communications and thermal management implemented in multilayer silicon stacks are approached with systems study. Host vehicles, composed of microsystems, including micro/nano-spacecraft and spherical rovers are contemplated with respect to future performance and implications, system level design, and breadboard realizations. A module of great importance, named the "integrated communications and thermal management system for advanced integrated spacecraft" or ICTM, symbolizes the achievements within the field of self-contained microsystems and is a prioritized entity throughout the thesis. The ICTM is natively placable onboard all types of highly miniaturized craft.</p><p>The single AIN spacecraft and future clusters of these are investigated with respect to future full scale implementation of space systems designed and implemented with the distributed reconfigurable nanospacecraft cluster (DRNC) concept. Here, a true entanglement of microsystems technology (MST) and miniaturized spacecraft technology can revolutionize the applications, cost, and span of conceivable space missions.</p><p>An intended communications scenario supporting a data rate of 1 Mbps, for the transmitter, is achieved during 6 minutes with a maximum continuous power dissipation of 10 W. Thermal simulations support the expectation, of a thermally biased ICTM, that the module is capable of supporting this energy burst, by using the mechanisms of heat storage and heat switches, and still fulfilling the requirements imposed by AIN type of spacecraft. In addition, multiple functional surfaces for the ICTM are evaluated with respect to equilibrium temperature and process compatibility. The tailored surfaces provide temperature control using micromachining methods.</p><p>A design of a micromachined Ka-band front end with several MST enabled features is presented including e.g. vias, phase-shifters, and antennas. Similar antennas have been manufactured resulting in an evaluation of ring- and slot-antennas on silicon substrate. Based on a primitive version of the ICTM, a S-band patch antenna has been successfully implemented and characterized. Included in the thesis is a microthruster, an enabling technology for DRNC.</p>

<p>Microsystem interfaces to the macroscopic surroundings and within the microsystems themselves are formidable challenges that this thesis makes an effort to overcome, specifically for enabling a spacecraft based entirely on microsystems. The NanoSpace-1 nanospacecraft is a full-fledged satellite design with mass below 10 kg. The high performance with respect to mass is enabled by a massive implementation of microsystem technology – the entire spacecraft structure is built from square silicon panels that allow for efficient microsystem integration. The panels comprise bonded silicon wafers, fitted with silicone rubber gaskets into aluminium frames. Each module of the spacecraft is added in a way that strengthens and stiffens the overall spacecraft structure.</p><p>The structural integrity of the silicon module as a generic building block has been successfully proven. The basic design (silicon, silicone, aluminium) survived considerable mechanical loads, where the silicon material contributed significantly to the strength of the structural element. Structural modeling of the silicon building blocks enables rapid iterative design of e.g. spacecraft structures by the use of pertinent model simplifications.</p><p>Other microsystem interfaces treats fluidic, thermal, and mechanical functions. First, solder sealing of microsystem cavities was demonstrated, using screen-printed solder and localized resistive heating in the microsystem interface. Second, a dismountable fluidic microsystem connector, using a ridged silicon membrane, intended for monopropellant thruster systems, was developed. Third, a thermally regulated microvalve for minute flows, made by a silicon ridge imprint in a stainless steel nipple, was investigated. Finally, particle filters for gas interfaces to microsystems, or between parts of fluidic microsystems, were made from sets of crossed v-grooves in the interface of a bonded silicon wafer stack. Filter manufacture, mass flow and pressure drop characterization, together with numeric modeling for filter design, was performed.</p><p>All in all this reduces the weight and volume when microsystems are interfaced in their applications.</p>

This thesis explores the potential of multifunctional silicon-based microsystems for advanced integrated nanospacecraft (AIN). Especially, multifunctional microsystems with the coexistant functions of communications and thermal management implemented in multilayer silicon stacks are approached with systems study. Host vehicles, composed of microsystems, including micro/nano-spacecraft and spherical rovers are contemplated with respect to future performance and implications, system level design, and breadboard realizations. A module of great importance, named the "integrated communications and thermal management system for advanced integrated spacecraft" or ICTM, symbolizes the achievements within the field of self-contained microsystems and is a prioritized entity throughout the thesis. The ICTM is natively placable onboard all types of highly miniaturized craft. The single AIN spacecraft and future clusters of these are investigated with respect to future full scale implementation of space systems designed and implemented with the distributed reconfigurable nanospacecraft cluster (DRNC) concept. Here, a true entanglement of microsystems technology (MST) and miniaturized spacecraft technology can revolutionize the applications, cost, and span of conceivable space missions. An intended communications scenario supporting a data rate of 1 Mbps, for the transmitter, is achieved during 6 minutes with a maximum continuous power dissipation of 10 W. Thermal simulations support the expectation, of a thermally biased ICTM, that the module is capable of supporting this energy burst, by using the mechanisms of heat storage and heat switches, and still fulfilling the requirements imposed by AIN type of spacecraft. In addition, multiple functional surfaces for the ICTM are evaluated with respect to equilibrium temperature and process compatibility. The tailored surfaces provide temperature control using micromachining methods. A design of a micromachined Ka-band front end with several MST enabled features is presented including e.g. vias, phase-shifters, and antennas. Similar antennas have been manufactured resulting in an evaluation of ring- and slot-antennas on silicon substrate. Based on a primitive version of the ICTM, a S-band patch antenna has been successfully implemented and characterized. Included in the thesis is a microthruster, an enabling technology for DRNC.

Modern electronics continues to push past boundaries of integration and functional density toward elusive, completely autonomous, self-powered microsystems. As systems continue to shrink, however, less energy is available on board, leading to short device lifetimes (run-time or battery life). Extended battery life is particularly advantageous in the systems with limited accessibility, such as biomedical implants and structure-embedded micro-sensors. The power management process usually requires compact and efficient power converters to be embedded in these microsystems. This dissertation introduces switched-capacitor (SC) power converter designs that make all these techniques realizable on silicon.Four different integrated SC power converters with multiple control schemes are designed here to provide low-power high-efficient power sources. First, a monolithic step-down power converter with subthreshold z-domain digital pulse-width modulation (DPWM) controller is proposed for ultra-low power microsystems. The subthreshold design significantly reduces the power dissipation in the controller. Second, an efficient monolithic master-slave complementary power converter with a feedback controller that purely operates in subthreshold operation region is discussed to tailor for the aforementioned ultra-low power applications. Third, we introduce an efficient monolithic step-down SC power stage with multiple-gain control and on-chip capacitor sizing for self-powered microsystems. The multiple-gain control helps the converter to constantly maintain high efficiency over a large input/output range. The size-adjustable pumping capacitors allow the output voltage to be regulated at different desired levels, with a constant 50% duty ratio. The monolithic implementations in these three integrated CMOS power converters effectively suppress noise and glitches caused by parasitic components due to bonding, packaging and PCB wiring. Fourth, an efficient step-up and step-down SC power converter with multiple-gain closed-loop controller is presented. The measurements and simulation results in these four power converters demonstrate the techniques proposed in this research. The approaches presented in this dissertation are evidently viable for realizing compact and high efficient SC power converters, contributing to next generation power-efficient microsystems designs.

The fundamental motivation for this dissertation is to address the widening interconnect gap between integrated circuit (IC) demands and package substrates specifically for high frequency digital-RF systems applications. Moore's law for CMOS ICs predicts that transistor density on ICs will double approximately every 18 months. The current state-of-the-art in IC package substrates is at 20µm lines/spaces and 50-60µm microvia diameter using epoxy dielectrics with loss tangent above 0.01. The research targets are to overcome the barriers of current technologies and demonstrate a set of advanced materials and process technologies capable of 5-10µm lines and spaces, and 10-30µm diameter microvias in a multilayer 3-D wiring substrate using 10-25µm thin film dielectrics with loss tangent in the <0.005. The research elements are organized as follows with a clear focus on understanding and characterization of fundamental materials structure-processing-property relationships and interfaces to achieve the next generation targets. (a) Low CTE Core Substrate, (b) Low Loss Dielectrics with 25µm and smaller microvias, (c) Sub-10µm Width Cu Conductors, and (d) Integration of the various dielectric and conductor processes.

Microsystem interfaces to the macroscopic surroundings and within the microsystems themselves are formidable challenges that this thesis makes an effort to overcome, specifically for enabling a spacecraft based entirely on microsystems. The NanoSpace-1 nanospacecraft is a full-fledged satellite design with mass below 10 kg. The high performance with respect to mass is enabled by a massive implementation of microsystem technology – the entire spacecraft structure is built from square silicon panels that allow for efficient microsystem integration. The panels comprise bonded silicon wafers, fitted with silicone rubber gaskets into aluminium frames. Each module of the spacecraft is added in a way that strengthens and stiffens the overall spacecraft structure. The structural integrity of the silicon module as a generic building block has been successfully proven. The basic design (silicon, silicone, aluminium) survived considerable mechanical loads, where the silicon material contributed significantly to the strength of the structural element. Structural modeling of the silicon building blocks enables rapid iterative design of e.g. spacecraft structures by the use of pertinent model simplifications. Other microsystem interfaces treats fluidic, thermal, and mechanical functions. First, solder sealing of microsystem cavities was demonstrated, using screen-printed solder and localized resistive heating in the microsystem interface. Second, a dismountable fluidic microsystem connector, using a ridged silicon membrane, intended for monopropellant thruster systems, was developed. Third, a thermally regulated microvalve for minute flows, made by a silicon ridge imprint in a stainless steel nipple, was investigated. Finally, particle filters for gas interfaces to microsystems, or between parts of fluidic microsystems, were made from sets of crossed v-grooves in the interface of a bonded silicon wafer stack. Filter manufacture, mass flow and pressure drop characterization, together with numeric modeling for filter design, was performed. All in all this reduces the weight and volume when microsystems are interfaced in their applications.

Cette thèse traite de la réduction d’ordre de modèle du phénomène communément rencontré dans la modélisation de microsystèmes, à savoir, dans la littérature anglaise, le « squeeze-film damping ». Dans un premier chapitre sont présentées les différentes méthodes de réduction d’ordre de modèle. Dans le cas des systèmes linéaires, elles ont un cadre théorique bien établi. Ces méthodes peuvent être adaptées pour les systèmes non-linéaires. La validité des modèles réduits résultants sera alors réduite à un certain espace des phases, leur établissement faisant intervenir certaines trajectoires particulières servant d’apprentissage. On présente finalement la méthode des modes normaux non-linéaires dont les modèles résultants ne dépendent pas d’une trajectoire d’apprentissage. Au chapitre 2, on s’intéresse plus particulièrement au phénomène de « squeeze-film damping » régi par l’équation de Reynolds. Après avoir détaillé son établissement à partir de certaines hypothèses, on décrit les différentes méthodes de résolution de l’équation linéaire puis non-linéaire de la littérature. On compare ensuite les résultats d’un modèle de l’équation de Reynolds à des simulations éléments finis de l’équation de Navier-Stokes afin de valider les hypothèses faites pour la dérivation de l’équation de Reynolds. On propose ensuite une résolution originale par changement de variable. On étudie aussi plusieurs autres résolutions possibles ainsi que plusieurs bases de projection parmi celles décrites dans le premier chapitre. Le chapitre 3 est consacré à la modélisation du problème couplé que constitue le micro-interrupteur MEMS qui est un candidat au remplacement des interrupteurs à base de transistors dans les communications RF. Sa modélisation fait intervenir trois domaines, la mécanique, l’électrostatique, et la fluidique à travers l’équation de Reynolds. Après voir décrit les différents modèles de la littérature, on propose un modèle réduit couplé dont le modèle fluidique est basé sur le modèle établi au chapitre 2. Ce modèle est validé par rapport à des modèles différences finies et à des résultats expérimentaux de la littérature.Enfin le quatrième chapitre traite de la réduction du coût d’évaluation du modèle réduit couplé de micro-interrupteur du chapitre 3. La première méthode proposée consiste à trouver une fonction d’approximation de la projection de la force fluidique sur le premier mode mécanique, fonction des coordonnées modales mécaniques position et vitesse. Cette méthode ne se révèle valable que dans le cas incompressible. Dans le cas compressible, la résolution de l’équation de Reynolds restant obligatoire, on utilise la méthode de Rewienski et al. qui consiste à linéariser par morceaux les fonctions régissant la dynamique. Une autre méthode de linéarisation par morceaux, tirant parti d’une particularité du modèle du chapitre 2 et permettant de s’affranchir d’une trajectoire d’apprentissage, est également proposée. / This thesis deals with reduced-order modelling of squeeze-film damping, a fluidic phenomenon that is commonly encountered in MEMS. In the first chapter, reduced-order modelling methods are presented. For linear systems, well-established theories exist. They can be adapted to nonlinear systems. However, the resulting reduced-order models are valid in a certain region of the state-space only, depending on the training trajectory. The method of nonlinear normal modes, which does not depend on a training trajectory is also introduced. Chapter two is focused on the squeeze-film damping phenomenon governed by the Reynolds equation. We first establish the equation from appropriate hypotheses, and then present the different resolutions of its linear and nonlinear form found in literature. The results from a model based on the Reynolds equation are then compared to results from a finite element Navier-Stokes model, in order to validate the various hypotheses made. An original method of resolution based on a change of variable is then proposed. Several other method of resolution are studied as well as different projection bases amongst those presented in chapter one.Chapter three is dedicated to the modelling a micro-switch, a candidate to the replacement of switches based on transistors in RF communications. Its modelling implies the coupling of three domains: mechanics, electrostatics, and fluidics with Reynolds equation. Following a description of the models from literature, a coupled model is proposed, the fluidic model being the one presented in chapter two. This model is validated compared to finite difference models as well as experimental data from the literature.Finally, the fourth chapter aims at reducing the evaluation cost of the coupled micro-switch model established in chapter three. The first method consists in finding an approximation function of the projection of the fluidic force on the first linear mechanical mode as a function of the mechanical modal coordinates, position and speed. This method is applicable in the incompressible case only. In the compressible case, the Reynolds equation has to be solved. The method of Rewienski and al., which consists in piecewise-linearizing the functions governing the dynamics, is used. Another method based on a piecewise-linear approach, taking advantage of the particular structure of the model presented in chapter two, thus not depending on a training trajectory, is proposed.

L'évolution des systèmes embarqués se traduit aujourd'hui par des ensembles complexes, dits systèmes cyber-physiques, opérant principalement en réseau et interagissant fortement avec leur environnement.Intégrés à des circuits de contrôle et de traitement du signal, les micro-systèmes électromécaniques, ou MEMS, jouent un rôle primordial dans ces ensembles en tant que capteurs ou actionneurs.La conception de tels systèmes requiert des solutions globales et pluri-disciplinaires telles que le prototypage virtuel.Basée sur des modèles haut-niveau, cette technique permet d'anticiper le comportement du système dès les premières phases de conception et de le raffiner lors de phases plus avancées.Ces méthodes ont progressivement été appliquées à la conception de circuits intégrés, notamment avec l'utilisation de langages de description matérielle, tels que VHDL ou Verilog.En adoptant un niveau d'abstraction supérieur, SystemC a largement contribué au développement concourant des parties matérielles et logicielles.Parallèlement, les extensions proposées dans SystemC-AMS répondent au nombre croissant de composants analogiques dans les circuits intégrés et constituent une base prometteuse pour le prototypage virtuel de systèmes hétérogènes.Pour cette raison, cette thèse traite de la modélisation et de la simulation haut-niveau de dispositifs MEMS en SystemC-AMS.Dans un premier temps, nous évaluons les capacités actuelles du standard et des modèles de calcul proposés dans SystemC-AMS.Nous démontrons les limites et la difficulté d'élaborer des modèles équivalents de dispositifs MEMS dont la géométrie et les couplages internes nécessitent des descriptions plus détaillées.Nous proposons donc, dans un deuxième temps, d'intégrer directement dans SystemC-AMS des modèles réduits de dispositifs MEMS.La réduction d'ordre de modèle est une méthode mathématique permettant de créer des représentations compactes de systèmes initialement très larges en termes de degrés de liberté.Ainsi, nous utilisons les modèles générés depuis l'outil d'analyse en éléments finis \emph{MEMS+} et proposons une interface de programmation pour les insérer dans des modèles SystemC-AMS.Après avoir détaillé les principales fonctionnalités de l'interface, nous discutons les améliorations possibles du standard et de la solution présentée.Enfin, nous vérifions notre solution avec l'étude d'un accéléromètre et comparons les résultats avec l'état de l'art en termes de précision des modèles et de performances de simulation.Cette thèse propose ainsi une méthodologie complète pour intégrer des dispositifs MEMS dans un environnement de simulation haut-niveau. / Embedded systems have evolved to more complex assemblies, called Cyber-Physical Systems (CPS), mostly operating through networks and tightly interacting with the environment.As actuators or sensors, micro-electromechanical systems (MEMS) are essential elements in these systems where they are integrated along with control and signal processing units.Designing such solutions requires a multi-domain approach like virtual prototyping.Based on system-level models, this technique allows to anticipate the global behavior in early-design phases and to further refine it in more advanced steps.Integrated circuits were progressively designed with respect to this method, especially through Hardware Description Languages (HDLs) like VHDL or Verilog.By adopting a higher-abstraction degree, SystemC enabled the co-development of hardware/software specific applications.In parallel, the Analog and Mixed-Signal (AMS) extensions proposed in SystemC-AMS partly addressed the increasing amount of analog components and are considered as a promising alternative for the virtual prototyping of heterogeneous systems.To that end, this thesis addresses the system-level modeling and simulation of MEMS devices in SystemC-AMS.First, we evaluate the current capabilities of the standard and supported models of computation in SystemC-AMS.We demonstrate the limitations and the the difficulty to elaborate equivalent models of MEMS devices whose geometry and internal coupling require more detailed descriptions.Second, we propose to directly integrate MEMS reduced models in SystemC-AMS.Model-order reduction is a mathematical technique to decrease the number of degrees of freedom and generate compact models from large-scale systems.We thus integrate the reduced models exported from the finite-element analysis tool \emph{MEMS+} and propose an Application Programmable Interface (API) to insert these \textit{ad hoc} models in SystemC-AMS.After reviewing the main API features, we discuss some improvements of both the standard and the presented solution.Finally, we verify our solution through the use case of an accelerometer and compare the results with the state of the art in terms of modeling accuracy and simulation performance.This thesis introduces a framework to integrate MEMS devices with the surrounding electronics in a unified system-level simulation environment.