Wire bonding has been used in integrated circuit packaging for many decades because of its high reliability and performance. The most common metal used has been gold, but with the surge in commodity prices of gold in recent years, copper wire is now used to altered gold wire for cost saving. Many challenges have to be solved to meet its application requirement; coating is one of the applications. In this study, a 3D coated copper wire and coated Al pad is built by finite element method to simulate ultrasonic bonding and thermosonic bonding. To consider the effect of coated material to stress and strain field on ultrasonic bonding and the effect of coated material to temperature field on thermosonic bonding. Then use the Taguchi experiment method to discuss the effect on Cu-Ball and Al pad under different coated material and thickness combination. The results show that with coated material on Al pad or copper wire could reduce more than 48% of effective plastic strain after the bonding process, it obviously reduce the Al splash phenomenon in copper wire bonding. But the coated material such like palladium and nickel which have lower thermal conductivity would resist the heat transfer. And the Taguchi experiment method shows that the most effective way to reduce the effective stress during impact stage and ultrasonic vibration stage is to increase the thickness of palladium and nickel respectively, and when the thickness of coated material Au reached 0.01£gm could increase the temperature of Cu-Ball and Al pad mostly.

In this paper, we discuss the effect of the hydrogen-bonding on the photoluminescent(PL) properties of 1-pyrenecarboxylic acid (PCA)/ poly(methyl methacrylate) (PMMA). Isolated fluorophore can be obtained when PCA molecules were blended and septrated by PMMA, i. e. excimer emission can be more efficiently prevented. With the use of non-solvent, toluene, in the preparation step, excimer emission of PCA can be more effeiciently prevented as compared to the good solvent, tetrahydrofuran(THF). With a high PMMA/PCA ratio of 1000/1, emission spectra show no sign of excimer formation. Intermolecular hydrogen bonding between PMMA and PCA helps to prevent the excimer formation. Solvents used in the preparative state play important role on the final PL properties of the solid film. In the blend, partial carbonyl groups in PMMA band with carboxylic acid group in PCA, this causes the appearance of a stretching band at 1718 cm-1 in infrared spectroscopy. The hydrogen-bond interactions help to the prevention of excimer formation in the PMMA/PCA blending systems.

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Properly folded proteins are necessary for all living organisms. Incorrectly folded proteins can lead to a variety of diseases such as Alzheimer’s Disease or Bovine Spongiform Encephalitis (Mad Cow Disease). Understanding the forces involved in protein folding is essential to the understanding and treatment of protein misfolding diseases. When proteins fold, a significant amount of surface area is buried in the protein interior. It has long been known that burial of hydrophobic surface area was important to the stability of the folded structure. However, the impact of burying polar surface area is not well understood. Theoretical results suggest that burying polar groups decreases the stability, but experimental evidence supports the belief that polar group burial increases the stability. Studies of tyrosine to phenylalanine mutations have shown the removal of the tyrosine OH group generally decreases stability. Through computational investigations into the effect of buried tyrosine on protein stability, favorable van der Waals interactions are shown to correlate with the change in stability caused by replacing the tyrosine with phenylalanine to remove the polar OH group. Two large-scale studies on nearly 1000 high-resolution x-ray structures are presented. The first investigates the electrostatic and van der Waals interactions, analyzing the energetics of burying various atom groups in the protein interior. The second large-scale study analyzes the packing differences in the interior of the protein and shows that hydrogen bonding increases packing, decreasing the volume of a hydrogen bonded backbone by about 1.5 Å3 per hydrogen bond. Finally, a structural comparison between RNase Sa and a variant in which five lysines replaced five acidic groups to reverse the net charge is presented. It is shown that these mutations have a marginal impact on the structure, with only small changes in some loop regions.

To improve the wire bondability, interfacial adhesion and popcorn cracking resistance in the packaging processing of IC and MEMS chips, this thesis utilized oxygen and helium plasmas to modify and clean the surface of metal pads. The influences of the plasma cleaning time, metal pad materials and wire bonding time/temperature/power on the strength of wire bonding were investigated. Two different wire materials (Al wire with 32 £gm in diameter and Au wire with 25 £gm in diameter) were bonded on the surface of Al, Au and Pt metal pads using a commercial ultrasonic wire bonder (SPB-U688), respectively. The pull strength detection of the implemented micro joints is characterized by an accurate pull strength testing system (Dage SERIES-4000). Based on hundred measurement results, this research has three conclusions described as follows. (I) The pull strength of Au pad is higher than that of Al and Pt pads no matter with the plasma cleaning process or not. The maximum pull strength (12.286 g) can be achieved as the surface of Au pad was modified by the helium plasma for 180 seconds. (II) Helium plasma cleaned wafer can obtain larger improvement of pull strength than that of the oxygen plasma under the same plasma time. However, this result can not be concluded in Al and Pt pads. (III) The optimized wire bonding time/power of the Au, Al and Pt pads are 0.07 s/2.1, 0.05 s/0.6 W and 0.03 s/2.7 W, respectively.

Ball bonding with gold wire has been the preferred choice to connect semiconductor chip and a lead frame. Recently, copper wires have been increasingly used to replace gold wires because of the rising price of gold. However, copper is harder than gold and has the tendency to induce the damage of bond pad or other underlying layers. Herein, Al pad material has to be changed from bulk to single crystal with (100) surface orientation in order to improve bonding reliability. Firstly, finite element method was adopted to simulate 3D wire bonding. Also, from the impact of gold wire bonding, the stress concentration was found on pad and underlying layers due to the higher elastic modulus of bulk Al. During copper ball impact, there is not only the serious stress concentration at pad, but also a pad splash due to the insufficient strength of bulk Al, even though bulk Al has a lower elastic modulus. Secondly, material properties of Al(100) were obtained by uniaxial tensile tests at constant speed. With molecular dynamics method, the incorporated result showed that Al(100) has the lower elastic modulus and higher yield strength than those of bulk material. Finally, single crystal Al(100) was used, instead of bulk material, to carry out copper ball impact process by using multi-scale simulation. Al(100) material is able to transform impact energy into the resilience of strain energy effectively owing to its high yield stress and low elastic modulus. Results show that the application of Al(100) material reduces the effects of stress concentration and pad ¡§splashing¡¨ successfully during copper ball impact process.

Thesis (M.S.D.)--Indiana University School of Dentistry, 2009. / Title from PDF t. p. (viewed Feb. 9, 2009) Advisor(s): Jeffrey A. Platt, Chair of the Research Committee, Tien-Min Gabriel Chu, Michael A. Cochran, Bruce A. Matis, Burak Taskonak, B. Keith Moore. Curriculum vitae. Includes abstract. Includes bibliographical references (leaves 71-76).

Thesis (Ph.D.)--University of Melbourne, Melbourne Dental School, Faculty of Medicine, Dentistry and Health Sciences, 2010. / Typescript. Includes bibliographical references.

Thesis (Ph. D.)--University of Chicago, Department of Chemistry, August 2003. / Includes bibliographical references. Also available on the Internet.

Thesis (Ph. D.)--University of Washington, 2003. / Vita. Includes bibliographical references (p. 96-115).