The goal of this thesis is on improving the understanding of mechanical and tribological mechanisms in microelectronic wire bonding. In particular, it focusses on the development and application of quantitative models of ultrasonic (US) friction and interfacial wear in wire bonding. Another objective of the thesis is to develop a low-stress Cu ball bonding process that minimizes damage to the microchip. These are accomplished through experimental measurements of in situ US tangential force by piezoresistive microsensors integrated next to the bonding zone using standard complementary metal oxide semiconductor (CMOS) technology. The processes investigated are thermosonic (TS) Au ball bonding on Al pads (Au-Al process), TS Cu ball bonding on Al pads (Cu-Al process), and US Al wedge-wedge bonding on Al pads (Al-Al process). TS ball bonding processes are optimized with one Au and two Cu wire types, obtaining average shear strength (SS) of more than 120 MPa. Ball bonds made with Cu wire show at least 15% higher SS than those made with Au wire. However, 30% higher US force induced to the bonding pad is measured for the Cu process using the microsensor, which increases the risk of underpad damage. The US force can be reduced by: (i) using a Cu wire type that produces softer deformed ball results in a measured US force reduction of 5%; and (ii) reducing the US level to 0.9 times the conventionally optimized level, the US force can be reduced by 9%. It is shown that using a softer Cu deformed ball and a reduced US level reduces the extra stress observed with Cu wire compared to Au wire by 42%. To study the combined effect of bond force (BF) and US in Cu ball bonding, the US parameter is optimized for eight levels of BF. For ball bonds made with conventionally optimized BF and US settings, the SS is ≈ 140 MPa. The amount of Al pad splash extruding out of bonded ball interface (for conventionally optimized BF and US settings) is between 10–12 µm. It can be reduced to 3–7 µm if accepting a SS reduction to 50–70 MPa. For excessive US settings, elliptical shaped Cu bonded balls are observed, with the major axis perpendicular to the US direction. By using a lower value of BF combined with a reduced US level, the US force can be reduced by 30% while achieving an average SS of at least 120 MPa. These process settings also aid in reducing the amount of splash by 4.3 µm. The US force measurement is like a signature of the bond as it allows for detailed insight into the tribological mechanisms during the bonding process. The relative amount of the third harmonic of US force in the Cu-Al process is found to be five times smaller than in the Au-Al process. In contrast, in the Al-Al process, a large second harmonic content is observed, describing a non-symmetric deviation of the force signal waveform from the sinusoidal shape. This deviation might be due to the reduced geometrical symmetry of the wedge tool. The analysis of harmonics of the US force indicates that although slightly different from each other, stick-slip friction is an important mechanism in all these wire bonding variants. A friction power theory is used to derive the US friction power during Au-Al, Cu-Al, and Al-Al processes. Auxiliary measurements include the current delivered to the US transducer, the vibration amplitude of the bonding tool tip in free-air, and the US tangential force acting on the bonding pad. For bonds made with typical process parameters, several characteristic values used in the friction power model such as the ultrasonic compliance of the bonding system and the profile of the relative interfacial sliding amplitude are determined. The maximum interfacial friction power during Al-Al process is at least 11.5 mW (3.9 W/mm²), which is only about 4.8% of the total electrical power delivered to the US transducer. The total sliding friction energy delivered to the Al-Al wedge bond is 60.4 mJ (20.4 J/mm²). For the Au-Al and Cu-Al processes, the US friction power is derived with an improved, more accurate method to derive the US compliance. The method uses a multi-step bonding process. In the first two steps, the US current is set to levels that are low enough to prevent sliding. Sliding and bonding take place during the third step, when the current is ramped up to the optimum value. The US compliance values are derived from the first two steps. The average maximum interfacial friction power is 10.3 mW (10.8 W/mm²) and 16.9 mW (18.7 W/mm²) for the Au-Al and Cu-Al processes, respectively. The total sliding friction energy delivered to the bond is 48.5 mJ (50.3 J/mm²) and 49.4 mJ (54.8 J/mm²) for the Au-Al and Cu-Al processes, respectively. Finally, the sliding wear theory is used to derive the amount of interfacial wear during Au-Al and Cu-Al processes. The method uses the US force and the derived interfacial sliding amplitude as the main inputs. The estimated total average depth of interfacial wear in Au-Al and Cu-Al processes is 416 nm and 895 nm, respectively. However, the error of estimation of wear in both the Au-Al and the Cu-Al processes is ≈ 50%, making this method less accurate than the friction power and energy results. Given the error in the determination of compliance in the Al-Al process, the error in the estimation of wear in the Al-Al process might have been even larger; hence the wear results pertaining to the Al-Al process are not discussed in this study.

This thesis begins with a brief analysis of the synthetic methodologies utilized in polymer science. A conclusion is drawn inferring that upper limits in molecular design are inevitable, arising as a direct consequence of the predominance of covalent strategies in the field. To address these concerns, the universal polymer backbone (UPB) concept has been hypothesized. A UPB has been defined as any copolymer, side-chain functionalized with multiple recognition elements that are individually capable of forming strong, directional, and reversible non-covalent bonds. Non-covalent functionalization of these scaffolds can lead to the formation of a multitude of new polymer structures, each stemming from a single parent or universal polymer backbone. To prepare such a UPB, isomerically pure exo-norbornene esters containing either a PdII SCS pincer complex or a diaminopyridine residue were synthesized, polymerized, and copolymerized via ROMP. All polymerizations were living under mild reaction conditions. Kinetic studies showed that the kp values are highly dependent upon the isomeric purity but completely independent of the terminal recognition units. Non-covalent functionalization of these copolymers was accomplished via 1) directed self-assembly, 2) multi-step self- assembly, and 3) one-step orthogonal self-assembly. This system shows complete specificity of each recognition motif for its complementary unit with no observable changes in the association constant upon functionalization. To explore potential applications of this UPB concept, random terpolymers possessing high concentrations of pendant alkyl chains and small amounts of recognition units were synthesized. Non-covalent crosslinking using a directed functionalization strategy resulted in dramatic increases in solution viscosities for metal crosslinked polymers with only minor changes in viscosity for hydrogen bonding motifs. The crosslinked materials were further functionalized via self-assembly by employing the second recognition motif, which gave rise to functionalized materials with tailored crosslinks. This non-covalent crosslinking/functionalization strategy could allow for rapid and tunable materials synthesis by overcoming many difficulties inherent to the preparation of covalently crosslinked polymers. Finally, the current status of the UPB concept is reviewed and methodological extensions of the concept are suggested. Evaluation of how UPBs may be used to optimize materials and their potential use in fabricating unique electro-optical materials, sensors, and drug delivery vesicles are explored.

This thesis presents the development of wafer level vacuum packaging processes using Au-Si eutectic and glass frit bonding contributing to the improvement of packaging concepts for a variety of MEMS devices. In the first phase of this research, micromachined resonators and pirani vacuum gauges are designed for the evaluation of the vacuum package performance. These designs are verified using MATLAB and Coventorware finite element modeling tool. Designed resonators and pirani vacuum gauges and previously developed gyroscopes with lateral feedthroughs are fabricated with a newly developed Silicon-On-Glass (SOG) process. In addition to these, a process for the fabrication of similar devices with vertical feedthroughs is initiated for achieving simplified packaging process and lower parasitic capacitances. Cap wafers for both types of devices with lateral and vertical feedthroughs are designed and fabricated. The optimization of Au-Si eutectic bonding is carried out on both planar and non-planar surfaces. The bonding quality is evaluated using the deflection test, which is based on the deflection of a thinned diaphragm due to the pressure difference between inside and outside the package. A 100% yield bonding on planar surfaces is achieved at 390&ordm / C with a v holding time and bond force of 60 min and 1500 N, respectively. On the other hand, bonding on surfaces where 0.15&mu / m feedthrough lines exist can be done at 420&ordm / C with a 100% yield using same holding time and bond force. Furthermore, glass frit bonding on glass wafers with lateral feedthroughs is performed at temperatures between 435-450&ordm / C using different holding periods and bond forces. The yield is varied from %33 to %99.4 depending on the process parameters. The fabricated devices are wafer level vacuum packaged using the optimized glass frit and Au-Si eutectic bonding recipes. The performances of wafer level packages are evaluated using the integrated gyroscopes, resonators, and pirani vacuum gauges. Pressures ranging from 10 mTorr to 60 mTorr and 0.1 Torr to 0.7 Torr are observed in the glass frit packages, satisfying the requirements of various MEMS devices in the literature. It is also optically verified that Au-Si eutectic packages result in vacuum cavities, and further study is needed to quantify the vacuum level with vacuum sensors based on the resonating structures and pirani vacuum gauges.

Eine grundlegende Schwierigkeit in der Röntgenoptik liegt in der Bereitstellung geeigneter Optiken. So ist aufgrund der schwachen Wechselwirkung der Röntgenstrahlung mit Materie der Einsatz brechender Optiken nicht sinnvoll, und es wird auf alternative Konzepte wie Röntgenwellenleiter zurückgegriffen. Röntgenwellenleiter sind nicht-dispersive strahlführende Optiken, welche die Kohärenz der Röntgenstrahlung filtern und als quasi-Punktquellen fungieren. Hierbei wird der Röntgenstrahl in einer oder zwei Dimensionen räumlich beschränkt, wobei der Wellenlängenbereich der Röntgenstrahlung eine Abmessung im sub-100 nm-Bereich erfordert. In der vorliegenden Arbeit wurde ein Verfahren etabliert, mit welchem die Herstellung von Wellenleiterkanälen im sub-50 nm-Bereich in Silizium gelingt. Die Prozessierung basiert hierbei auf einem Schema aus elektronenstrahllithographischer Belichtung, Reaktivem Ionenätzen und Wafer bonding. Das Verfahren ist variabel in Bezug auf verschiedene Wellenleitergeometrien, beispielsweise gekreuzte Wellenleiter und Kanalwellenleiter, ist auf alternative Materialien übertragbar, und erlaubt die Strahlführung auf in einer Dimension gekrümmten Pfaden. Die im Rahmen der vorliegenden Arbeit hergestellten Wellenleiter wurden erfolgreich an verschiedenen Synchrotron-Messplätzen eingesetzt und ihre Fernfelder charakterisiert, und der kohärente Wellenleiterstrahl wurde in der Röntgenmikroskopie und der holographischen Bildgebung eingesetzt. Es finden sich sowohl für die Quellgröße der Wellenleiter als auch für die Auflösung in der Bildgebung Werte im sub-50 nm-Bereich.

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2008. / Includes bibliographical references.

Le collage direct est un procédé par lequel deux surfaces suffisamment planes et propres peuvent se coller sans ajout d'un adhésif. Le collage direct de surfaces structurées est souvent utilisé pour la fabrication de système mécanique microélectronique (MEMS), où une plaque de silicium avec des cavités est collée à une autre plaque de silicium. La fabrication de ces dispositifs est chère et il serait utile d'avoir une ligne directrice lors du dessin de structures afin de savoir à l'avance si le collage direct sera possible.Un modèle de simulation 2D pour le collage direct de deux substrats est développéet utilisé pour étudier l'influence des cavités sur la vitesse de propagation de l'ondede collage. Les prédications données par des simulations avec Comsol® sont en bonnecohérence avec les mesures expérimentales et une loi en 2 dimensions de la vitesse de collage est obtenue. Le collage de plaques parfaitement planes avec des cavités serait toujours possible. Les limitations lors du collage de vraies plaques sont dues au coût de l'énergie élastique pour déformer les plaques non parfaitement planes. Cette limite est atteinte facilement quand l'onde de collage doit traverser une tranchée, dans ce cas un dessin avec un petit guide de collage pour aider à traverser la cavité fonctionnera mieux. La taille de ce guide d'onde doit être choisis en considèrent la flèche de la plaque. En effet la seconde règle importante du dessin est de garder une surface de collage suffisante pour avoir plus d'énergie d'adhésion que le coût en énergie élastique dû à la déformation des plaques non parfaitement planes.L'énergie d'adhésion est un important paramètre du collage direct, car c'est l'énergie qui permet l'adhésion. Cette énergie d'adhésion est différente de l'énergie de collage la plus répandues qui est l'énergie requise pour séparer deux plaques précédemment collées. Dans cet ouvrage une méthode simple de mesure d'adhésion est proposée. Une mesure de l'évolution de l'énergie d'adhésion sur un temps long nous mène à proposer un mécanisme d'évolution lié à la formation de ponts capillaires entre des surfaces rugueuses. / Direct bonding is a process by which two sufficiently flat and clean surfaces can bond to each other without any added adhesive layer. Direct bonding of patterned surfaces is often used for the fabrication of Micro-Electro-Mechanical Systems (MEMS), where a silicon wafer with cavities is bonded to a plain wafer. The fabrication of these devices is expensive and it would be useful to have guidelines when designing knew devices to know in advance if direct bonding will be possible.A 2D simulation model of the direct bonding of two substrates is developed and usedto study the influence of the cavities on the bonding wave velocity. The prediction of the simulation run with Comsol® are in good coherence with the experimental measures and a 2D law of the bonding velocity is obtained. The bonding of perfectly flat wafers with cavities should always be possible. Limitations to the bonding of real wafers are due to the elastic energy cost of deforming the non perfectly flat wafers. This limit is reached easily when the bonding wave must cross a trench, so a design with a small bonding guide to help cross the cavity will work best. The width of this wave guide should be chosen by considering the bow of the wafer. Indeed the second important design rule is to keep a bonding area big enough to have more adhesion energy than the elastic energy cost due to non flat wafers deformation.The adhesion energy is an important parameter of the direct bonding, as it is theenergy that drives the adhesion. This adhesion energy is different from the more widely known bonding energy which is the energy needed to separate two previously bonded wafers. In this work a simple method to measure the adhesion is proposed. Long time measurement of the evolution of the adhesion energy lead us to propose a mechanism for its evolution linked to the formation of capillary bridges between rough surfaces.

La démontabilité des assemblages collés structuraux est une nouvelle problématique liée à l’augmentation de l’utilisation de la technologie du collage dans de nombreux secteurs industriels et de la prise en compte de l’éco-conception dans les processus industriels. Peu de travaux ont été menés à ce jour sur cette thématique qui représente un véritable verrou technologique pour la diffusion de la technologie d’assemblage par collage. Une des voies utilisées et détaillées dans la présente étude est basée sur l’incorporation, dans une formulation d’adhésif, d’un additif organique solide possédant un point de sublimation dans une gamme de température connue.Ainsi, l’étude de l’influence de la reformulation par incorporation de l’additif montre qu’en dépit de la réactivité entre cette molécule et certains composants de la formulation de l’adhésif, les propriétés de mise en œuvre et les caractéristiques thermo-mécaniques ne sont pas drastiquement modifiées et restent compatibles avec une utilisation industrielle.Le mécanisme de démontabilité est basé sur la diffusion du gaz libéré par la réaction de sublimation de l’additif jusqu’aux interfaces où les contraintes générées induisent une rupture interfaciale. Néanmoins, le désassemblage est grandement fonction de la nature de la surface des substrats assemblés. Une compétition a lieu entre le travail nécessaire pour faire croître les bulles à l’interface et le travail des forces d’adhésion.L’efficacité de ce procédé de démontabilité a été éprouvée dans le cadre de tests de validation des segments du tore d’un télescope. L’assemblage réalisé avec un adhésif incorporant un additif spécifique permet de transmettre d’importantes contraintes mécaniques puis après une phase d’activation, de se désassembler avec des contraintes résiduelles nulles / Structural adhesives are nowadays widely used in numerous industries like automotive, aerospace, avionics or microelectronics … for many reasons such as easy processing or weight and cost savings. A strong effort has been achieved so far to enhance the level of adherence in structural assemblies and in this particular case a new challenge appears: the easy dismantling of structural bonded joints. This innovative concept results from industrial constrains like maintenance or recycling needs.This work studies a process which offers a simple and efficient solution to the disassembling of structural bonds. Based on the use of specific additives activated by heating at a certain temperature, this new technology allows the drastic decrease of the bonding performance and allow the dismantling in a very short time. It fulfills the main characteristics required by this application, like no change in processing (implementation, curing conditions,…) and no or slight modification of the mechanical properties. The results of the influence of adding additive is evaluated.This process is based on the incorporation. of specific chemicals in the adhesive or primer formulations. These additives are selected according to specific properties like decomposition temperature. An innovative aspect of this technology lies in the localization of the dismantling. The first step of the additive action is migration from the bulk of the adhesive to the interface. In a second time, once at the interface, the decomposition gases generated by the additive (mainly steam and nitrogen) induce constrains and stresses. After a certain time, theses stresses are sufficient enough to overcome the adhesion forces and the adhesive debonds from the substrate, adhesive failure occurs. One logical consequence of this interfacial action is the use of a dismantling primer, which enables to improve the efficiency of the technology and allows additive savings.This work proposes mecanisms based on experimental results in order to explain what happens in the adhesive bulk and on the interfaces. Finally, an application of this process is described related to the use of debondable adhesive for structural coupling during ground tests in the frame of GAIA telescope. Its main structure is a multi segments brazed torus in silicon carbide. In order to test each segment, a structural and debondable epoxy adhesive was developed, allowing structural bonding at room temperature and easy dismantling with interfacial failure after thermal activation. After testing and dismantling, segments were reused for final application.

This master´s thesis deals with the bonding process, which is the dominant technology of the production of door leaves for railway vehicles. Following the necessary study of the basic essence of bonded joints the thesis further introduces the individual construction options of this product. The essential part of the thesis is represented by presentation of the achieved results of the testing of individual selected types of adhesives. On the basis of these results the most suitable type and supplier of industrial adhesive is selected.

Cílem diplomové práce je návrh síťové konfigurační knihovny s důrazem kladeným na přenositelnost mezi operačními systémy na bázi Linuxu a BSD a rozšiřitelnosti podpory knihovny. V druhé kapitole práce zkoumá dostupné konfigurační rozhraní obou operačních systémů. Detailně pak rozebírá vlastnosti rozhraní Netlink socketů, které je primárním konfiguračním rozhraním pro síťové prvky na Linuxu, a systémové volání ioctl, které má na Linuxu menší schopnosti, ale zato je primárně používané na BSD a jiných UNIX systémech. Jsou též zkoumané rozhraní pro konfiguraci rozdílných firewallů. V třetí kapitole je práce zameřená na konkrétní typy síťových zařízení, specifika jejich konfigurace a jejich návaznost na rozhraní jádra popsané v druhé kapitole. V čtvrté kapitole jsou formulovány požadavky na konfigurační knihovnu: jednoduchá rozšiřitelnost, přenositelnost na různé operační systémy, podpora sledování změn a událostí a rozšiřitelnost o různé typy uživatelských rozhraní. Na základě výzkumu z předcházejících dvou kapitol je přednesen návrh knihovny. Návrh definuje konfigurační rozhraní jako hierarchii abstraktních tříd, oddělených od implementace. To umožnuje mít současně několik implementací stejného konfiguračního rozhraní i v rámci jednoho operačního systému. Jako vstupní rozhraní knihovny je definovaná třída LibNCFG, která má na starosti tyto konfigurační objekty vytvořit namísto uživatele. Tímto je dosažená jednoduchá rozšiřitelnost knihovny o nové rozhraní operačních systémů i o podporu konfigurace nových síťových prvků. Podpora pro nové uživatelské rozhraní se dá implementovat jako nová služba, která zabaluje rozhraní knihovny a poskytuje jiná rozhraní. Pro podporu sledování změn poskytuje třída LibNCFG metody pro registraci zpětných volání pro definované události. Ve čtvrté kapitole práce detailně popisuje rozhraní třídy LibNCFG, modulu Common a tříd NetDevice, EthDevice a BondDevice, které definují konfigurační rozhraní příslušných typů síťových zařízení. Pro tyto třídy jsou implementované konkrétní třídy NetlinkNetDevice, NetlinkEthDevice a sysfsBondDevice a popsané jejich implementační detaily. V páté kapitole je popsaná ukázková aplikace, která byla implementovaná pro účely předvedení jednoduchosti použití konfigurační knihovny. Nakonec jsou v závěru shrnuté výsledky práce a je vedena diskuze o možných vylepšeních a o pokračování projektu.

This paper discusses basic issues of micromachined ultrasonic transducers, including their design and fabrication. First, the acoustic fundamentals of ultrasonic transducers are introduced, and relevant simulation methods are illustrated. Following these topics, important aspects of silicon micromachining are presented. Based on this knowledge, two distinctive micromachining processes for transducer fabrication are proposed. One of them, the bulk process, has been proved to be successful, whereas for the second one, a surface process, some improvements are still needed. Besides these works, an innovative direct bonding technology is also developed. This technology constitutes the basis of the bulk process. Of course, it can also be used for the packaging of other MEMS devices.