Current membrane technology, based on polymeric materials, is subject to a limiting tradeoff between productivity (permeability) and efficiency (selectivity). Other materials with better gas separation performance exist, such as zeolites and carbon molecular sieves, but the physical characteristics of these materials inhibit industrial scale membrane preparation. This research focuses on the application of hybrid membrane technology, which has shown the ability to combine the advantageous properties of these materials, to a system comprised of carbon molecular sieves dispersed in the upper bound polymer 6FDA-6FpDA. Hybrid membranes require effective mass transfer across the interface between the two phases. This work shows the sensitivity of the component materials to processing conditions and the importance of consistency in gas separation membrane production. In particular, milling the sieves to reduce the size and using chemical linkage agents to bond to the polymer have potential to alter the separation performance of the respective materials. Analysis of multiple factors in this work provides important information regarding the source of unexpected properties in the hybrid membranes. Hybrid membrane testing in this work shows a need for active control of particle agglomerates within the dope prior to casting for effective membrane production. Continual sonication during the preparation of the casting dope was able to prevent the excessive agglomerates present in earlier trials. Further reduction of stresses generated during the casting process was also necessary to produce membranes with enhanced selectivity. Annealing the hybrid films above the polymer Tg appears to repair the interfacial morphology and produce effective membranes. The application of this process to enhance the gas separation performance of 6FDA-6FpDA represents the first known report of successful selectivity improvement in an upper bound polymer using the hybrid membrane approach.

The goal of this work was to achieve a homogeneous morphology of carbon nanotubes in a polyimide matrix, characterize the resulting nanocomposite properties, and understand structure-property relationships. Melt-mixing was used as an effective method for dispersing multiwall nanotubes and carbon nanofibers in a phenylethynyl terminated imide resin where aggregation occurred only in particle-saturated systems. Particle network formation within the nanocomposites was studied using rheology and impedance spectroscopy; results showed that the electrical percolation threshold occurred at a lower particle loading than the rheological percolation threshold, consistent with the oligomer size in comparison to the distance for electrical conductivity (~5 nm). Thermomechanical analysis showed that the addition of nanoparticles enhanced the polyimide storage modulus and thermal behavior indicated that the nanoparticles restricted polymer motion to higher temperatures. A study of the cure mechanism of the oligomer with and without nanoparticles showed that the nanoparticles reduced the activation energy required for cure initiation while increasing the obtainable extent of cure at various isothermal temperatures. The work presented in this dissertation shows that an easy, time effective processing method can be used to homogeneously disperse nanoparticles in an imide oligomer, and the resulting nanocomposites exhibit enhanced properties. A business plan is also presented that reflects the market potential of this technology.

Mixed matrix membranes (MMMs) consisting of a polymer bulk phase and an inorganic dispersed phase have the potential to provide a more selective membrane because they incorporate the selectivity of a zeolite dispersed phase while maintaining the ease of use of a polymer membrane. A critical problem in MMM applications is control over the polymer-zeolite interface adhesion during fabrication which can detrimentally impact membrane performance. In this work, MgOxHy (1≤x≤2, 0≤y≤2) nanostructures have been grown on pure-silica MFI and aluminosilicate LTA zeolites through four surface deposition techniques: Grignard decomposition reactions, solvothermal and modified solvothermal depositions, and ion-exchange induced surface crystallization. The structural properties of the surface nanostructures produced by each of the four methods were thoroughly characterized for their morphology, crystallinity, porosity, surface area, elemental composition, and these properties were used to predict the method’s suitability for use in composite membranes. The nanostructured zeolites were used in mixed matrix membranes (MMMs) at two MMMs weight loadings. The dispersion, mechanical properties, and CO₂/CH₄ gas separation properties were measured MMMs made with each method of functionalized LTA. All functionalization methods improve adhesion with the polymer observable by microscopy, the dispersion of particles, and the elastic modulus and hardness of the membrane. Gas permeation measurements prove the quality and effectiveness of the Ion Exchange membrane for CO₂/CH₄ separation by its significant increase in selectivity over the pure polymer. Lastly, the interface between the two materials was studied by probing the interfacial polymer mobility using NMR spin-spin relaxation measurements and mechanical mapping of membrane cross sections. It was shown that the nanostructures have both steric and chemical interactions with the polymer. Mapping of the elastic modulus indicated that functionalization methods that resulted in poorer zeolite coverage also disrupted the mechanical properties of the membrane at the interface of the materials. The investigations in this thesis provide detailed structure-property relationships of surface-modified molecular sieves and nanocomposite membranes fabricated using these materials, allowing a rational approach to the design of such materials and membranes.

Membrane separations are rapidly growing alternatives to traditionally expensive gas separation processes. For natural gas purification, membranes are used to remove carbon dioxide to prevent pipeline corrosion and increase the heating value of the natural gas. The robust chemical and physical properties of polyimide membranes make them ideal for the numerous components and high pressures associated with natural gas production. Typically, the performance of membranes changes over time as a result of physical aging of the polymer. Previous work shows that the thin selective layer of an asymmetric hollow fiber membrane, the morphology of choice for gas separations, ages differently than a thick dense film of the same material. Also, carbon dioxide, which is highly soluble in most polymers, can actively swell and plasticize polymer membranes at higher pressures. In this work, free acid groups present in the model polyimide are covalently crosslinked to stabilize the matrix against plasticization. Physical aging of two different crosslinked derivatives are compared to the free acid polyimide through gas permeation, gas sorption, and refractive index measurements. Thick (~50 m) and thin (~650 nm) films are examined to determine the effects of sample dimension on physical aging. The crosslinking mechanism employs diol substituents to form ester linkages through the free acid group. However, the annealing treatment, above the glass transition temperature, used to "reset" the thermal history of the films is found to form a new crosslinked polymer. Characterization of this new crosslinking mechanism reveals a high-temperature decarboxylation of the free acid creates free-radical phenyl groups which form covalent crosslinks through other portions of the polymer structure. Since ester crosslinks may be vulnerable to hydrolysis in aggressive gas feed streams, this new mechanism of crosslinking may create a more robust membrane for aggressive separations. In addition to the physical aging study, supercritical carbon dioxide conditioning of the two glycol crosslinked polyimides is compared to the free acid polymer. In this case, the free acid polymer is not crosslinked since the esterification crosslinking reaction occurs at much lower temperature than the decarboxylation mechanism. The free acid polymer displays an atypical permeation response under supercritical carbon dioxide conditions which suggests a structural reorganization of the polymer occurs. The crosslinked polymers do not exhibit this type of response. Mixed gas permeation confirms a substantial decrease in the productivity of the free acid polyimide and reveals the enhanced stability of the crosslinked polyimides following the supercritical carbon dioxide conditioning. Finally, examination of structurally similar fluorine-containing polyimides following approximately 18 years of aging allows the study of polymer structure on physical aging. A 6FDA-based polyimide is compared to a BPDA-based polyimide to understand the effects of bulky, CF3 groups on physical aging, and polyimides with diamine isomers reveal the effects of structural symmetry on physical aging.

This dissertation focuses on the synthesis and characterization of high performance polymers, specifically polybenzimidazoles (PBIs) for gas separation applications and polyimides (PI) for water purification and as interfacial agents for thermoplastic carbon fiber composites. Two methods for improving the gas transport properties (for H2/CO2 separation) of a tetraaminodiphenylsulfone (TADPS)-based polybenzimidazole were investigated. Low molecular weight poly(propylene carbonate) (PPC) and poly(ethylene oxide) (PEO) were incorporated as sacrificial additives that could be removed via a controlled heat treatment protocol. PBI films containing 7 and 11 wt% PPC (blend) and 13 wt% PEO (graft) were fabricated and the gas transport properties and mechanical properties after heat treatment were measured and compared to the PBI homopolymer. After heat treatment, the 7 wt% PPC blend exhibited the highest performance while retaining the toughness exhibited by the PBI homopolymer. Novel sulfonated polyimides and their monomers were synthesized for use as interfacial agents and water purification membranes. Polyimides are high performance polymers that have high thermal, mechanical, and chemical stability. The objective was to assess structure-property relationships of novel sulfonated polyimides prepared by direct polymerization of the diamine monomers. A series of sulfonated polyimides was synthesized using an ester-acid polymerization method with varying degrees of sulfonation (20%, 30%, and 50% disulfonated and 50% and 100% monosulfonated polyimides). The results showed that the toughness of the polyimides in the fully hydrated state was much better than current commercial cation exchange membranes. A 100% disulfonated polyimide (sPI) and poly(amic acid) salt (PAAS) using the same monomers used for the synthesis of Ultem® were utilized as suspending agents for the fabrication of coated sub-micron polyetherimide (PEI) particles. Sub-micron particles were obtained using 1 wt% PAAS and 4 wt% sPI to coat the PEI. The PEI particles were coupled onto ozone treated carbon fibers using a silane coupling agent. SEM images showed a significant amount of particle coating on the treated carbon fibers compared to the non-silane treated carbon fibers. / PHD

The humidity, temperature, wind speed/direction micro sensors can be manufactured individually, resulting in three individual substrates. The integration of the three sensors into a single substrate is a vital challenge to achieve an integrated intelligent sensor so called a multiple sensor. This requires the integration of process flows and is a major challenge because adequate sensor performance must be maintained. Polyimide was selected as a humidity sensing material for its compatibility with conventional integrated circuit fabrication technology, negligible temperature dependence and good resistance against contamination. Nickel was selected for the temperature and wind speed/direction sensor because of its useful temperature coefficient and the advantage of its cost. Since the known wet etchant for nickel requires hard-baked photoresist, a method which does not attack the polyimide while removing the photoresist must be developed. The method developed for etching nickel employs hard-bake-free photoresist. Other challenge was ensuring good thermal isolation for the wind speed/direction sensor fabricated on a silicon nitride layer preformed on top of a silicon wafer. Since silicon acts as a good heat sink, the silicon under the sensor was etched entirely away until the silicon nitride layer was reached. This structure achieved good thermal isolation resulting in small power consumption. This low power feature is essential for sensors deployed in fields where power access or replacement of power sources is restricted. This structure was compared with the structure created by polyimide plateau on a silicon nitride layer coated on a silicon substrate as a function of power consumption. Based on the examination of thermal isolation, the multiple sensor utilizing a MEMS technique was fabricated with a single-sided mask aligner. The characteristics of humidity sensors fabricated with polyimide were examined in detail with respect to variations of electrode structures, improvement of sensitivity, effect of process temperature, temperature and frequency dependence, and stability. The humidity sensor constructed with O2 plasma treated polyimide resulted an improvement in sensitivity and hysteresis. The investigation using XPS, FTIR and AFM concluded the chemical modification of polyimide played an important role in this improvement. The design, fabrication and results of a series of humidity sensors are quantified. There is always no unique packaging solution for sensors because of the application-specific nature of the sensors. This intelligent environmental monitoring system was designed to accommodate both an environmental sensor and its signal conditioning electronics circuitry (SICONEC) into a single package. The environmental sensors need direct exposure to the environment while SICONEC needs a sealed encapsulation to avoid environmental damage. A new style of packaging addressing these requirements was demonstrated using a hot embossing machine. The hot embossing machine was used to embed an integrated circuit (IC) in a bare die condition into a polycarbonate (PC) sheet. In this case, the IC was flipped down against the PC, which protects the front side of the IC from the environmental damages. In a test phase, a die containing operational amplifiers was embossed into the PC. A humidity sensor and surface mount resisters were placed on the same surface of the PC to test the validity of this new technique. Interconnection between the embossed die and the humidity sensor was established using bonding wires. Copper tracks were also used to ensure all electrical connections for the die, the humidity sensor and the resistors. The results clarified the method developed. Details of process methods, issues and further potential improvement are reported.

A challenging application space exists for high-aspect-ratio, high-fidelity dielectrics in micro-electro-mechanical system (MEMS), microelectronic, and photonic applications. Photosensitive polymers are widely used in these fields because they are relatively easy to process and pattern, and have good mechanical properties. Photosensitive polynorbornene (PNB)-based dielectrics have been shown to have high sensitivity, excellent photodefinition properties, and high mechanical strength making them suitable for MEMS, microelectronic packaging, and photonic applications. PNB-based dielectrics can be functionalized with epoxide, carboxylic acid, or fluorinated alcohol groups. Epoxy or carboxylic acid groups can be used to provide cross-linkable sites, resulting in improved chemical and thermal properties while fluorinated alcohol groups can provide solubility in aqueous base. The focus of this study has been on the epoxy-based cross-linking of ultraviolet and electron beam (e-beam) sensitive negative-tone PNB-based dielectrics. The impact of multifunctional epoxy-based additives on the cross-linking, photolithographic properties, and adhesion properties of the photosensitive PNB dielectric was investigated. High aspect ratio features of 13:1 (height:width) were produced in 40 µm thick films (a single coat) with straight side-wall profiles and high fidelity. Contrast values as high as 33.4 were obtained at doses below 15 mJ/cm2. To evaluate the polymer's suitability to MEMS and microelectronics applications, epoxy cross-linking reactions were studied as a function of processing condition through Fourier transform infrared spectroscopy (FTIR), nanoindentation, swelling and dielectric measurements. The fully cross-linked films had an elastic modulus of 2.9 GPa and hardness of 0.18 GPa which can improve the mechanical compliance of the packaging device. To explore the feasibility of the PNB dielectric as a highly sensitive e-beam resist for nano scale fabrication, the e-beam initiated reaction between PNB cross-linking sites and the multifunctional epoxy cross-linkers was investigated. In this study, the interaction of an e-beam with the PNB mixture and its compounds was investigated. The contrast, photodefinability, and e-beam activation of the components in the PNB formulations were studied. The PNB polymer had very high e-beam sensitivity and contrast. It was shown that the addition of a photoacid generator (PAG) to the polymer-epoxy mixture enhanced the contrast and sensitivity. Formulations with the additional cross-linker showed improved contrast, sensitivity, and substrate adhesion. 100 nm structures with 13.5 nm line edge roughness (LER) were fabricated. The influence of the developing time, the developer concentration, PEB, and film thickness on the contrast and sensitivity were studied. Structures with contrast values as high as approximately 8 were fabricated at doses as low as 0.38 µC/cm2. The acid-catalyzed epoxy ring opening reaction of the PNB dielectric was studied using FTIR spectroscopy. The photo and thermal acid generation initiated epoxy ring opening reactions and subsequent cross-linking of polymer. Additionally, polymer properties were characterized as a function of processing conditions for this polymer system. It was shown that thermal cure conditions have a substantial impact on the mechanical and electrical properties of the polymer. The rate and ultimate conversion of the epoxy ring opening reaction increased with increasing cure temperature, resulting in a higher degree of cross-linking at cure temperatures above 140°C. Degradation reactions occurred at temperatures above 160°C, indicating loss of epoxide cross-linking groups and linkages. These hypotheses were supported by electrical and mechanical property studies. It was shown that curing the PNB polymer at 160°C for 1 h after develop resulted in full epoxy ring opening and highest cross-link density. This sample showed lower dielectric constant (3.9), residual stress (20 MPa), and solvent swelling (3.1%). Variable frequency microwave (VFM) processing of the PNB dielectric was studied to investigate the rapid curing of the polymer at lower temperatures. The FTIR results showed that the microwave reaction rates were higher at each isothermal cure temperature compared to convective heating, indicating that the rapid VFM curing of PNB at low temperatures is feasible. The PNB film was fully cross-linked after 15 min VFM cure at the low temperature of 150˚C. The shortest time to fully cure the polymer was found to be 5 min at 160°C. Also, the feasibility of rapid VFM curing of PNB in air was studied. All samples VFM-cured (140˚C-180˚C) in air showed no signs of oxidation. The electrical and mechanical properties of VFM-cured films were characterized and compared with thermally cured films to determine the effectiveness of the VFM processing. VFM-cured samples showed higher degree of cross-linking than thermally-cured samples, which was congruent with the FTIR results. Improved or equivalent properties were obtained for VFM-cured samples at shorter cure cycles and lower cure temperatures compared to thermally-cured films. The PNB dielectric was also used as an overcoat material to make micro and nano fluidic channels. In this work, incorporation of advanced micro/nano fluidics with high-sensitivity photonic sensors was demonstrated. 500 nm to 50 µm channels were fabricated by thermal decomposition of epoxy-based PNB polymers. Microdisks with quality factors of over 106 were presented in complementary metal-xide-semiconductor (CMOS) compatible SiN on oxide technology. These ultra-high quality factor SiN resonators were demonstrated in the visible range for the first time. The fluidic structures were interfaced with photonics for index and florescence sensing. This study was a collaboration with Dr. Ehsan Shahhosseini from the Photonics Group at Georgia Tech.

Los polímeros de alto rendimiento (HPP) desempeñan un rol importante en la actualidad. El desarrollo de métodos más eco­nómicos para sintetizar estos polímeros minimizando el impacto tanto en la salud como en el medio ambiente es una prioridad. Las poliimidas (PI) pertenecen al grupo de los HPP y presentan características excepcionales como una gran estabilidad ante elevadas temperaturas, alta resistencia a los productos químicos agresivos y a la radiación, así como propiedades de aislamiento. Sin embargo, la síntesis de las PI presenta aún retos importantes. En este artículo presentamos un enfoque alternativo para sinte­tizar PI de forma y tamaño impresionante. / High-performance polymers (HPPs) play an important role in modern technology. Many efforts aim to develop cost-effective pathways to synthesize polymers without causing any harm to health and the environment. Polyimides (PIs) belong to the class of HPPs and they show outstanding features e.g. high-tempera­ture stability, resistance to aggressive chemicals and radiation, as well as insulating properties. PI synthesis, however, present yet major challenges. We herein present an alternative approach to PIs of intriguing shape and of impressive size.

Organic semiconductors have witnessed a prolific boom for their potential in the manufacturing of lightweight, flexible, and even biocompatible electronics. One of the fields of research that has yet to benefit from organic semiconductors is high temperature electronics. The lightweight nature and robust processability is attractive for applications such as aerospace engineering, which require high temperature stability, but little has been reported on taking such a leap because charge transport is temperature dependent and commonly unstable at elevated temperatures in organics. Historically, mechanistic studies have been bound to low temperature regimes where structural disorders are minimal in most materials. Discussed here is a blending approach to render semiconducting polymer thin films thermally stable in unprecedented operation temperature ranges for organic materials. We found that by utilizing highly rigid host materials, semiconducting polymer domains could be confined, thus improving their molecular and microstructural ordering, and a thermally stable charge transport could be realized up to 220°C. With this blending approach, all-plastic high temperature electronics that are extremely stable could also be demonstrated. In efforts to establish a universal route towards forming thermally stable semiconducting blends, we found that the molecular weight of conjugated polymer plays a crucial role on the miscibility of the blends. Finally, we found that the choice of the host matrix ought to consider the charge trapping nature of the insulator.<br>

The flexible and stretchable electronic market is increasing particularly in the field of biomedical electronics. Widely used printed silver conductive tracks today are only eligible for on-skin applications. However, for biomedical applications fully biocompatible, flexible and even stretchable materials for device fabrication are needed. This paper presents an additive printing approach to fabricate flexible and stretchable electronics by using a biocompatible platinum material. Usually, in order to realize electrically conducting Ptinterconnects by inkjet printing, it requires a furnace sintering at prohibitively high temperatures, which are not compatible with thermal sensitive polymeric substrates. This paper describes a high-power diode laser sintering (HPDL) and a flash lamp annealing (FLA) as promising alternative sintering methods. Both processes are eligible whereas laser sintering showed slightly better results. Bending tests and adhesive strength tests of platinum printed inks on polyimide with up to 180 000 cycles, show that printed platinum is a suitable biocompatible material for flexible electronics.