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No / Two novel reduced-size, printed spiral antennas are proposed for use in personal communications mobile terminals exploiting the “big low earth orbit” (Big-LEO) satellite system (uplink 1.61–1.63 GHz; downlink 2.48–2.5 GHz). The two proposed antenna give 3.12―6.25% bandwidth at lower resonant mode of 1600MHz, while at the higher resonant mode of 2450MHz a bandwidth of around 6% is obtained. The experimental and simulated return losses of the proposed antennas show good agreement. The computed and measured gains, and axial ratios are presented, showing that the performance of the proposed two antennas meets typical specifications for the intended applications.

Yes / In this paper, a planar multiple input, multiple output (MIMO) dipole antenna for a future sub-6 GHz 5G application is proposed. The planar MIMO structure consists of 4 antenna elements with an overall size of 150×82×1 mm3. The single antenna element is characterized by a size of 32.5×33.7×1 mm3 printed on an FR-4 dielectric substrate with εr=4.4 and tanδ=0.02. The suggested antenna structure exhibits good impedance bandwidth equal to 3.24 GHz starting from 3.3 to 6.6 GHz with an S11 value of less than -10 dB (S11≤-10 dB) with antenna gain varying from 5.2 up to 7.05 dB in the entire band, which covers all the sub-6 GHz frequency band of the 5G application. Good isolation is achieved between the MIMO elements due to low surface waves inside the MIMO antenna substrate. The radiation of the MIMO antenna structure can be manipulated and many beam-types can be achieved as desired. The high-frequency structure simulator (HFSS) software package is used to design and simulate the proposed structure, while the CST MWS is used to validate the results.

The layer-by-layer nature of additive manufacturing (AM) allows for access to the entire build volume of a component during manufacture including the internal structure. Voids are accessible during the build process and allow for components to be embedded and sealed with subsequently printed layers. This process, in conjunction with direct write (DW) of conductive materials, enables the direct manufacture of parts featuring embedded electronics, including interconnects and sensors. The scope of previous works in which DW and AM processes are combined has been limited to single material AM processes. The PolyJet process is assessed for hybridization with DW because of its multi-material capabilities. The PolyJet process is capable of simultaneously depositing different materials, including rigid and elastomeric photopolymers, which enables the design of flexible features such as membranes and joints. In this work, extrusion-based DW is integrated with PolyJet AM technology to explore opportunities for embedding conductive materials on rigid and elastomeric polymer substrates. Experiments are conducted to broaden the understanding of how silver-loaded conductive inks behave on PolyJet material surfaces. Traces of DuPont 5021 conductive ink as small as 750?m wide and 28?m tall are deposited on VeroWhite+ and TangoBlack+ PolyJet material using a Nordson EFD high-precision fluid dispenser. Heated drying at 55°C is found to accelerate material drying with no significant effect on the conductor's geometry or conductivity. Contact angles of the conductive ink on PolyJet substrates are measured and exhibit a hydrophilic interaction, indicating good adhesion. Encapsulation is found to negatively impact conductivity of directly written conductors when compared to traces deposited on the surface. Strain sensing components are designed to demonstrate potential and future applications. / Master of Science

ISO 9000:2000 is the newest version of the ISO 9000 family of standards. Unlike the 1994 version, it does not distinguish between servicing, testing and designing standards. It emphasizes quality improvement rather than quality control and briefly explains how to implement the Plan-Do-Check- Act (PDCA) cycle for improvement and the use of statistical techniques to improve the quality of process and product instead of controlling the quality of the output. The thesis explains why companies need to be certified and how to implement quality improvement programs. The objective of this thesis is to provide generic certification guidelines for printed circuit board manufacturers, based on ISO 9000:2000 standard. This standardized framework could assist companies in achieving ISO 9000 certification. Since every manufacturer has its own proprietary set of controls on their processes, these generic guidelines provide an opportunity for the user to plug in their own information and to write their own processes. Another objective of this thesis is to introduce a methodology for the implementation of the various methods and tools that can be applied for process improvement in printed circuit boards manufacturing.