Aerosol Jet® Printing (AJP) is a direct-write based additive manufacturing process that is capable of printing electronics with fine features and various materials. It eliminates the complex masking process in traditional semiconductor manufacturing, thus enables flexible electronics design and reduces manufacturing cost. However, the quality control of AJP processes is still a challenging problem, primarily due to the lack of understanding of the potential root causes of the quality issues. There is a complex interaction among process setting variables, in situ feature variables, and quality variables in AJP processes. In this research, an ensemble model strategy is proposed to quantify the effect of the process setting variables on the in situ feature variables, and the effect of the in situ feature variables on quality variables in a two-level hierarchical way. By identifying significant in situ feature variables as responses for the process setting variables, as well as predictors for product quality in a joint estimation problem, the proposed models have a hierarchical variable relationship to enable in situ process control for variation reduction and defect mitigation. A real case study is investigated to demonstrate the advantages of the proposed method. / Master of Science

Yes / Four versions of the compact hexagonal-shaped monopole printed antennas for UWB applications are presented. The first proposed antenna has an impedance bandwidth of 127.48 % (3.1 GHz to 14 GHz), which satisfies the bandwidth for ultra-wideband communication systems. To reduce the foreseen co-channel interference with WLAN (5.2GHz) and X-Band systems (10GHz), the second and third antennas type were generated by embedding hexagonal slot on the top of the radiating patch. The integration of the half and full hexagonal slots created notched bands that potentially filtered out the sources of interference, but were static in nature. Therefore, a fourth antenna type with tuneable-notched bands was designed by adding a varactor diode at an appropriate location within the slot. The fourth antenna type is a dual-notch that was electronically and simultaneously tuned from 3.2GHz to 5.1GHz and from 7.25GHz up to 9.9GHz by varying the bias voltages across the varactor. The prototypes of the four antenna versions were successfully fabricated and tested. The measured results have good agreement with the simulated results. / This work is carried out under the grant of the Fundacão para a Ciência e a Tecnologia (FCT - Portugal), with the reference number: SFRH/BPD/95110/2013.

This research focuses on developing a model to predict the yield of a printed circuit board manufactured on a given assembly line. Based on an extensive literature review as well as discussion with industrial partners, it was determined that there is no tool available for assisting engineers in determining reliable estimates of their production capabilities as they introduce new board designs onto their current production lines. Motivated by this need, a more in-depth study of manufacturing yield as well as the electronic assembly process was undertaken. The relevant literature research was divided into three main fields: process modeling, board design, and PCB testing. The model presented in this research combines elements from process modeling and board design into a single yield model. An optimization model was formulated to determine the fault probabilities that minimize the difference between actual yield values and predicted yield values. This model determines fault probabilities (per component type) based on past production yields for the different board designs assembled. These probabilities are then used to estimate the yields of future board designs. Two different yield models were tested and their assumptions regarding the nature of the faults were validated. The model that assumes independence between faults provided better yield predictions. A preliminary case study was performed to compare the performance of the presented model with that of previous models using data available from the literature. The proposed yield model predicts yield within 3% of the actual yield value, outperforming previous regression models that predicted yield within 10%, and artificial neural network models that predicted yield within 5%. A second case study was performed using data gathered from actual production lines. The proposed yield model continued to provide very good yield predictions. The average difference with respect to the actual yields from this case study ranged between 1.25% and 2.27% for the lines studied. Through sensitivity analysis, it was determined that certain component types have a considerably higher effect on yield than others. Once the proposed yield model is implemented, design suggestions can be made to account for manufacturability issues during the design process. / Master of Science

Yes / Data envelopment analysis (DEA) is a technique for identifying the best practices of a given set of decision-making units (DMUs) whose performance is categorized by multiple performance metrics that are classified as inputs and outputs. Although DEA is regarded as non-parametric, the sample size can be an issue of great importance in determining the efficiency scores for the evaluated units, empirically, when the use of too many inputs and outputs may result in a significant number of DMUs being rated as efficient. In the DEA literature, empirical rules have been established to avoid too many DMUs being rated as efficient. These empirical thresholds relate the number of variables with the number of observations. When the number of DMUs is below the empirical threshold levels, the discriminatory power among the DMUs may weaken, which leads to the data set not being suitable to apply traditional DEA models. In the literature, the lack of discrimination is often referred to as the “curse of dimensionality”. To overcome this drawback, we provide a simple approach to increase the discriminatory power between efficient and inefficient DMUs using the well-known pure DEA model, which considers either inputs only or outputs only. Three real cases, namely printed circuit boards, Greek banks, and quality of life in Fortune’s best cities, have been discussed to illustrate the proposed approach. / panish Ministry of Economy, Industry and Competitiveness (Ministerio de Economía, Industria y Competitividad), the State Research Agency (Agencia Estatal de Investigación) and the European Regional Development Fund (Fondo Europeo de Desarrollo Regional) under grant MTM2016-79765-P (AEI/FEDER, UE).

The ever-increasing need for higher bandwidth and density is one of the motivations for extensive research on planar optoelectronic structures on printed circuit board (PCB) substrates. Among these applications, optical interconnects have received considerable attention in the last decade. Several optical interconnect techniques, such as free space, guided wave, board level and fiber array interconnects, have been introduced for system level applications. In all planar optoelectronic systems, optical waveguides are crucial elements that facilitate signal routing. Low propagation loss, high reliability and manufacturability are among the requirements of polymer optical waveguides and polymer passive devices on PCB substrates for practical applications. Besides fabrication requirements, reliable characterization tools are needed to accurately and nondestructively measure important guiding properties, such as waveguide propagation loss. In three-dimensional (3D) fully embedded board-level optical interconnects, another key challenge is to realize efficient optical coupling between in-plane waveguides and out-of-plane laser/detector devices. Driven by these motivations, the research presented in this thesis focuses on some fundamental studies of optical interconnects for PCB substrates, e.g., developing low-loss optical polymer waveguides with integrated efficient out-of-plane couplers for optical interconnects on printed circuit board substrates, as well as the demonstration of a novel free-space optical interconnect system by using a volume holographic thin film. Firstly, the theoretical and experimental investigations on the limitations of using mercury i-line ultraviolet (UV) proximity photolithography have been carried out, and the metallization techniques for fine copper line formation are explored. Then, a new type of low-loss polymer waveguides (i.e., capped waveguide) is demonstrated by using contact photolithography with considerable performance improvement over the conventional waveguides. To characterize the propagation properties of planar optical waveguides, a reliable, nondestructive, and real-time technique is presented based on accurately imaging the scattered light from the waveguide using a sensitive charge coupled device (CCD) camera that has a built-in integration functionality. To provide surface normal light coupling between waveguides and optoelectronic devices for optical interconnects, a simple method is presented here to integrate 45° total internal reflection micro-mirrors with polymer optical waveguides by an improved tilted beam photolithography (with the aid of de-ionized water) on PCBs. A new technique is developed for a thin layer of metal coating on the micro-mirrors to achieve higher reflection and coupling efficiency (i.e., above 90%). The combination of the capped waveguide technique and the improved tilted UV exposure technique along with a hard reusable metal mask for metal deposition eliminates the usage of the traditional lift-off process, greatly simplifies the process, and reduces fabrication cost without sacrificing the coating quality. For the study of free-space optical interconnects, a simple system is presented by employing a single thin-film polymeric volume holographic element. One 2-spherical-beam hologram is used to link each point light source with the corresponding photodetector. An 8-channel free-space optical interconnect system with high link efficiency is demonstrated by using a single volume holographic element where 8 holograms are recorded.

Οι σύγχρονες επικοινωνιακές ανάγκες οδήγησαν στην ευρεία εξάπλωση των ασύρματων δικτύων και στη σταδιακή αντικατάσταση των υφιστάμενων ενσύρματων. Η ραγδαία εξέλιξη των ασυρμάτων επικοινωνιών είχε ως αποτέλεσμα την σημαντική μείωση των διαστάσεων των τερματικών συσκευών, την ολοκλήρωση διαφορετικών υπηρεσιών διαφορετικών συχνοτήτων λειτουργίας στην ίδια συσκευή και την ανάγκη πολλαπλών κεραιών για την αντιμετώπιση του φαινοµένου της διάλειψης και της διασυµβολικής παρεμβολής του ασύρματου καναλιού. Αυτές οι εξελίξεις έθεσαν καινούργιες απαιτήσεις στην σχεδίαση της κεραίας οδηγώντας στην ανάγκη κεραιών εξαιρετικά μικρών διαστάσεων, πολυσυχνοτικών, χαμηλού κόστους, υψηλής απόδοσης και επιθυμητών χαρακτηριστικών ακτινοβολίας κατά περίπτωση. Όλα αυτά είχαν ως αποτέλεσμα να δοθεί ιδιαίτερη έμφαση στη μελέτη και σχεδιασμό τυπωμένων επίπεδων κεραιών που θα συμβάλλουν στην εξασφάλιση της κατάλληλης ποιότητας παρερχόμενων υπηρεσιών (QOS). Οι τυπωμένες επίπεδες κεραίες αποτελούν κυρίαρχο συστατικό ενός ασύρματου επικοινωνιακού συστήματος και αποτελούν αντικείμενο μελέτης καθώς παρουσιάζουν ελκυστικά χαρακτηριστικά. Χαρακτηριστικά αναφέρουμε πως έχουν χαμηλό κατασκευαστικό κόστος, μικρό βάρος και μέγεθος. Επιπλέον είναι εύκολο να κατασκευαστούν, να ενσωματωθούν σε τερματικές διατάξεις και μικροκυματικά κυκλώματα και να συνδυαστούν σε επίπεδες συστοιχίες κεραιών. Πρόκειται για διατάξεις συμβατές με ηλεκτρονικά σταθερής κατάστασης ,τεχνολογίες Silicon, υβριδικά και μονολιθικά κυκλώματα και είναι κατάλληλες για μεγάλο εύρος εφαρμογών. Στη παρούσα διπλωματική εργασία παρουσιάζεται μια μελέτη τυπωμένων κεραιών γεωμετρίας Yagi για ασύρματες τερματικές συσκευές ,με έμφαση στις εφαρμογές των κινητών επικοινωνιών και των ασυρμάτων τοπικών δικτύων. Αρχικά πραγματοποιήθηκε μια βιβλιογραφική αναζήτηση και παρουσίαση των υπαρχόντων Yagi κεραιών που έχουν παρουσιαστεί κατά καιρούς στη διεθνή βιβλιογραφία και στη συνέχεια μελετήθηκαν και σχεδιάστηκαν τυπωμένες Yagi κεραίες για διαφορετικές εφαρμογές και με διαφορετικά χαρακτηριστικά λειτουργίας .Εξομοιώθηκαν κεραίες στενής αλλά και ευρείας ζώνης με διαφορετική γεωμετρική δομή, μέγεθος, μηχανισμούς τροφοδοσίας και ζώνες λειτουργίας. Επιπλέον εξετάστηκαν ζητήματα όπως ο συνδυασμός των τυπωμένων κεραιών σε συστοιχίες καθώς και ο ρόλος του επιπέδου γείωσης, του μηχανισμού τροφοδοσίας , των κατευθυντικών στοιχείων και πώς αυτά επηρεάζουν τη λειτουργία της κεραίας. / Modern communication needs have led to wide spread of wireless networks and to the progressive replacement of the existing wired-ones. Wireless communications’ rapid development resulted in the reduction of terminal device’s dimensions as well as in the integration of different services operating in various frequencies in the same device and finally in the deployment of multiple antennas systems to mitigate the phenomena of fading and intersymbol interference of wireless channel. These developments, in turn, placed new requirements in antenna’s design leading to the need of exceptionally small, low-cost and multiband antennas, possessing high efficiency and desirable radiation characteristics. As a result specific emphasis was given in the study and design of printed antennas that will guarantee the appropriate quality of services (QOS). It is a fact that printed planar antennas are one of the most important components of a wireless communication system and they are an object of great study as they present attractive characteristics. It is important to mention that they are small in weight and size and they can be easily fabricated with low cost procedures. Moreover they can be integrated in terminal devices and microwave circuits and they can be combined in antenna arrays. In addition they are compatible with solid-state electronics, Silicon technologies, hybrid and monolithic circuits and they are suitable for a wide range of applications. A study on printed Yagi antennas for terminal devices is presented on this thesis with emphasis in applications for mobile communications and wireless local networks. Initially a bibliographic research has been realised on existing printed Yagi antennas that have occasionally been presented in the international bibliography and we their different features and geometric models have been introduced. Afterwards, printed Yagi antennas have been deigned and studied for different applications with various operational characteristics. We have simulated narrowband and also broadband antennas with different geometric structure, size, feeding mechanism and area of operation. Moreover many issues have been examined such as antennas’ combination in arrays, antennas’ operation and performance in comparison with ground plane presence, different feeding mechanism and additional directors.

Entre 1829 et 1851 le champ dramatico-médiatique s’est vu reconfiguré : l’apparition de grandes revues littéraires, la naissance de la presse à quarante francs, la multiplication des périodiques et l’augmentation de leurs tirages sont conjoints des bouleversements économiques, politiques et sociaux faisant suite à la période postrévolutionnaire, et de mutations théâtrales majeures sur les scènes parisiennes. En résulte un accroissement de la présence de textes dramatiques diffusés dans la presse, sous de multiples formes : pièces jouées à lire en feuilletons, extraits, fragments, mais aussi ensembles de scènes théâtrales et d’articles théâtralisés ou dialogués à lire le temps de la fréquentation d’une feuille. Il existe ainsi à l’époque un troisième canal d’accès du théâtre vers l’espace public – entre la scène et le livre –, la presse. Parce que le théâtre partage avec le périodique des caractéristiques discursives, stylistiques et formelles, ses limites s’en trouvent diluées sinon abolies. En cet espace spécifique qu’est le journal, il n’est pas de concept de « genre dramatique » qui tienne. Ce que nous avons coutume de nommer « théâtre » n’existe pas, et vient à former une masse textuelle impure, mêlant matières journalistiques et dramatiques. Aussi est-ce au regard de ce contexte éditorial pleinement signifiant qu’il convient d’interpréter les pièces en bonne et due forme alors diffusées, parfois composées à sa destination : un pan entier de l’écriture dramatique romantique a été « médiatique », et doit se comprendre comme tel, recontextualisé et « recotextualisé » dans un cadre éditorial soumis aux modes, à la temporalité collective, à la collaboration et aux effets de lecture redevables à la présence d’autres articles qui lui sont contigus. Étudier le lien intime que les formes dramatiques éditées dans la presse entretiennent avec leur support de diffusion dans le second tiers du XIXe siècle permet de faire émerger une autre histoire du théâtre romantique, médiatique et en grande partie textuelle, en mettant au jour des auteurs, des tentatives dramatiques ou des événements aujourd’hui oubliés, mais aussi en ouvrant à la relecture de textes consacrés, tels ceux de Sand, de Vigny ou encore de Musset. / During the period 1829-1851, numerous factors brought about a reconfiguration of the relationship between print media and dramatic genres: the appearance of major literary journals, the introduction of low-priced printed press, the proliferation of mass periodicals and their increased print runs. These factors echoed not only the economic, social and political upheavals that characterized the first half of the 19th-century in post-revolutionary France but also the sweeping changes that affected the Parisian stage. As a result, one notes an increased presence of dramatic texts in the printed press. They may appear in various forms, as serialized theatrical plays, extracts, fragments but also collections of scenes and dramatized or dialogue-based articles – their length tailored to the newspaper format. Thus, between the stage and the page, dramatic forms could reach the public through a third access channel: print media. Their shared discursive, stylistic and formal features blur and even obliterate the boundaries between dramatic texts and periodical writing. In this particular context, the concept of “dramatic genre” does not apply and what we call “drama” does not exist as such. The result is a mixed mass of text, combining journalistic and dramatic materials. The “proper” plays that were circulated in the press, or even written for it, should be studied against the backdrop of this fully significant editorial context. An entire branch of Romantic playwriting was “media-oriented” and should be understood as such, with a new focus on context and co-text within an editorial framework subject to trends, collective temporality, collaborations and reading effects resulting from the influence of adjacent articles.The study of the close relationship between dramatic forms and their means of dissemination in the second third of the 19th-century gives a new, media-oriented and largely text-centered perspective on the history of the Romantic drama. Besides highlighting long-forgotten authors, events or diverse dramatic forms, it also prompts a new approach to the dramatic writings of well-established authors such as George Sand, Alfred de Vigny or Alfred de Musset.

M. Tech. (Department of Metallurgical Engineering, Faculty of Engineering and Technology), Vaal University of Technology. / Dust generated during comminution of end of life printed circuit boards (PCB), typically having d80 of 212 μm, contains copper and gold up to 6.32 % and 635 g/ton, respectively. The dust particles being highly diverse in material makeup, an hydrometallurgical processing scheme able to selectively recover target values was studied. Use of mineral acids will result in multiple metal dissolution which will complicate subsequent solution treatments. Detailed characterization of the dust was first carried out, and leaching scheme were thereafter investigated to selectively recover gold and copper from the dust, in three leaching stages. Different conditions of ammonia and thiourea leaching were investigated to optimize agitation speed, reagents concentration, temperature and leaching time. The leaching kinetics of these elements from the dust under different prevailing leaching conditions were studied. Elemental composition of the dust size fractions indicates metal contents generally increase with decreasing dust particle size, down to – 53 μm size, which contains up to 635 g/ton Au, 25.43 % Fe, and 1.40 % Cu, compared to 51 g/ton Au, 3.07 % Fe and 6.32 % Cu in the 150–212 μm fraction. Thermodynamically, under oxidative ammonia leaching, zinc and copper ammine complex is feasible, yet zinc recovery is low. For 75 – 106 μm dust size, 2 M NH4OH, 17.5 M H2O2, 1 atm. pressure and 400 rpm in Parr reactor, Cu and Zn recoveries were 92 % and 50 %, while the activation energies evaluated within 283 – 313 K gave 47.39 kJ/mol and 33.12 kJ/mol. The kinetic analysis for copper leaching gave best correlation coefficient (R2) of 0.9804 when fitted into the chemical control model, and the rate constant was 4.4 x 10-3 at 313 K. The presence of base metals frustrates direct gold recovery from the dust using thiourea with sulphuric acid and hydrogen peroxide. Therefore, the residue obtained from the first stage copper leach was acid washed to remove iron and other residual base metal contents with 5 M H2SO4, at 333 K, 400 rpm for 2 hours. Recovery analysis shows that about 75-98 % Fe, 54-65 % Zn and 96-98 % Ni were recovered under this condition while Cu was less than 7 % at all PSDs; copper having been selectively removed at the first stage. Using 75 – 106 μm dust fraction, gold recovery was optimum when the acid wash residue was leached with 0.5 M thiourea (SC(NH2)2), 0.5 M sulphuric acid (H2SO4), 0.1 M hydrogen peroxide (H2O2) under 1 atm. pressure, 298 K and 400 rpm for 4 hours. The recovery was 98 % Au. Using this optimum for other size fractions, over 98 % gold was recovered from 150–212 μm, 106 – 150 μm and 75 – 106 μm dust while 71 % and 68 % Au were recovered from 53 – 75 μm and – 53 μm respectively. The lower recovery at the finest sizes can be due to the quantity of the gold contents deported in this particle size, which will require higher reagent dosage. The kinetic analysis gave best correlation coefficient (R2) of 0.99 when fitted to the chemical control leaching model. From this data, a process flowsheet was proposed to give separate streams rich in copper and gold values from the processed dust, with detailed processing parameters. This is considered a readily scalable process solution for retrieving gold and copper from PCB dust.

Trend towards downsizing the product size and at the same time to bring more functionality in electronic products, demands electrically interconnecting several miniaturized electronic components with high counts of I\Os (Input/Out put) on smaller and smaller size printed wiring boards [PWB]. These miniature components occupy lower foot print area but require higher routing interconnection densities. However, the conventional multilayer board technologies exhibit limitations when there is need to connect very high I\O components such as ball grid arrays, which require blind and buried interconnections within the multilayer mono-block. This limitation has given raise to newer methods of multi layer construction. Build–up multilayer PWB is now the technology of choice for enhanced routing capability including blind and buried interlayer connections. Build up methods are based on making very small vias within dielectric layers followed by metalisation. Typically blind and buried vias are very small, and hence called “micro vias” connecting the layers selectively within the multilayer mono-block. Buried vias make the interconnection between the consecutive layers, and blind vias connect the surface layers to any one of the interior layers in the build up multilayer board. If the blind vias are filled with a dielectric, the entire top and bottom surface area becomes available for high -density component mounting. The crux in build up board technologies is the method of creating micro-holes; a micro hole is a hole, which is less than 150 micro meter in diameter. Efforts are made to replace existing metalising techniques with “paste filling” methodologies, which would result in “SOLID CONDUCTING VIAS” CALLED AS “MICRO -INTERCONNECTS” The work reported in this thesis aims at demonstrating one such innovative ‘solid conducting via’ formation without using any of the known micro-hole formation techniques. Based on the results obtained some useful conclusions have been drawn which will perhaps go a long way in the name of “PRINTED PILLAR TECHNOLOGY” a novel methodology for building multilayer suitable for very high I\O components such as “ball grid arrays.”

Inkjet printing has emerged from a digital graphic arts printing technology to become a versatile tool for the patterned deposition of functional materials. This thesis contributes to the research in the area of functional inkjet printing by focusing on two different topics: (i) inkjet printing of colloidal suspensions to study the principles of deposit formation and to develop deposits with photonic properties based on self-assembly, and (ii) the development of a reliable manufacturing process for all-inkjet-printed thin-film transistors, highlighting the importance of selection of materials and inks, print pattern generation, and the interplay between ink, substrate and printing conditions. (i) Colloidal suspensions containing nanospheres were applied as ink formulation in order to study the fundamental processes of layer formation and to develop structures with periodically arranged nanospheres allowing the modulation of electromagnetic waves. Evaporation-driven self-assembly was found to be the main driver for the formation of the final deposit morphology. Fine-tuning of inkjet process parameters allows the deposition of highly ordered structures of nanospheres to be arranged as monolayer, multilayer or even three-dimensional assemblies with a microscopic spherical shape. (ii) This thesis demonstrates the development of a manufacturing process for thin-film transistors based on inkjet printing. The knowledge obtained from the study with the colloidal nanospheres is used to generate homogeneous and continuous thin films that are stacked well-aligned to each other to form transistors. Industrial printheads were applied in the manufacturing process, allowing for the up-scaling of the manufacturing by printing of several thousands of devices, and thus the possibility to study the process yield as a function of printing parameters. The discrete droplet-by-droplet nature of the inkjet printing process imposes challenges on the control of printed patterns. Inkjet printing of electronic devices requires a detailed understanding about the process and all of the parameters that influence morphological or functional characteristics of the deposits, such as the selection of appropriate inks and materials, the orientation of the print pattern layout to the deposition process and the reliability of the inkjet process.