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Copper has become the metal of choice for metallization, owing to its high electrical and thermal conductivity, relatively higher melting temperature and correspondingly lower rate of diffusivity. Most of the current studies can get high strength copper thin films but on an expense of conductivity. This study proposes a technique to deposit high strength and high conductivity copper thin films on different silicon substrates at room temperature. Single crystal Cu (100) and Cu (111) have been grown on Si (100) and Si (110) substrates, respectively. Single crystal Cu (111) films have a high density of growth twins, oriented parallel to the substrate surface due to low twin boundary energy and a high deposition rate. The yield strengths of these twinned Cu films are much higher than that of bulk copper, with an electrical resistivity value close to that of bulk copper. X-ray diffraction, transmission electron microscopy and nanoindentation techniques were used to show that high density twins are sole reason for the increase in hardness of these thin films. The formation of growth twins and their roles in enhancing the mechanical strength of Cu films while maintaining low resistivity are discussed.

Copper has become the metal of choice for metallization, owing to its high electrical and thermal conductivity, relatively higher melting temperature and correspondingly lower rate of diffusivity. Most of the current studies can get high strength copper thin films but on an expense of conductivity. This study proposes a technique to deposit high strength and high conductivity copper thin films on different silicon substrates at room temperature. Single crystal Cu (100) and Cu (111) have been grown on Si (100) and Si (110) substrates, respectively. Single crystal Cu (111) films have a high density of growth twins, oriented parallel to the substrate surface due to low twin boundary energy and a high deposition rate. The yield strengths of these twinned Cu films are much higher than that of bulk copper, with an electrical resistivity value close to that of bulk copper. X-ray diffraction, transmission electron microscopy and nanoindentation techniques were used to show that high density twins are sole reason for the increase in hardness of these thin films. The formation of growth twins and their roles in enhancing the mechanical strength of Cu films while maintaining low resistivity are discussed.

Diamond-like Carbon (DLC) film exhibits an extreme hardness, low friction coefficient, chemical stability, heat conductivity, and high resistance. Their properties lead to remarkable applications on industry. In the experiment, we use electrondeposition to deposit the DLC film on Si substrate. Different concentrations of electrolyte were used to deposit on the of silicon substrates with different roughness surface. KOH solution was used to etch and to get the different roughness on the surface of silicon substrates. the morphology of surface were observed by SEM and AFM. Composition and microstructure of the DLC film were characterized by the Raman spectroscopy and XPS, repectively. The optical properties of DLC film were investigated by the N&K analyzer. From the AFM results, the surface morphology observed by KOH etching on the surface of silicon substrates during etching time as 0¡B20¡B40¡B60 min, the surface roughness increased from 2.64 to 14.07 nm. Based on thevariation of surface roughness, the growth rate was observed more quicker than the non etch surface. Moreover, to deposit the DLC film on the alkalinity solution was better then acid solution. However, the ID/IG ratio and the sp2/sp3 ratio obtained from Raman and XPS increase with the roughness surface from 1.09 to 1.82 and 0.985 to 2.15, respectively. It is because that the microstructure of DLC film varies and exchange to graphitization. The mixed the ammonia water and ammonium acetate into acetic acid solution was used to deposit DLC film on Si surface, and film shows with lower ID/IG ratio. Additionally, as the amount of ammonium acetate was varied in the solution, the ID/IG ratio of the films observed as decrease from 1.2 to 0.93 with increasing amount of ammonium acetate 10g to 40g. It was due to the methyl radicals increase in the solution. Besides, we can find the optical band gap decreased with DLC films changing to graphitization.

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Made available in DSpace on 2014-12-17T15:15:02Z (GMT). No. of bitstreams: 1 FranciscoOA.pdf: 1713095 bytes, checksum: 1ee138883bf7b4da570838f6654b21b0 (MD5) Previous issue date: 2006-12-15 / Conselho Nacional de Desenvolvimento Cient?fico e Tecnol?gico / In the present work we use a plasma jet system with a hollow cathode to deposit thin TiO2 films on silicon substrates as alternative at sol-gel, PECVD, dip-coating e magnetron sputtering techniques. The cylindrical cathode, made from pure titanium, can be negatively polarized between 0 e 1200 V and supports an electrical current of up to 1 A. An Ar/O2 mixture, with a total flux of 20 sccm and an O2 percentage ranging between 0 and 30%, is passed through a cylindrical hole machined in the cathode. The plasma parameters and your influence on the properties of deposited TiO2 films and their deposition rate was studied. When discharge occurs, titanium atoms are sputtered/evaporated. They are transported by the jet and deposited on the Si substrates located on the substrate holder facing the plasma jet system at a distance ranging between10 and 50 mm from the cathode. The working pressure was 10-3 mbar and the deposition time was 10 -60 min. Deposited films were characterized by scanning electron microscopy and atomic force microscopy to check the film uniformity and morphology and by X-ray diffraction to analyze qualitatively the phases present. Also it is presented the new dispositive denominate ionizing cage, derived from the active screen plasma nitriding (ASPN), but based in hollow cathode effect, recently developed. In this process, the sample was involved in a cage, in which the cathodic potential was applied. The samples were placed on an insulator substrate holder, remaining in a floating potential, and then it was treated in reactive plasma in hollow cathode regime. Moreover, the edge effect was completely eliminated, since the plasma was formed on the cage and not directly onto the samples and uniformity layer was getting in all sampl / Filmes finos de TiO2 foram depositados sobre substrato de sil?cio usando descarga em c?todo oco. A presente t?cnica foi usada como alternativa a outras t?cnicas como solgel, PECVD, dip-coating e magnetron sputtering. O sistema desenvolvido apresenta uma configura??o de c?todo oco cil?ndrico polarizado com tens?o DC variando entre 0 e 1200V e corrente de at? 1 A. Um jato de plasma de Ar + O2, extrai ?tomos do mesmo, que s?o em seguida depositados sobre um substrato frontalmente posicionado. As amostras s?o posicionadas a dist?ncias do c?todo variando entre 10 e 50 mm. Foram investigadas os par?metros do plasma e sua influ?ncia sobre as propriedades dos filmes depositados. Os par?metros de trabalho para deposi??o de TiO2 foram 20sccm de fluxo da mistura Ar/O2 com percentuais de oxig?nio variando entre 0 -30%, press?o de trabalho 10-3 mbar e tempos de deposi??o de 10 -60 minutos. As amostras foram caracterizadas por microscopia eletr?nica de varredura e microscopia de for?a at?mica para verificar sua uniformidade e morfologia e por difra??o de raios-x para an?lise qualitativa das fases presentes nos filmes. Neste trabalho tamb?m ? apresentado um novo dispositivo, denominado gaiola ionizante, derivada da nitreta??o a plasma em tela ativa (ASPN), mas baseado no efeito de c?todo oco, recentemente desenvolvido. Neste processo as amostras s?o envolvidas por uma gaiola, na qual ? aplicada a diferen?a de potencial, permanecendo em potencial flutuante, sendo tratadas numa regi?o livre da influ?ncia do campo el?trico por um plasma reativo, operando em regime de c?todo oco. Dessa forma foram obtidas camadas uniformes em todas as amostras e eliminados defeitos como o efeito de borda

Thema dieser Arbeit ist die Synthese von GaAs Nanodrähten mittels Molekularstrahlepitaxie. Dabei wird das Wachstum mittels Au- und jenes mittels selbst-induziertem VLS-Mechanismus verglichen. Die Au-induzierte Methode ist als vielseitiger Ansatz für die Herstellung von Nanodrähten bekannt. Darüberhinaus wird seit Neuerem der selbst-induzierte Mechanismus untersucht, bei dem Galliumtropfen die Rolle des Goldes übernehmen, um eine etwaige Verunreinigung mit Au von vornherein auszuschliessen. Mit beiden Wachstumsmethoden erzielen wir GaAs Nanodrähte mit großem Aspektverhältnis und epitaktischer Beziehung zum Si(111) Substrat. Während des Au-induzierten Wachstums entsteht eine parasitäre Schicht zwischen den Drähten, die mittels des selbst-induzierten Mechanismus vermieden werden. Alle GaAs Drähte sind vollständig relaxiert. Die durch die Gitterfehlanpassung (4,1\% zwischen GaAs und Si) verursachte Verspannung wird durch Versetzungen an der Grenzfläche abgebaut. Selbst-induzierte Drähten zeigen ausschließlich unpolare Seitenfacetten, während verschiedene polare Facetten für Au-induzierte Nanodrähte beschrieben werden. Mittels VLS-Nukleationstheorie könnne wir den Einfluss des Tropfenmaterials auf die Stabilität der verschiedenen Seitenfacetten erklären. Optoelektronische Anwendungen benötigen lange Minoritätsladungsträgerlebensdauern bei Raumtemperatur. Daher wurden mit (Al,Ga)As Hüllen ummantelte GaAs Nanodrähte mittels zeitaufgelöster PL vermessen. Das Ergebnis sind 2,5 ns für die selbst-induzierten aber nur 9 ps für die Au-induzierten Nanodrähte. Durch temperaturabhängige PL Messungen kann eine charakteristische Aktivierungsenergie von 77 meV nachgewiesen werden, die nur in den Au-induzierten Nanodrähten vorliegt. Dies suggeriert, dass sich Au aus den Tröpfchen in die GaAs Nanodrähte einbaut und dort als tiefes, nichtstrahlendes Rekombinationszentrum fungiert. / In this work the synthesis of GaAs nanowires by molecular beam epitaxy (MBE) using the vapour-liquid-solid (VLS) mechanism is investigated. A comparison between Au- and self-assisted VLS growth is at the centre of this thesis. While the Au-assisted method is established as a versatile tool for nanowire growth, the recently developed self-assisted variation results from the exchange of Au by Ga droplets and thus eliminates any possibility of Au incorporation. By both methods, we achieve nanowires with epitaxial alignment to the Si(111) substrates. Caused by differences during nanowire nucleation, a parasitic planar layer grows between the nanowires by the Au-assisted method, but can be avoided by the self-assisted method. Au-assisted nanowires grow predominantly in the metastable wurtzite crystal structure, while their self-assisted counterparts have the zincblende structure. All GaAs nanowires are fully relaxed and the strain arising from the lattice mismatch between GaAs and Si of 4.1\% is accommodated by misfit dislocations at the interface. Self-assisted GaAs nanowires are generally found to have vertical and non-polar side facets, while tilted and polar nanofacets were described for Au-assisted GaAs nanowires. We employ VLS nucleation theory to understand the effect of the droplet material on the lateral facets. Optoelectronic applications require long minority carrier lifetimes at room temperature. We fabricate GaAs/(Al,Ga)As core-shell nanowires and analyse them by transient photoluminescence (PL) spectroscopy. The results are 2.5 ns for the self-assisted nanowires as well as 9 ps for the Au-assisted nanowires. By temperature-dependent PL measurements we find a characteristic activation energy of 77 meV that is present only in the Au-assisted nanowires. We conclude that most likely Au is incorporated from the droplets into the GaAs nanowires and acts as a deep, non-radiative recombination centre.

The present work focuses on the growth and characterizations of GaN and InN layers and nanostructures on p-Si(100) and p-Si(111) substrates by plasma-assisted molecular beam epitaxy and the studies of GaN/p-Si and InN/p-Si heterojunctions properties. The thesis is divided in to seven different chapters. Chapter 1 gives a brief introduction on III-nitride materials, growth systems, substrates, possible device applications and technical background. Chapter 2 deals with experimental techniques including the details of PAMBE system used in the present work and characterization tools for III-nitride epitaxial layers as well as nanostructures. Chapter 3 involves the growth of GaN films on p-Si(100) and p-Si(111) substrates. Phase pure wurtzite GaN films are grown on Si (100) substrates by introducing a silicon nitride layer followed by low temperature GaN growth as buffer layers. GaN films grown directly on Si (100) are found to be phase mixtured, containing both cubic and hexagonal modifications. The x-ray diffraction (XRD), scanning electron microscopy (SEM), photoluminescence (PL) spectroscopy studies reveal that the significant enhancement in the structural and optical properties of GaN films grown with silicon nitride buffer layer grown at 800 oC, when compared to the samples grown in the absence of silicon nitride buffer layer and with silicon nitride buffer layer grown at 600 oC. Core-level photoelectron spectroscopy of SixNy layers reveals the sources for superior qualities of GaN epilayers grown with the high temperature substrate nitridation process. The discussion has been carried out on the typical inverted rectification behavior exhibited by n-GaN/p-Si heterojunctions. Considerable modulation in the transport mechanism is observed with the nitridation conditions. The heterojunction fabricated with the sample of substrate nitridation at high temperature exhibites superior rectifying nature with reduced trap concentrations. Lowest ideality factors (~1.5) are observed in the heterojunctions grown with high temperature substrate nitridation which is attributed to the recombination tunneling at the space charge region transport mechanism at lower voltages and at higher voltages space charge limited current conduction is the dominating transport mechanism. Whereas, thermally generated carrier tunneling and recombination tunneling are the dominating transport mechanisms in the heterojunctions grown without substrate nitridation and low temperature substrate nitridation, respectively. A brief comparison of the structural, optical and heterojunction properties of GaN grown on Si(100) and Si(111) has been carried out. Chapter 4 involves the growth and characterizations of InN nanostructures and thinfilms on p-Si(100) and p-Si(111) substrates. InN QDs are grown on Si(100) at different densities. The PL characteristics of InN QDs are studied. A deterioration process of InN QDs, caused by the oxygen incorporation into the InN lattice and formation of In2O3/InN composite structures was established from the results of TEM, XPS and PL studies. The results confirm the partial oxidation of the outer shell of the InN QDs, while the inner core of the QDs remains unoxidized. InN nanorods are grown on p-Si(100), structural characterizations are carried out by SEM, and TEM. InN nanodots are grown on p-Si(100), structural characterizations are performed. InN films were grown on Si(100) and Si(111) substrates and structural characterizations are carried out. Chapter 5 deals with the the heterojunction properties of InN/p-Si(100) and InN/p-Si(111).The transport behavior of the InN NDs/p-Si(100) diodes is studied at various bias voltages and temperatures. The temperature dependent ZB BH and ideality factors of the forward I-V data are observed, while it is governed through the modified Richardson’s plot. The difference in FB BH and C-V BH and the deviation of ideality factor from unity indicate the presence of inhomogeneities at the interface. The band offsets derived from C-V measurements are found to be Δ EC=1.8 eV and Δ EV =1.3 eV, which are in close agreement with Anderson’s model. The band offsets of InN/p-Si heterojunctions are estimated using XPS data. A type-III band alignment with a valence band offset of Δ EV =1.39 eV and conduction band offset of ΔEC=1.81 eV is identified. The charge neutrality level model provides a reasonable description of the band alignment of the InN/p-Si interface. The interface dipole deduced by comparison with the electron affinity model is 0.06 eV. The transport studies of InN NR/p-Si(100) heterojunctions have been carried out by conductive atomic force microscopy (CAFM) as well as conventional large area contacts. Discussion of the electrical properties has been carried out based on local current-voltage (I-V) curves, as well as on the 2D conductance maps. The comparative studies on transport properties of diodes fabricated with InN NRs and NDs grown on p-Si(100) substrates and InN thin films grown on p-Si(111) substrates have also been carried out. Chapter 6 deals with the growth and characterizations of InN/GaN heterostructures on p-Si(100) and p-Si(111) substarets and also on the InN/GaN/p-Si heterojunction properties. The X-ray diffraction (XRD), scanning electron microscopy (SEM) studies reveal a considerable variation in crystalline quality of InN with grown parameters. Deterioration in the rectifying nature is observed in the case of InN/GaN/p-Si(100) heterojunction substrate when compared to InN/GaN/p-Si (111) due to the defect mediated tunneling effect, caused by the high defect concentration in the GaN and InN films grown on Si(100) and also due to the trap centers exist in the interfaces. Reduction in ideality factor is also observed in the case of n-InN/n-GaN/p–Si(111) when compared to n-InN/n-GaN/p–Si(100) heterojunction. The sum of the ideality factors of individual diodes is consistent with experimentally observed high ideality factors of n-InN/n-GaN/p–Si double heterojunctions due to double rectifying heterojunctions and metal semiconductor junctions. Variation of effective barrier heights and ideality factors with temperature are confirmed, which indicate the inhomogeneity in barrier height, might be due to various types of defects present at the GaN/Si and InN/GaN interfaces. The dependence of forward currents on both the voltage and temperatures are explained by multi step tunneling model and the activation energis were estimated to be 25meV and 100meV for n-InN/n-GaN/p–Si(100) and n-InN/n-GaN/p–Si(111) heterojunctions, respectively. Chapter 7 gives the summary of the present study and also discusses about future research directions in this area.