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Characterization of lead-free solders for electronic packagingMa, Hongtao, Johnson, R. Wayne, Suhling, J. C. January 2007 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references.
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Mechanical properties and microstructure invesitigation of SN-AG-CU lead free solder for electronic package applicationsWang, Qing, Johnson, R. Wayne, Gale, W. F. January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
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PBGA reliability of lead free solder balls assembled with tin lead solder paste for harsh environment electronicsMitchell, Charles Clayton, January 2006 (has links) (PDF)
Thesis(M.S.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references.
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Monitoring and control system for hot air solder leveling process /Schuh, Amy Jeanne, January 1991 (has links)
Report (M.S.)--Virginia Polytechnic Institute and State University. M.S. 1991. / Vita. Abstract. Includes bibliographical references (leaf 105). Also available via the Internet.
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Development of convective reflow-projection moire warpage measurement system and prediction of solder bump reliability on board assemblies affected by warpageTan, Wei. January 2008 (has links)
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Dr. Ume, I. Charles; Committee Member: Dr. Book, Wayne; Committee Member: Dr. Kim, Yeong; Committee Member: Dr. Pan, Jiahui; Committee Member: Dr. Sitaraman, Suresh; Committee Member: Dr. Wu, C. F. Jeff.
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Soldering in magnesium high pressure die casting and its preservation by surface engineeringTang, Caixian. January 2007 (has links)
Thesis (PhD) - Swinburne University of Technology, Industrial Research Institute Swinburne - 2007. / [A thesis submitted] for the degree of Doctor of Philosophy, Industrial Research Institute, Swinburne University of Technology - 2007. Typescript. Includes bibliographical references (p. 154-167).
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Prognostics health management and damage relationships of lead-free components in thermal cycling harsh environmentsMadhura Hande, Handattu, Lall, Pradeep, January 2008 (has links)
Thesis--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (leaves 159-167).
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Heterogeneous nucleation of Sn in Sn-Ag-Cu solder jointsBenedict, Michael Scott. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Program of Materials Science and Engineering, 2007. / Includes bibliographical references.
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Drop impact reliability testing lead-free chip scale packages : a thesis /Farris, Andrew. Liddicoat, Albert A. January 2008 (has links)
Thesis (M.S.)--California Polytechnic State University, 2008. / Major professor: Albert Liddicoat, Ph.D. "Presented to the faculty of California Polytechnic State University, San Luis Obispo." "In partial fulfillment of the requirements for the degree [of] Master of Science in Electrical Engineering." "June 2008." Includes bibliographical references (leaves 70-73). Also available online. Also available on microfiche (2 sheets).
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Viscoelastic stress analysis and fatigue life prediction of a flip-chip-on-board electronic package /Koeneman, Paul Bryant, January 1999 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 1999. / Vita. Includes bibliographical references (leaves 110-112). Available also in a digital version from Dissertation Abstracts.
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