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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

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Showing 71 to 80 of 225 (0.077 seconds)

Spelling suggestions: "subject:"solder)""

71

Characterization of lead-free solders for electronic packaging

Ma, Hongtao, Johnson, R. Wayne, Suhling, J. C. January 2007 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references.
72

Mechanical properties and microstructure invesitigation of SN-AG-CU lead free solder for electronic package applications

Wang, Qing, Johnson, R. Wayne, Gale, W. F. January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
73

PBGA reliability of lead free solder balls assembled with tin lead solder paste for harsh environment electronics

Mitchell, Charles Clayton, January 2006 (has links) (PDF)
Thesis(M.S.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references.
74

Monitoring and control system for hot air solder leveling process /

Schuh, Amy Jeanne, January 1991 (has links)
Report (M.S.)--Virginia Polytechnic Institute and State University. M.S. 1991. / Vita. Abstract. Includes bibliographical references (leaf 105). Also available via the Internet.
75

Development of convective reflow-projection moire warpage measurement system and prediction of solder bump reliability on board assemblies affected by warpage

Tan, Wei. January 2008 (has links)
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Dr. Ume, I. Charles; Committee Member: Dr. Book, Wayne; Committee Member: Dr. Kim, Yeong; Committee Member: Dr. Pan, Jiahui; Committee Member: Dr. Sitaraman, Suresh; Committee Member: Dr. Wu, C. F. Jeff.
76

Soldering in magnesium high pressure die casting and its preservation by surface engineering

Tang, Caixian. January 2007 (has links)
Thesis (PhD) - Swinburne University of Technology, Industrial Research Institute Swinburne - 2007. / [A thesis submitted] for the degree of Doctor of Philosophy, Industrial Research Institute, Swinburne University of Technology - 2007. Typescript. Includes bibliographical references (p. 154-167).
77

Prognostics health management and damage relationships of lead-free components in thermal cycling harsh environments

Madhura Hande, Handattu, Lall, Pradeep, January 2008 (has links)
Thesis--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (leaves 159-167).
78

Heterogeneous nucleation of Sn in Sn-Ag-Cu solder joints

Benedict, Michael Scott. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Program of Materials Science and Engineering, 2007. / Includes bibliographical references.
79

Drop impact reliability testing lead-free chip scale packages : a thesis /

Farris, Andrew. Liddicoat, Albert A. January 2008 (has links)
Thesis (M.S.)--California Polytechnic State University, 2008. / Major professor: Albert Liddicoat, Ph.D. "Presented to the faculty of California Polytechnic State University, San Luis Obispo." "In partial fulfillment of the requirements for the degree [of] Master of Science in Electrical Engineering." "June 2008." Includes bibliographical references (leaves 70-73). Also available online. Also available on microfiche (2 sheets).
80

Viscoelastic stress analysis and fatigue life prediction of a flip-chip-on-board electronic package /

Koeneman, Paul Bryant, January 1999 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 1999. / Vita. Includes bibliographical references (leaves 110-112). Available also in a digital version from Dissertation Abstracts.

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