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Kinetics of intermetallic growth at the interfaces of soldered metallizationsZribi, Anis B. January 2002 (has links) (PDF)
Thesis (Ph.D.)--State University of New York at Binghamton, 2002. / Adviser: Eric J. Cotts. Includes bibliographical references.
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Förstudie för automatisering av manuell lödningSchentz, Kristian January 2010 (has links)
This degree project has been carried out in cooperation with Enertech AB in Ljungby and is pilot study to automating all current manual soldering. The soldering process accounts for a large part of the processing cost in the production of a heat pump. The process is also a quality risk and has a major impact on the lifetime of the final product. The Main task of this project has been to evaluate automation of the soldering process, to develop automation solutions and a principle layout, to draw the design changes required for the automation and to calculate the supposed solution. This pilot study has resulted in a suggested automation solution using laser as a heat source for soldering. Calculations of the solution show that a automating a laser soldering cell is very profitable.
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Principal component regression models for thermo-mechanical reliability of plastic ball grid arrays on CU-core and no CU-core PCB assemblies in harsh environmentsShirgaokar, Aniket, Lall, Pradeep. January 2009 (has links)
Thesis--Auburn University, 2009. / Abstract. Vita. Includes bibliographic references (p.80-97).
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Development of laser ultrasonic and interferometric inspection system for high-volume on-line inspection of microelectronic devicesValdes, Abel. January 2009 (has links)
Thesis (M. S.)--Mechanical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Ume, I. Charles; Committee Member: Kalaitzidou, Kyriaki; Committee Member: Mayor, J. Rhett. Part of the SMARTech Electronic Thesis and Dissertation Collection.
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Implementation and qualification of a prototype tester for reflow soldering process compatability evaluation of surface mount technology componentsWong, Anthony Yin-bong 23 June 2011 (has links)
Not available / text
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Fundamentals of area array solder interconnect yieldKim, Chunho 12 1900 (has links)
No description available.
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Thermo-mechanical reliability of the VSPA package solder jointsMurphy, R. Sean 12 1900 (has links)
No description available.
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Thermal cycling and rate-dependent stress relaxation behavior of soldersWoodmansee, Michael W. 08 1900 (has links)
No description available.
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Design and implementation of an automated solder joint inspection systemErdahl, Dathan S. (Dathan Shane) 12 1900 (has links)
No description available.
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Analysis of lead free tin-silver-copper and tin-lead solder wetting reactionsAnson, Scott J. January 2007 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Dept. of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
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