Global ETD Search

61	Kinetics of intermetallic growth at the interfaces of soldered metallizations Zribi, Anis B. January 2002 (has links) (PDF) Thesis (Ph.D.)--State University of New York at Binghamton, 2002. / Adviser: Eric J. Cotts. Includes bibliographical references.
62	Förstudie för automatisering av manuell lödning Schentz, Kristian January 2010 (has links) This degree project has been carried out in cooperation with Enertech AB in Ljungby and is pilot study to automating all current manual soldering. The soldering process accounts for a large part of the processing cost in the production of a heat pump. The process is also a quality risk and has a major impact on the lifetime of the final product. The Main task of this project has been to evaluate automation of the soldering process, to develop automation solutions and a principle layout, to draw the design changes required for the automation and to calculate the supposed solution. This pilot study has resulted in a suggested automation solution using laser as a heat source for soldering. Calculations of the solution show that a automating a laser soldering cell is very profitable. Laser soldering laserlödning produktionsutveckling lödning laser induktionslödning lasersvetsning ctc robot
63	Principal component regression models for thermo-mechanical reliability of plastic ball grid arrays on CU-core and no CU-core PCB assemblies in harsh environments Shirgaokar, Aniket, Lall, Pradeep. January 2009 (has links) Thesis--Auburn University, 2009. / Abstract. Vita. Includes bibliographic references (p.80-97).
64	Development of laser ultrasonic and interferometric inspection system for high-volume on-line inspection of microelectronic devices Valdes, Abel. January 2009 (has links) Thesis (M. S.)--Mechanical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Ume, I. Charles; Committee Member: Kalaitzidou, Kyriaki; Committee Member: Mayor, J. Rhett. Part of the SMARTech Electronic Thesis and Dissertation Collection.
65	Implementation and qualification of a prototype tester for reflow soldering process compatability evaluation of surface mount technology components Wong, Anthony Yin-bong 23 June 2011 (has links) Not available / text Surface mount technology Solder and soldering
66	Fundamentals of area array solder interconnect yield Kim, Chunho 12 1900 (has links) No description available. Solder and soldering Electronic packaging Materials
67	Thermo-mechanical reliability of the VSPA package solder joints Murphy, R. Sean 12 1900 (has links) No description available. Solder and soldering Testing Electronic packaging Reliability Electronic packaging Testing
68	Thermal cycling and rate-dependent stress relaxation behavior of solders Woodmansee, Michael W. 08 1900 (has links) No description available. Deformations (Mechanics) Solder and soldering Testing Materials Mechanical properties
69	Design and implementation of an automated solder joint inspection system Erdahl, Dathan S. (Dathan Shane) 12 1900 (has links) No description available. Microelectronic packaging Reliability Solderand soldering Testing Laser interferometers
70	Analysis of lead free tin-silver-copper and tin-lead solder wetting reactions Anson, Scott J. January 2007 (has links) Thesis (Ph. D.)--State University of New York at Binghamton, Dept. of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.

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