Thesis (Ph. D.)--University of Texas at Austin, 2007. / Vita. Includes bibliographical references.

Thesis (Ph.D.)--Lehigh University, 1994. / Adviser: Michael R. Notis. Includes bibliographical references.

The systems engineering approach was used to implement conformal solder mask in the manufacture of printed wiring boards (PWBs) at the AT&T Microelectronics Richmond Plant. Existing solder mask had a planar surface causing low soldering process yields on PWBs using Surface Mount Technology (SMT). SMT reduced product cost by allowing 50% more components per unit area of a PWB. Conformal solder mask processing reduced the mask thickness applied, and allowed future SMT PWBs to be manufactured. Coating methods to apply solder mask were evaluated. Two methods, curtain coating and electrostatic spray (ESS) f were chosen since no method satisfied all operational requirements. Ciba Geigy's Probimer process was implemented to meet short term revenue and capacity requirements. Probimer was an industry standard but had performance limitations. ESS met all requirements but required additional development to select a solder mask material and obtain customer approval. / Master of Science

No description available.

This diploma thesis deals with the soldering process in manufacturing instrument transformers. It summarizes the knowledge of soldering process, lead-free alloys and test methods selected solder joint. In the practical part is the analysis the manufacturing process in terms of soldering operations, testing of selected lead-free alloys, which are considered as a replacement for lead-based alloy - now used in the manufacturing process. The conclusion is optimized manufacturing process to reduce operating costs and improve quality.

The theoretical part of dissertation is devoted to familiarization with the process of assembly and soldering of PCBs. There are described the selected types of lead-free solder paste, the various procedures of flux deposition, where the greater part is focuses to the printing through template. Also, I analyze the different procedures shouldering and soldering. I focused mainly on the mechanical mounting of SMD components soldering with help convection reflow and soldering in the vapor. In the practical part is described the design of the test PCB, methodology of assembly PCB and soldering various technologies with predefined settings. The analysis of the results is done by a non-destructive x-ray method and destructive micro-cut method. The x-ray method detects the position and size of the voids in the solder. This information is used for faster processing of micro-cut. The micro-cut method is included in the analysis for a more detailed examination of the solder joint. At the end of the thesis, there is a summary of the recommendation that the setting of the manufacturing process increases the quality of the brazed joint.

Approved for public release; distribution is unlimited / Solder joints provide both electrical and mechanical interconnections between a silicon chip and the packaging substrate in an electronic application. The thermomechanical cycling (TMC) in the solder due to the mismatch of the coefficient of thermal expansion (CTE) between the silicon chip and the substrate causes numerous reliability challenges. This situation is aggravated by the ongoing transition to lead-free solders worldwide, and the trend towards larger, hotter-running chips. Therefore, improved solder joints, with higher resistance to creep and low-cycle fatigue, are necessary for future generations of microelectronics. This study reports in the development a process to fabricate solder joints with a fine distribution of shape memory alloys (SMA) NiTi particulates. The microstructure and interface zone of the as-reflowed solder-SMA composite has been characterized. / Lieutenant, United States Navy

by Chow Yeung Ming = 化學鍍鎳層的表面性質與焊接能力之關係 / 周洋明. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2000. / Includes bibliographical references (leaves 62-65). / Text in English; abstracts in English and Chinese. / by Chow Yeung Ming = Hua xue du nie ceng de biao mian xing zhi yu han jie neng li zhi guan xi / Zhou Yangming. / Abstract --- p.i / 論文摘要 --- p.ii / Acknowledgements --- p.iii / Table of Contents --- p.v / List of Figures --- p.viii / List of Tables --- p.ix / Abbreviations --- p.x / Chapter Chapter 1 --- INTRODUCTION / Chapter 1.1 --- Electroless Plating (Autocatalytic Deposition) --- p.1 / Chapter 1.2 --- Electroless Nickel (EN) Plating --- p.2 / Chapter 1.3 --- Types of Electroless Nickel Deposits --- p.2 / Chapter 1.4 --- Properties of Electroless Nickel --- p.5 / Chapter 1.5 --- Applications of Electroless Nickel in Electronic Packaging Industry --- p.7 / Chapter 1.6 --- Importance of Solderability --- p.8 / Chapter 1.7 --- Literature Review of Solderability Studies of Electroless Nickel --- p.9 / Chapter 1.8 --- Motivations & Aims of Studies --- p.10 / Chapter Chapter 2 --- EXPERIMENTAL & INSTRUMENTATION / Chapter 2.1 --- Electroless Nickel Plating --- p.11 / Chapter 2.2 --- Solderability Measurements / Chapter 2.2.1 --- Soldering --- p.13 / Chapter 2.2.2 --- Various test methods for solderability --- p.13 / Chapter 2.2.3 --- Wetting balance method --- p.15 / Chapter 2.2.4 --- Solderability measurements of electroless nickel deposits --- p.17 / Chapter 2.2.5 --- Assessment of wetting curves --- p.19 / Chapter 2.3 --- Surface Oxidation Studies / Chapter 2.3.1 --- Use of X-ray photoelectron spectroscopy (XPS) in surface characterization --- p.19 / Chapter 2.3.2 --- XPS system --- p.22 / Chapter 2.3.3 --- Surface composition of electroless nickel deposits --- p.22 / Chapter 2.3.4 --- Oxide thickness characterization by angle-resolved XPS --- p.25 / Chapter 2.3.5 --- Oxide thickness characterization by XPS depth profiling with low-energy-ion sputtering --- p.28 / Chapter 2.4 --- Surface Morphology Studies / Chapter 2.4.1 --- Surface morphology studies by scanning Auger electron microscopy (SAM) & atomic force microscopy (AFM) --- p.28 / Chapter 2.4.2 --- SAM studies of electroless nickel surfaces --- p.29 / Chapter 2.4.3 --- AFM studies of electroless nickel surfaces --- p.29 / Chapter 2.5 --- Oxide Quality Studies --- p.31 / Chapter Chapter 3 --- RESULTS & DISCUSSIONS / Chapter 3.1 --- Solderability Measurements by the Wetting Balance Method --- p.33 / Chapter 3.2 --- Surface Oxidation Studies / Chapter 3.2.1 --- Surface composition of electroless nickel deposits --- p.36 / Chapter 3.2.2 --- Oxide thickness characterization by angle-resolved XPS --- p.38 / Chapter 3.2.3 --- Oxide thickness characterization by XPS depth profiling with low-energy-ion sputtering --- p.44 / Chapter 3.2.4 --- Conclusion --- p.47 / Chapter 3.3 --- Surface Morphology Studies / Chapter 3.3.1 --- SAM studies of electroless nickel surfaces --- p.49 / Chapter 3.3.2 --- AFM studies of electroless nickel surface --- p.49 / Chapter 3.3.3 --- Conclusion --- p.53 / Chapter 3.4 --- Interpretation of Wetting Kinetics of Electroless Nickel --- p.54 / Chapter Chapter 4 --- CONCLUSIONS & FURTHER STUDIES / Chapter 4.1 --- Conclusions --- p.59 / Chapter 4.2 --- Further Studies --- p.60 / Appendix --- p.61 / References --- p.62

Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2006. / Includes bibliographical references.

<p>This degree project has been carried out in cooperation with Enertech AB in Ljungby and is pilot study to automating all current manual soldering. The soldering process accounts for a large part of the processing cost in the production of a heat pump. The process is also a quality risk and has a major impact on the lifetime of the final product.</p><p>The Main task of this project has been to evaluate automation of the soldering process, to develop automation solutions and a principle layout, to draw the design changes required for the automation and to calculate the supposed solution.</p><p>This pilot study has resulted in a suggested automation solution using laser as a heat source for soldering. Calculations of the solution show that a automating a laser soldering cell is very profitable.</p>