Global ETD Search

41	Observation and modeling of heterogeneous microstructural evolution in Sn-Pb solder Woodmansee, Michael W. 08 1900 (has links) No description available. Solder and soldering
42	Flip chip processing of lead-free solders and halogen-free high density microvia substrates Baynham, Grant Andrew 05 1900 (has links) No description available. Microelectronic packaging Materials Solder and soldering Green technology
43	Effect of Cu concentration and cooling rate on microstructure of Sn-3.9Ag-XCu Athavale, Saurabh. January 2006 (has links) Thesis (M.S.M.E.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science, 2006. / Includes bibliographical references.
44	Numerical prediction and experimental validation of flip chip solder joint geometry for MEMS applications / Lo, Chi Chuen. January 2008 (has links) Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2008. / Includes bibliographical references (leaves 149-158). Also available in electronic version.
45	Application of artificial neural networks to predict defect levels in wave soldering processes Samant, Purnanand G. January 2007 (has links) Thesis (M.S.)--State University of New York at Binghamton, Dept. of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
46	Experimental and numerical study of solder ball joints' reliability at package level & board level / Xu, Zhengjian. January 2009 (has links) Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2009. / Includes bibliographical references (leaves 99-110).
47	Testing methodology for reflow soldering process : compatibility evaluation of surface mount technology / Guo, Weiqing, January 2001 (has links) Thesis (Ph. D.)--University of Texas at Austin, 2001. / Vita. Includes bibliographical references (leaf 235). Available also in a digital version from Dissertation Abstracts.
48	Quality inspection and reliability study of solder bumps in packaged electronic devices [electronic resource] : using laser ultrasound and finite element methods Yang, Jin. January 2008 (has links) Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Ume, I. Charles; Committee Member: Danyluk, Steven; Committee Member: Goyal, Deepak; Committee Member: Lu, Jye-Chyi(JC); Committee Member: Michaels, Thomas; Committee Member: Sitaraman, Suresh. Part of the SMARTech Electronic Thesis and Dissertation Collection.
49	Soldering in high pressure die casting (HPDC) performance evaluation and characterisation of physical vapour deposition (PVD) coatings / Gulizia, Stefan. January 2008 (has links) Thesis (MEng) - School of Engineering and Science, Swinburne University of Technology, 2008. / Thesis submitted for the degree of Master of Engineering, School of Engineering and Science, Swinburne University of Technology, 2008. Typescript. Includes bibliographical references (p. 98-101).
50	Experimental study of void formation in solder joints of flip-chip assemblies Wang, Daijiao, Panton, Ronald L. January 2005 (has links) (PDF) Thesis (Ph. D.)--University of Texas at Austin, 2005. / Supervisor: Ronald L. Panton. Vita. Includes bibliographical references.

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