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Observation and modeling of heterogeneous microstructural evolution in Sn-Pb solderWoodmansee, Michael W. 08 1900 (has links)
No description available.
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Flip chip processing of lead-free solders and halogen-free high density microvia substratesBaynham, Grant Andrew 05 1900 (has links)
No description available.
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Effect of Cu concentration and cooling rate on microstructure of Sn-3.9Ag-XCuAthavale, Saurabh. January 2006 (has links)
Thesis (M.S.M.E.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science, 2006. / Includes bibliographical references.
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Numerical prediction and experimental validation of flip chip solder joint geometry for MEMS applications /Lo, Chi Chuen. January 2008 (has links)
Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2008. / Includes bibliographical references (leaves 149-158). Also available in electronic version.
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Application of artificial neural networks to predict defect levels in wave soldering processesSamant, Purnanand G. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Dept. of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
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Experimental and numerical study of solder ball joints' reliability at package level & board level /Xu, Zhengjian. January 2009 (has links)
Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2009. / Includes bibliographical references (leaves 99-110).
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Testing methodology for reflow soldering process : compatibility evaluation of surface mount technology /Guo, Weiqing, January 2001 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 2001. / Vita. Includes bibliographical references (leaf 235). Available also in a digital version from Dissertation Abstracts.
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Quality inspection and reliability study of solder bumps in packaged electronic devices [electronic resource] : using laser ultrasound and finite element methodsYang, Jin. January 2008 (has links)
Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Ume, I. Charles; Committee Member: Danyluk, Steven; Committee Member: Goyal, Deepak; Committee Member: Lu, Jye-Chyi(JC); Committee Member: Michaels, Thomas; Committee Member: Sitaraman, Suresh. Part of the SMARTech Electronic Thesis and Dissertation Collection.
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Soldering in high pressure die casting (HPDC) performance evaluation and characterisation of physical vapour deposition (PVD) coatings /Gulizia, Stefan. January 2008 (has links)
Thesis (MEng) - School of Engineering and Science, Swinburne University of Technology, 2008. / Thesis submitted for the degree of Master of Engineering, School of Engineering and Science, Swinburne University of Technology, 2008. Typescript. Includes bibliographical references (p. 98-101).
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Experimental study of void formation in solder joints of flip-chip assembliesWang, Daijiao, Panton, Ronald L. January 2005 (has links) (PDF)
Thesis (Ph. D.)--University of Texas at Austin, 2005. / Supervisor: Ronald L. Panton. Vita. Includes bibliographical references.
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