Global ETD Search

11	Comparison of thermal fatigue reliability between SAC and SnPb solders under various stress range conditions / Yang, Chaoran. January 2009 (has links) Includes bibliographical references (p. 80-84).
12	Role of intermetallics for both tin-lead and lead free solder structures and its solder pad combination Iyer, Ganesh R. January 2005 (has links) Thesis (M.S.)--State University of New York at Binghamton, Mechanical Engineering Dept., 2005. / Includes bibliographical references.
13	A Study of the Processing Properties of Hard-Particle Reinforced Composite Solders Calderon, Jose Guadalupe 05 1900 (has links) The microstructural, mechanical and thermal properties of various composite solder formulations were investigated. Special interest was given in observing the processing properties, microstructural characteristics, fatigue behavior, tensile strength, and the effect of environmental ageing on the composite solder formulations. The solderability parameters wetting and speed of soldering, reflow temperature, and the thermal stability of the resulting composite solder were also examined. solder chemistry Solder and soldering.
14	Tensile strength comparison between presoldered and postsoldered joints a thesis submitted in partial fulfillment ... restorative dentistry ... / Monday, J. J. Luc. January 1981 (has links) Thesis (M.S.)--University of Michigan, 1981.
15	Micro impact fatigue testing of solder joints Guruprasad, Pradosh. January 2008 (has links) Thesis (M.S.)--State University of New York at Binghamton, Materials Science and Engineering Program, 2008. / Includes bibliographical references.
16	Tensile strength comparison between presoldered and postsoldered joints a thesis submitted in partial fulfillment ... restorative dentistry ... / Monday, J. J. Luc. January 1981 (has links) Thesis (M.S.)--University of Michigan, 1981.
17	Prediction and Reduction of Die Soldering. Hogan, Patrick Alan 30 April 2008 (has links) Die Soldering occurs in aluminum permanent mold casting when the cast metal bonds with the die surface and remains stuck upon ejection of the part. Eventually, this layer builds up and production must be stopped for cleaning. It was estimated in a Contech squeeze casting plant in Pierceton, IN, that 1.5% of variable overhead can be directly attributed to die soldering. Previous work at WPI has focused on developing the mechanism of how soldering occurs. This work focuses on how that knowledge can be applied in an industrial setting. The work has focused on 4 major areas: (1) Using MAGMAsoft to predict die soldering, (2) Using surface metrology to measure die soldering, (3) Documenting the total process effects of using strontium modified casting alloys. The work has resulted in: (1) Guidelines for using MAGMAsoft to predict die soldering. The results can be incorporated into the existing MAGMA die soldering module, but provide more accurate time and temperature criteria. (2) The results of the study prove that measurement of the surface of the cast part itself can be used as a method for quantifying die soldering. (3) The total process effects of Sr-modification are reported, along with suggestions for immediate use of Sr-modification at the Pierceton, IN casting plant and guidelines for using Strontium in the future. aluminum casting die soldering casting
18	Soldering in high pressure die casting and its prevention by lubricant and oxide layers / Fraser, Darren T. January 2000 (has links) Thesis (Ph. D.)--University of Queensland, 2001. / Includes bibliographical references.
19	Study of polyarylene ether and its application in isotropically conductive adhesive Liong, Silvia 08 1900 (has links) No description available. Solder and soldering Electronic packaging Thermoplastics
20	A study of six weak organic acids commonly used in soldering fluxes Smith, Brian Andrew 08 1900 (has links) No description available. Organic acids Solder and soldering Testing

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