Thermal management is one of many critical tasks in the design of power electronic systems. It has become increasingly important as a result of the introduction of high power density and integrated modules. It has also been realized that higher temperatures do affect reliability due to a variety of physical failure mechanisms that involve thermal stresses and material degradation. Therefore, it is important to consider temperature as design parameter in developing power electronic modules. The NSF Center for Power Electronics System (CPES) at Virginia Tech previously developed a first generation (Gen-I) active Integrated Power Electronics Module (IPEM). This module represents CPES's approach to design a standard power electronic module with low labor and material costs and improved reliability compared to industrial Intelligent Power Modules (IPM). A preliminary Generation II (Gen-II.A) active IPEM was built using embedded power technology, which removes the wire bonds from the Gen-I IPEM. In this module, the three primary heat-generating devices are placed on a direct bonded copper substrate in a multi-chip module format. The overall goal of this research effort was to optimize the thermal performance of this Gen-II.A IPEM. To achieve this goal, a detailed three-dimensional active IPEM was modeled using the thermal-fluid analysis program ESC in I-DEAS to study the thermal performance of the Gen-II.A IPEM. Several design variables including the ceramic material, the ceramic thickness, and the thickness of the heat spreader were modeled to optimize IPEM geometric design and to improve the thermal performance while reducing the footprint. Input variables such as power loss and interface material thicknesses were studied in a sensitivity and uncertainty analysis. Other design constraints such as electrical design and packaging technology were also considered in the thermal optimization of the design. A new active IPEM design named Gen-II.C was achieved with reduced-size and improved thermal and electrical performance. The success of the new design will enable the replacement of discrete components in a front-end DC/DC converter by this standard module with the best thermal and electrical performance. Future improvements can be achieved by replacing the current silicon chip with a higher thermal-conductivity material, such as silicon carbide, as the power density increases, and by, exploring other possible cooling techniques. / Master of Science

Thermal management is a rapidly growing field in power electronics today. As power supply systems are designed with higher power density levels, keeping component temperatures within suitable ranges of their maximum operating limits becomes an increasingly challenging task. This project focuses on thermal management at the system level, using a 1.2 kW front-end power converter as a subject for case study. The establishment of a methodology for using the computer code I-deas to computationally simulate the thermal performance of component temperatures within the system was the primary goal. A series of four benchmarking studies was used to verify the computational predictions. The first test compares predictions of a real system with thermocouple measurements, and the second compares computational predictions with infrared camera and thermocouple measurements on a component mounted to a heat sink. The third experiment involves using flow visualization to verify the presence of vortices in the flow field, and the fourth is a comparison of computational temperature predictions of a DC heater in a controlled flow environment. A radiation study using the Monte Carlo ray-trace method for radiation heat transfer resulted in the reduction of some component temperature predictions of significant components. This radiation study focused on an aspect of heat transfer that is often ignored in power electronics. A component rearrangement study was performed to establish a set of guidelines for component placement in future electronic systems. This was done through the use of a test matrix in which the converter layout was varied a number of different ways in order to help determine thermal effects. Based on the options explored and the electrical constraints on the circuit, an optimum circuit layout was suggested for maximum thermal performance. This project provides a foundation for the thermal management of power electronics at the system level. The use of I-deas as a computational modeling tool was explored, and comparison of the code with experimental measurements helped to explore the accuracy of I-deas as a system level thermal modeling tool. / Master of Science

Heat pipes are passive heat transfer devices in which a working fluid is sealed inside a metal enclosure. Properly designed wick structures on the inner surface of the heat pipe are critical as the wick aids in the return of the condensed liquid from the cold end back to the hot end where the vaporization-condensation cycle begins again. Additive manufacturing techniques allow for manufacturing complex parts that are typically not feasible with conventional manufacturing methods. Thus, additive manufacturing opens the possibility to develop high performance heat pipes with complex shapes. In this study, an additive manufacturing technique called Binder Jetting is used to fabricate a fully operational compact (78 mm x 48 mm x 8 mm) flat plate heat pipe. Rectangular grooves with converging cross section along the length act as the wicking structure. A converging cross section was designed to enhance the capillary force and to demonstrate the capability of additive manufacturing to manufacture complex shapes. This work describes the challenges associated with the development of heat pipes using additive manufacturing such as de-powdering and sintering. Multiple de-powdering holes and internal support pillars to improve the structural strength of the heat pipe were provided in order to overcome the manufacturing constraints. The heat pipe was experimentally characterized for thermal performance with acetone as the working fluid for two different power inputs. The heat pipe operated successfully with a 25% increase in effective thermal conductivity when compared to solid copper. / Master of Science / The number of transistors in electronic packages has been on an increasing trend in recent decades. Simultaneously there has been a push to package electronics into smaller regions. This increase in transistor density has resulted in thermal management changes of increased heat flux and localization of hotspots. Heat pipes are being used to overcome these challenges. Heat pipes are passive heat transfer devices in which a working fluid is sealed inside a metal enclosure. The fluid is vaporized at one end and condensed at the other end in order to efficiently move heat through the pipe by taking advantage of the latent heats of vaporization and condensation of the fluid. Properly designed wick structures on the inner surface of the heat pipe are used to move the condensed fluid from the cold end back to the hot end, and the wick is a critical component in a heat pipe. Additive manufacturing techniques offer the opportunity to manufacture complex parts that are typically not feasible with conventional manufacturing methods. Thus, additive manufacturing opens the possibility to develop high performance heat pipes with complex shapes as well as the ability to integrate heat exchangers with the heat source. In this study, an additive manufacturing technique called Binder Jetting is used to fabricate a fully operational compact (78 mm x 48 mm x 8 mm) flat plate heat pipe. Rectangular grooves with converging cross section along the length act as the wicking structure. This work describes the challenges associated with the development of heat pipes using additive manufacturing such as depowdering and sintering. The heat pipe was experimentally characterized for thermal performance with acetone as the working fluid for two different power inputs. The heat pipe was found to operate successfully with a 25% increase in effective thermal conductivity when compared with solid copper.

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The modern military aircraft can be defined as a System of Systems (SoS); several distinct systems operating simultaneously across boundary interfaces. As the on-board subsystems have become more complex and diverse, the development process has become more isolated. When considering thermal management of distributed heat loads, the aircraft has become a collection of individually optimised components and subsystems, rather than the implementation of a single system to perform a given task. Avionic thermal management is quickly becoming a limiting factor of aircraft performance, reliability and effectiveness. The challenge of avionic thermal management is growing with the increasing complexity and power density of avionic packages. The aircraft relies on a heat rejection growth capacity to accommodate the additional through-life avionic heat loads. Growth capacity is defined as an allowable thermal loading growth designed into the system by the underutilisation of spatial and cooling supply at aircraft introduction; however, this is a limited resource and aircraft subsystem cooling capability is reaching a critical point. The depleted growth capacity coupled with increased avionic power demands has led to component thermal failure. However, due to the poor resolution of existing data acquisition, experimental facilities or thermodynamic modeling, the exact inflight-operating conditions remain relatively unknown. The knowledge gap identified in this work is the lack of definitive methodology to generate high fidelity data of in-flight thermal conditions of fast-jet subsystems and provide evidence towards effective future thermal management technologies. It is shown that, through the development of a new methodology, the knowledge gap can be reduced and as an output of this approach the unknown system behaviour can be defined. A multidisciplinary approach to the replication, analysis and optimisation of a fast-jet TMS is detailed. The development of a new Ground Test Facility (GTF) allows previously unidentified system thermal behaviour to be evaluated at component, subsystem and system level. The development of new data to characterise current thermal performance of a fast jet TMS allows recommendations of several new technologies to be implemented through a component led integrative system optimisation. This approach is to consider the TMS as a single system to achieve a single goal of component thermal management. Three technologies are implemented to optimise avionic conditions through the minimisation of bleed air consumption, improve avionic reliability through increased avionic component isothermalisation and increase growth capacity through improved avionic heat exchanger fin utilisation. These component level technologies improved system level performance. A reduction in TMS bleed air consumption from 1225kg to 510kg was found to complete a typical flight profile. A peak predicted aircraft specific fuel consumption saving of 1.23% is seen at a cruise flight condition because of this approach to avionic thermal management.

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The main objectives of this dissertation is to investigate the prospects of embedded thermoelectric devices integrated in a chip package and to develop a design methodology aimed at taking advantage of the on-chip on-demand cooling capabilities of the thermoelectric devices. First a simulation framework is established and validated against experimental results, which helps to study the cooling capabilities of embedded thermoelectric coolers (TEC) in both a transient and steady state. The potential for up to 15°C of total cooling has been shown. The thermal simulation framework allows for rapid assessment of TEC and system level thermal performance. Next, the thesis develops a co-simulation environment that is capable of simulating the thermal and electrical domain and couples them to design intelligent TEC controllers. These controllers are implemented on chip and can leverage the transient cooling capability of the device. The controllers are simulated within the co-simulation environment and their potential to control high power chip events are thoroughly investigated. The system level overheads are considered and discussions on implementation techniques are presented. The co-simulation framework is also extended to allow for simulation of real predictive technology microprocessor cores and their workloads. Finally the thesis implements a fully on-chip autonomous energy system that takes advantage of the TEC in its reverse energy harvesting mode and uses the same device to harvest energy and use the energy to power the on-chip cooling circuit. This increases the overall energy efficiency of the cooler and verifies the TEC control methods.

This thesis presents an analytical and experimental investigation into the capillary wicking limitation of an array of pillars. Commercial and nanopillar wicks are examined experimentally to assess the effects of micro and nanoscale capillary forces. By exerting a progressively higher heat flux on the wick, a maximum achievable mass flow was observed at the capillary limit. Through the balance of capillary and viscous forces, an ab initio analytical model is also presented to support the experimental data. Comparison of the capillary limit predicted by the analytical model and actual limit observed in experimental results are presented for three baseline wicks and two nanowicks. / text