This master’s thesis deals with the design of the switching power supply on the principle of high frequency converter. The goal of this thesis is construction of converter which is using GaN MOSFET transistors and SiC diodes for switching. The converter uses two switch forward power supply topology. Unusually high switching frequency was chosen for the design with power transformer with open magnetic core. The outcome of this work is functional converter which is primarily intended for educational and demonstrational purposes. Multiple parts of this converter are divided into individual blocks, which can be further used for construction of other types of switching converters.

Dans la course aux développements des technologies, une révolution a été induite par l'apparition des technologies Nitrures depuis deux décennies. Ces technologies à grande bande interdite proposent en effet une combinaison unique tendant à améliorer les performances en puissance, en intégration et en bilan énergétique pour des applications hautes fréquences (bande L à bande Ka en production industrielle). Ces technologies mobilisent fortement les milieux académiques et industriels afin de proposer des améliorations notamment sur les aspects de fiabilité. Les larges efforts consentis par des consortiums industriels et académiques ont permis de mieux identifier, comprendre et maîtriser certains aspects majeurs limitant la fiabilité des composants, et ainsi favoriser la qualification de certaines filières. Cependant, la corrélation et l'analyse physique fine des mécanismes de dégradation suscite encore de nombreux questionnements, et il est indispensable de renforcer ces études par une approche d'analyse multi-outils. Nous proposons dans ce travail de thèse une stratégie d'analyse selon deux aspects majeurs. Le premier concerne la mise en œuvre d'un banc de stress qui autorise le suivi de nombreux marqueurs électriques statiques et dynamiques, sans modifier les conditions de connectiques des dispositifs sous test. Le second consiste à mettre en œuvre un modèle physique TCAD le plus représentatif de la technologie étudiée afin de calibrer le composant à différentes périodes du stress.Le premier chapitre est consacré à la présentation des principaux tests de fiabilité des HEMTs GaN, et des défauts électriques et/ou structuraux recensés dans la littérature ; il y est ainsi fait état de techniques dites non-invasives (c.-à-d. respectant l'intégrité fonctionnelle du composant sous test), et de techniques destructives (c.-à-d. n'autorisant pas de reprise de mesure). Le second chapitre présente le banc de stress à haute fréquence et thermique développé pour les besoins de cette étude ; l'adjonction d'un analyseur de réseau vectoriel commutant sur les quatre voies de tests permet de disposer de données dynamiques fréquentielles, afin d'interpréter les variations du modèle électrique petit-signal des modules sous test à différentes périodes du stress. [...] / In the race to technologies development, disruptive wide bandgap GaN devices propose challenging performances for high power and high frequency applications. These technologies strongly mobilize academic and industrial partners in order to improve both the performances and the reliability aspects. Extensive efforts have made it possible to better identify, understand and control first order degradation mechanisms limiting the lifetime of the devices; however, the correlation (and fine physical analysis) of different degradation mechanisms still raises many questions, and it is essential to strengthen these studies by mean of multi-tool analysis approach. In this thesis, we propose a twofold analysis strategy. The first aspect concerns the implementation of a stress bench that allows the monitoring of numerous static and dynamic electrical markers, without removing the devices under test from their environment (in order to have a consistent data set during the period of the strain application). The second aspect consists in implementing a physical TCAD model of the technology under study, in order to calibrate the component before stress, and to tune the model at different periods of stress (still considering stress-dependent parameters potentially affecting the device). The first chapter is devoted to the presentation of the main reliability tests of GaN HEMTs, and of the electrical and/or structural defects identified in the literature; it thus refers to so-called non-invasive techniques (i.e. respecting the functional integrity of the component under test), and destructive techniques (i.e. not allowing additive electrical measurement). The second chapter presents the high frequency and thermal stress bench dedicated to this study; the addition of a vector network analyzer switching between the four test channels provides dynamic frequency data, in order to interpret the variations of the small signal electrical model of the devices under test at different stress periods.[...]

Im Rahmen der Arbeit wurde eine neuartige Variante der Hochtemperatur-Gasphasenepitaxie (HTVPE) für die Herstellung von GaN entwickelt, die eine hohe Flexibilität und bessere Kontrolle des Züchtungsprozesses ermöglicht. Für die Realisierung des Konzeptes wurde eine Züchtungsanlage für die HTVPE entworfen und aufgebaut. Des Weiteren wurde ein numerisches Modell des Wärme- und Stofftransports entwickelt und für die Untersuchungen der Transportphänomene im HTVPE-Reaktor sowie für die Weiterentwicklung des Züchtungsreaktors verwendet. Die systematischen Züchtungsexperimente zeigten eine gute Übereinstimmung mit den Simulationsergebnissen und lieferten ein besseres Verständnis der HTVPE und ihres Anwendungspotentials. Die versbesserte Prozesskontrolle ermöglichte die erstmalige Anwendung der Niedertemperatur-Nukleation für die heteroepitaktische Abscheidung von GaN auf Saphir mit der HTVPE. Weiterhin wurden Wachstumsraten über 80 µm/h erreicht und das Potential der HTVPE für die Herstellung von GaN-Volumenschichten demonstriert.

Polystyrene block polyethyleneimine (PS-b-PEI) copolymer prepared by combining PS and poly(2-methyl-2-oxazoline) (PMeOx) segments together through two strategies. Furthermore, PMeOx block was hydrolysis to produce PEI block which linked with PS block. Macroinitiator route is one of these two ways to prepare PS-b-PEI copolymer. Polystyrene macroinitiator or poly(2-methyl-2-oxazoline) macroinitiator prepared through Nitroxide Mediate Radical Polymerization (NMRP) or Cationic Ring Opening Polymerization (CROP) respectively. Each macroinitiator has active initiated terminal group toward another block monomer. Second strategy based on coupling of PS segment with PMeOx block through “click” coupling chemistry. Polystyrene modified with terminal azide moiety are combined with PMeOx functionalized with alkyne group via 1,3 dipolar cycloaddition reaction “click reaction”. PS-b-PMeOx was hydrolysis in alkaline medium to produce amphiphilic PS-b-PEI copolymer. A set of block copolymer with different block ratios was prepared and investigated to select suitable block copolymer for further applications. Stichiometric PS-b-PEI copolymer selected to stabilize gold nanoparticle (Au NPs) in polymer matrix. PEI segment work as reducing and stabilizing agent of gold precursor in aqueous solution. Various concentrations of gold precursor were loaded and its effect on UVVIS absorbance, particle size and particle distribution studied. In addition, reduction efficiency of PEI block was determined from XPS measurements. The thickness of Au NPs/PS-b-PEI thin film was determined with a novel model for composite system. On the other hand, Gallium nitride quantum dots (GaN QDs) stabilized in PS-b-PEI copolymer after annealing. Our amphiphilic block copolymer exhibit nice thermal stability under annealing conditions. GaN QDs prepared in narrow nano-size with fine particle distribution. Blue ray was observed as an indication to emission activity of GaN crystal. Over all, PS-b-PEI copolymer synthesized through macroinitiator and click coupling methods. It was successfully stabilized Au NPs and GaN QDs in polymer matrix with controlled particle size which can be post applied in tremendous industrial and researcher fields.

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Der Graben-Gate-MOSFET ist eine herausragende Bauelementarchitektur unter den vertikalen Bauelementen auf GaN-Basis, die derzeit für die nächste Generation der Leistungselektronik untersucht werden. Ein niedriges Reststromniveau im Aus-Zustand bei hoher Drain-Spannung ist für vertikale Transistoren von großer Bedeutung, da es ein entscheidendes Merkmal für eine hohe Durchbruchspannung und Zuverlässigkeit der Bauelemente ist. Die Drain-Restströme im Aus-Zustand haben ihren Ursprung in verschiedenen Quellen im vertikalen Trench-Gate-MOSFET. Neben dem Trench-Gate-Modul können auch die Reststrompfade an der trockengeätzten Seitenwand des lateralen Kantenabschlusses erheblich zum Drain-Reststrom im Aus-Zustand beitragen. In diesem Bericht wird der Einfluss jedes relevanten Prozessschritts auf den Drain-Reststrom im Aus-Zustand anhand spezifischer Teststrukturen auf hochwertigem epitaktischem GaN-Material, welche den lateralen Kantenabschluss des MOSFETs nachbilden, untersucht. Die elektrische Charakterisierung zeigt die Empfindlichkeit des Reststroms gegenüber plasmabezogenen Prozessen. Es wird eine Technologie der Randterminierung vorgestellt, die zu einem niedrigen Reststrom führt und gleichzeitig dicke dielektrische Schichten aus plasma-unterstützter Abscheidung enthält, die für die Herstellung einer Feldplattenstruktur über dem Kantenabschluss vorgesehen sind. / The trench gate MOSFET represents a prominent device architecture among the GaN based vertical devices currently investigated for the next generation of power electronics. A low leakage current level in off-state under high drain bias is of great importance for vertical transistors since it is a crucial feature for high breakdown voltage and device reliability. The off-state drain leakage originates from different sources in the vertical trench gate MOSFET. Besides the trench gate module, the leakage paths at the dry-etched sidewall of the lateral edge termination can also significantly contribute to the off-state drain-current. In this report, the influence of each relevant process step on the drain leakage current in off-state is investigated utilizing specific test structures on high-quality GaN epitaxial material which mimic the lateral edge termination of the MOSFET. Electrical characterization reveals the sensitivity of the leakage current to plasma-related processes. A termination technology is presented that results in low leakage current while including thick dielectric layers from plasma-assisted deposition as intended for fabrication of a field plate structure over the edge termination.

Gallium nitride (GaN) high-electron-mobility transistors (HEMTs) are favored for their smaller specific on-resistance, lower switching losses, and higher theoretical temperature limits as compared to traditional silicon (Si) power switches. They have the potential to dramatically increase the power density and efficiency of power electronics systems by replacing traditional Si-based switches. However, GaN HEMTs have a faster switching speed compared to their Si-based counterparts. Minimizing the parasitic loop inductances of the GaN HEMT package is crucial for reducing electromagnetic interference (EMI) noise and voltage spikes. Another concern with GaN HEMTs comes from their lower thermal conductivity and smaller die size. The HEMTs generally have a higher heat flux density, and accordingly, demand better heat dissipation. Thus, innovations are needed for making GaN HEMT packages with low parasitic inductances and higher thermal performances to further their applications in high-frequency, high-power-density converters. To reduce loop inductance, other researchers have embedded GaN HEMTs in a printed circuit board (PCB) and used plated vias for interconnections and heat dissipation. However, this approach requires more complex manufacturing steps and has lower thermal performance. This dissertation introduces different embedded packaging techniques for 650V, 150A GaN HEMTs; this method involves interconnecting the bare chips between direct-bonded copper (DBC) and a PCB or between two DBCs, as discussed in Chapter 2. Vertical interconnections by gold pins and silver rods are introduced and implemented in embedded packages to limit the parasitic loop inductance within 1.5 nH and parasitic resistances within 1.5 mΩ. The thermal performance of the embedded GaN HEMT packages is experimentally verified in Chapter 2; then, the junction-to-case thermal resistance (RthJC) measurement is discussed in Chapter 3. The common temperature-sensitive electrical parameters (TSEPs) of a GaN HEMT for junction temperature measurement lack sufficient sensitivity or stability due to the electron-trapping effect. The non-uniform distribution of the case temperature and a large temperature gradient between the case and heatsink also make it difficult to accurately measure the case temperature. In Chapter 3, gate-to-gate resistance (Rg2g) is selected as the TSEP for junction temperature measurement. The stacked thermal interface material (TIM) technique was used to reduce errors in case temperature measurement. This technique was implemented in a custom GaN HEMT package and in embedded GaN HEMT packages for measuring junction-to-case thermal resistance. The discrepancy between measurement and simulation is less than 20%, and the junction-to-case thermal resistance for embedded packages is within 0.1 °C/W. Chapter 4 evaluates the reliability of the GaN HEMT embedded packages developed in Chapter 2 by utilizing a power cycling test. Monitoring the junction temperature of the embedded packages online is challenging during the power cycling test. Other approaches have used the on-resistance as the TSEP in order to monitor junction temperature for GaN HEMTs but this is not accurate due to electron trapping. As discussed in Chapter 3, Rg2g is chosen as the TSEP to monitor the junction temperature without worrying about the influence of electron trapping, and this approach cycles the embedded packages at 75 A from 25°C to 125°C. The packages can endure 23,000 power cycles before failure. This work is the first to develop, fabricate, and characterize embedded packages for 650V, 150A GaN HEMT bare chips. These embedded packages with high-power-rated GaN HEMT bare dice provide an opportunity to reduce the number of paralleled power switches, reduce the system's cooling size, and increase the system's power density. In addition, this work is the first to develop the junction-to-case thermal resistance measurement technique by gate-to-gate electrical resistance and stacked-TIM for GaN HEMT packages. The technique helps enable solid thermal design for power electronics systems. / Doctor of Philosophy / Power switches are everywhere in our daily life. They are the fundamental elements in power converters for converting power to electric vehicles. As global power demand for these applications continues to increase, high levels of both efficiency and power density are crucial for power switches. However, traditional silicon-based switches are already very mature, and their properties are very close to their theoretical limits. For further improvement, researchers have tried to replace traditional Si switches with wide-bandgap switches, which have much higher theoretical limits. Gallium nitride high-electron-mobility transistors (GaN HEMTs) are one of the candidates. However, packaging these switches (GaN HEMTs) is challenging due to their initial properties. They naturally switch very quickly and have smaller sizes compared to traditional Si-based switches. The fast switching speed brings high dv/dt and di/dt during the switching period. It causes voltage spikes and electromagnetic interference (EMI) issues. And the smaller size contributes to higher heat flux density, thus requiring more efficient heat dissipation. To solve the challenge of packaging GaN HEMTs, this dissertation has developed embedded packaging techniques to achieve quiet switching and good heat dissipation. These packaging techniques enable GaN HEMTs' advantages and increase the power density and efficiency of power electronics systems. To experimentally verify the thermal performance of the embedded packages developed a junction-to-case thermal resistance measurement technique was introduced. The thermal resistance of a custom GaN HEMT package was measured, as were those of the embedded packages CPES also developed. The simulation results and the experimental results are close to each other. Finally, to further evaluate whether or not the newly developed embedded packages are reliable, power cycling tests were carried out at I = 75 A. The packages survived over 23,000 cycles before failure.

Galliumnitrid (GaN) ist ein Schlüsselmaterial zur Produktion von elektronischen Hochfrequenz- und Hochleistungsbauelementen sowie Leuchtdioden. Zum Erreichen der optimalen Bauelementleistung ist ein tiefgreifendes Verständnis sowie die Kontrolle von Punktdefekten unabdingbar um die elektrischen und optischen Substrateigenschaften präzise einzustellen. Im Rahmen dieser Arbeit wurden Punktdefekte in GaN mittels Photolumineszenz (PL)-spektroskopie untersucht. Häufige Übergangsmetallverunreinigungen (Fe, Mn und Cr) wurden anhand ihrer internen Übergänge, die sich durch scharfe Lumineszenz- und Absorptionslinien im nahen Infrarot auszeichnen, identifiziert. Mn und Cr wurden als Ursprung für ungewollte Substratfärbungen bestimmt. Teilweise Entfärbung konnte durch Mn-Si-Kodotierung erreicht werden. Der Zusammenhang zwischen Absorption und Emission des Cr-Zentrums wurde durch polarisationsabhängige PL-Anregungsspektroskopie analysiert. Weiterhin wurde der Einfluss von Kohlenstoffdotierung auf die Eigenschaften von GaN-Substraten durch PL- und PL-Anregungsspektroskopie untersucht. Eine neue Emissionsbande um 1,62 eV, die am effizientesten bei 2,7 eV angeregt wird, wurde für hochdotiertes GaN:C beobachtet und einem internen Übergang C_N-C_Ga-C_N-Komplexen zugeschrieben. / Gallium nitride (GaN) is a key material for the production of high frequency and high power electronics as well as light emitting diodes. Optimum device performance requires a profound understanding and control of the point defect formation in order to determine the electrical and optical substrate properties. Within this thesis, photoluminescence (PL) spectroscopy was applied to analyze point defects in GaN. Common transition metal impurities (Fe, Mn and Cr) were identified by their internal transitions characterized by sharp luminescence and absorption lines in the near infrared region. Among them, Mn and Cr were shown to be the origin of undesirable substrate coloration. Partial decoloration was achieved by an Mn-Si codoping approach. The relationship of absorption and emission processes of the Cr impurity center was further analyzed by polarization dependent PL excitation spectroscopy. Furthermore, the impact of C-doping on GaN substrate properties was investigated by PL and PL excitation spectroscopy. A new emission band around 1.6 eV, most efficiently excited at 2.7 eV, was reported for highly C-doped GaN and proposed to originate from an internal transition of C_N-C_Ga-C_N complexes.

GaN-HEMTs (Gallium Nitride-based High Electron Mobility Transistors) have, thanks to the large band gap of GaN, electrical properties that are suitable for applications of high electrical voltages, high currents, and fast switching. The large band gap also gives GaN-HEMTs a high resistance to radiation. In this degree project, the effects of 2 MeV proton irradiation of GaN-HEMTs constructed on both silicon carbide and silicon substrates are investigated. 20 transistors per substrate were irradiated in the particle accelerator 5 MV NEC Pelletron in the Ångström laboratory at Uppsala University. These transistors were exposed to radiation doses in the range of 10^11 to 10^15 protons/cm^2. The analysis shows that both transistors on silicon, as well as silicon carbide, are unaffected by proton irradiation up to a dose of 10^14 protons/cm^2. GaN-on-Si transistors show less influence of radiation than GaN-on-SiC transistors. The capacitances between gate and drain as well as drain and source for both GaN-on-SiC and GaN-on-Si HEMTs show hysteresis as a function of forward and backward gate voltage sweeps for the radiation dose of 10^15 protons/cm^2. / GaN-HEMTs (Galliumnitridbaserade High Electron Mobility Transistors) har tack vare det stora bandgapet i GaN goda elektriska egenskaper som lämpar sig för höga elektriska spänningar, höga strömmar och snabb växling mellan av- och på-tillstånd. Det stora bandgapet ger även GaN-HEMTs ett stort motstånd mot strålning.I detta examensarbete undersöks effekterna av 2 MeV protonbestrålning av GaN-HEMTs. Dessa HEMTs är konstruerade på både kiselkarbid- och kiselsubstrat.20 transistorer per transistorsubstrat bestrålades i partikelacceleratorn 5 MV NEC Pelletron i Ångströmslaboratoriet vid Uppsala Universitet. Dessa transistorer utsattes för strålningsdoser inom intervallet 10^11 till 10^15 protoner/cm^2. Resultaten visar att både tranisistorer på kisel såsom kiselkarbid är opåverkade av strålning upp till en dos av 10^14 protoner/cm^2. GaN-på-Si-transistorer visar en mindre påverkan av protonstrålning än GaN-på-SiC-transistorer. Ytterligare uppstod hysteresis för kapacitanser mellan gate och drain och mellan gate och source som en funktion av fram- och bakriktad gate-spänning efter en strålningsdos av 10^15 protoner/cm^2.

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