Dans le but d'atteindre une température de fonctionnement élevée tout en conservant de fortes exigences sur les performances des photodétecteurs infrarouges, la pression sur la qualité du matériau HgCdTe augmente de plus en plus. En particulier, une attention spéciale est maintenant portée aux contraintes et à leur relaxation des photodiodes HgCdTe. Bien que de récentes études se soient concentrées sur la déformation induite par un désaccord paramétrique sur des surfaces de la taille d'un plaque, aucune étude expérimentale n'a été capable de résoudre la déformation au niveau micrométrique.La limite de résolution spatiale millimétrique typique de la diffraction standard peut être dépassée en utilisant un faisceau synchrotron de rayons X focalisés. En effet, en effectuant des mesures de microdiffraction Laue, nous pouvons cartographier, avec une résolution submicronique, à la fois la contrainte déviatorique locale et l'orientation de la maille. Cette thèse se concentre sur l'analyse de tranchées gravées à l'intérieur des couches de HgCdTe avec des variations sur les étapes de passivation et de recuit. Nous sommes en mesure d'étudier une cartographie précise autour de la gravure et d'apprécier les effets locaux des étapes de traitement. La cartographie de déplacement des pics de diffraction montre la courbure des plans cristallins autour des tranchées gravées, avec une forte dépendance aux étapes technologiques.Ensuite, nous nous concentrons sur la position relative de tous les pics, qui sont mesurés simultanément. En supposant une contrainte bi-axiale entre la couche et le substrat, la pente du déplacement relatif du pic en fonction de leur position fournit directement la valeur de contrainte subie par le matériau. Ainsi, nous mesurons la déformation à travers l'ensemble de l'échantillon avec une précision de 3.10-5 et la cartographions avec une précision de position submicronique.Enfin, nous montrons comment l'utilisation d'un système de flexion 3 points conduit à la détermination expérimentale du seuil de plasticité dans les structures épitaxiées HgCdTe / CdZnTe ainsi qu'à la distribution spatiale de la contrainte appliquée. La dynamique du régime élastique au régime plastique et le comportement de la couche une fois que le seuil plastique est atteint sont étudiés. De plus, l'étape de gravure crée des bords abrupts à l'intérieur de la couche, conduisant à une modification du champ de contrainte en la concentrant sur les angles de la tranchée. / Within the general goal of reaching high operating temperature while maintaining strong requirements on infrared photodetector performances, the pressure on HgCdTe material quality is increasingly growing. In particular, careful attention is now being paid to stress and stress relaxation within HgCdTe photodiodes. While recent studies have focused on the lattice mismatch induced strain over areas in the order of the wafer, no experimental investigation has been able to resolve the strain at the micrometer level.The typical millimetric spatial resolution limit of standard diffraction can be overtaken using a focused synchrotron X-ray white beam. Indeed, by performing Laue microdiffraction measurements, we can map with a sub-micrometer resolution both the local deviatoric strain and lattice orientation. This thesis focuses on the analysis of etched trenches inside HgCdTe layers with variations on passivation and annealing steps. We are able to investigate a precise mapping around the etching and appreciate the local effects of the processing steps. Diffraction peak displacement mapping evidences bending of the crystal planes around etched trenches, with strong dependence upon the processing steps.Then, we focus on the relative position of all the peaks which are measured simultaneously. Assuming a bi-axial strain between layer and substrate, the slope of the peak relative displacement as a function of their position directly provides the strain value undergone by the material. Thus, we measure the strain through the entire sample with a precision of 3.10-5 and map it with a sub-micronic position precision.Finally, we show how the use of a three point calibrated bending set-up leads to the experimental determination of the plasticity threshold in HgCdTe/CdZnTe epitaxial structures together with the spatial distribution of the applied strain. The dynamics from elastic to plastic regime and the layer behavior once the plastic threshold is reached are investigated. Furthermore, the etching step creates abrupt edges inside the layer, leading to a modification of the strain field by concentrating it on the angles of the trench.

Cette thèse, réalisée à l'IES en partenariat avec la société SOFRADIR et le CEA-LETI, avait pour objectif d'évaluer les potentialités du matériau InSb pour la réalisation de photodiodes à avalanche (APD) moyen infrarouge (MWIR). Par l'étude du design (simulations TCAD), de la fabrication technologique en configuration MESA (voie humide, voie sèche, passivation), puis par la caractérisation électrique des dispositifs, ce travail de thèse s'est attaché à explorer l'ensemble des éléments nécessaires au développement de cette filière de photodétecteurs. Les photodiodes InSb fabriquées par épitaxie par jets moléculaires (EJM) ont présenté des densités de courant d'obscurité sur des monoléments de 10 à 30nA/cm² à -50mV et à 77K. Ces performances positionnent ces photodiodes à l'état de l'art pour la filière épi-InSb et souligne ainsi l'excellente qualité cristalline des couches épitaxiées. Les premières APDs InSb ont ensuite été épitaxiées et caractérisées. Avec une pure injection d'électrons nous avons observé une augmentation exponentielle du gain dans l'InSb, signature d'une multiplication initiée exclusivement par les électrons. Un premier gain de 3 à -4V a été mesuré. Cette asymétrie du processus d'ionisation par impact indiquerait la possibilité d'obtenir du gain sans excès de bruit, propriété indispensable pour les applications d'imagerie faible flux visée. A ce stade de l'étude, les performances des APDs InSb sont limitées par un dopage résiduel trop élevé dans les zones de multiplications réalisées, entrainant une forte contribution du courant tunnel bande à bande. Néanmoins, ces travaux fournissent tous les éléments d'orientations nécessaires au développement des APDs InSb dont le point clé est définitivement l'obtention d'un faible dopage résiduel dans la zone de multiplication. / This thesis realized at the IES, with the collaboration of SOFRADIR and the CEA-LETI, had for objective the potential evaluation of the InSb material for the realization of midwave infrared (MWIR) avalanche photodiodes (APD). Studying the design (TCAD modeling), the MESA technological fabrication (wet etching, dry etching, passivation) and analyzing the electrical characterizations of devices fabricated, this work has investigated all the scientific elements necessary for the development of this photodetector technology. The MBE (Molecular Beam Epitaxy) grow InSb photodiodes have shown monopixel dark current density from 10 to 30nA/cm² at -50mV and 77K. These performances are at the state of the art for InSb epi-diodes and highlight the excellent crystal quality of the epitaxial layers. The first InSb APDs were grown and characterized. With a pure electron injection, we have observed an exponential increase of the gain, signature of a single carrier multiplication exclusively initiated by the electrons. A gain value of 3 was measured at -4V. This asymmetrical aspect of the impact ionization process would indicate the possibility to obtain a gain without excess noise. This is fundamental for the intended imaging applications. At this stage, InSb APD performances are limited by a too high residual doping level, resulting in a strong band to band tunneling current. Nevertheless, this work provides all the milestones needed for the InSb APD development where the key point is undoubtedly the getting of low residual doping level in the multiplication layer.

The purpose of this research was to develop and test a radiation detector to perform beta dosimetry and spectroscopy. The detector utilizes plastic scintillator volumes to produce scintillation light in proportion to the amount of energy deposited in them, and a large-area avalanche photodiode to convert the light to electrical signals. Pulse processing electronics transform the electrical signals into a format useful for analysis, and various software programs are used to analyze the resulting data. The detector proved capable of measuring dose, as compared to Monte Carlo n-Particle simulations, to within about 50% or better, depending on geometry and source type. Spectroscopy results, in conjunction with MCNP-based spectral enhancement methods, proved the detector capable of recording beta spectra with endpoint energies greater than about 250 keV. The detector shows promise for further development as a portable beta detector for field use in beta-contaminated areas. / Graduation date: 2005

This paper describes recent progress in a continuing program to develop and apply RM³ (recess mounting with monolithic metallization) technologies for heterogeneous integration. Particular emphasis is placed on the APB (aligned pillar bonding) and MASA (magnetically assisted statistical assembly) technologies. Next, ongoing research on applications of RM3 integration to produce optoelectronic integrated circuits (OEICs) for optical clock distribution, diffuse optical tomography, and smart pixel arrays are described. Finally, potential new applications of these technologies in intra- and interchip optical signal interconnects, in fluorescent dye detection and imaging for biomedical applications, and in III-V mini-IC integration on Si-CMOS for enhancing off-chip drive capabilities are outlined. / Singapore-MIT Alliance (SMA)

A self-consistent, full-band, electrothermal ensemble Monte Carlo device simulation tool has been developed. It is used to study charge transport in bulk GaN, and to design, analyze, and improve the performance of AlGaN/GaN high electron mobility transistors (HEMTs) and avalanche photodiodes (APDs). Studies of electron transport in bulk GaN show that both peak electron velocity and saturated electron velocity are higher for transport in the basal plane than along the c-axis. Study of the transient electron velocity also shows a clear transit-time advantage for electron devices exploiting charge transport perpendicular to the c-axis. The Monte Carlo simulator also enables unique studies of transport under the influence of high free carrier densities but with low doping density, which is the mode of transport in AlGaN/GaN HEMTs. Studies of isothermal charge transport in AlGaN/GaN HEMTs operating at high gate bias show a drain current droop with increasing drain-source bias. The cause of the droop is investigated and a design utilizing source- or gate-connected field plate is demonstrated to eliminate the drain current droop. Electrothermal aspects of charge transport in AlGaN/GaN HEMTs are also investigated, and the influence of non-equilibrium acoustic and optical phonons is quantified. The calculated spatial distribution of non-equilibrium phonon population reveals a hot spot in the channel that is localized at low drain-source bias, but expands towards the drain at higher bias, significantly degrading channel mobility. Next, Geiger mode operation of wurtzite GaN-based homojunction APDs is investigated. The influences of dopant profile, active region thickness, and optical absorption profile on single photon detection efficiency (SPDE) are quantified. Simulations of linear mode gain as a function of multiplication region thickness and doping profile reveal that weakly n-type active regions may be exploited to achieve higher avalanche gain, without penalty to either applied bias or active region thickness. A separate absorption and multiplication APD (SAM-APD) utilizing a AlGaN/GaN heterojunction is also investigated. The presence of strong piezo-electric and spontaneous polarization charges at the heterojunction enables favorable electric field profile in the device to reduce dark current, improve excess noise factor, improve quantum efficiency, and improve breakdown probability. To maximize SPDE, a new device structure with a buried absorber is proposed and improved SPDE is demonstrated. Lastly, a new approach for the direct generation of self-sustaining millimeter-wave oscillations is proposed. In contrast to Gunn diodes, which exploit a bulk-like active region, periodic oscillation is achieved in the proposed structures through the creation, propagation and collection of traveling dipole domains supported by fixed polarization charge and the associated two-dimensional electron gas along the plane of a polar heterojunction. Numerical simulation of induced oscillations in a simple triode structure commonly used for AlGaN/GaN HEMTs reveals two distinct modes of self-sustaining millimeter-wave oscillation.

A wide variety of group III-Nitride-based photonic and electronic devices have opened a new era in the field of semiconductor research in the past ten years. The direct and large bandgap nature, intrinsic high carrier mobility, and the capability of forming heterostructures allow them to dominate photonic and electronic device market such as light emitters, photodiodes, or high-speed/high-power electronic devices. Avalanche photodiodes (APDs) based on group III-Nitrides materials are of interest due to potential capabilities for low dark current densities, high sensitivities and high optical gains in the ultraviolet (UV) spectral region. Wide-bandgap GaN-based APDs are excellent candidates for short-wavelength photodetectors because they have the capability for cut-off wavelengths in the UV spectral region (λ < 290 nm). These intrinsically solar-blind UV APDs will not require filters to operate in the solar-blind spectral regime of λ < 290 nm. For the growth of GaN-based heteroepitaxial layers on lattice-mismatched substrates, a high density of defects is usually introduced during the growth; thereby, causing a device failure by premature microplasma, which has been a major issue for GaN-based APDs. The extensive research on epitaxial growth and optimization of Al_x Ga _1-x N (0 ≤ x ≤ 1) grown on low dislocation density native bulk III-N substrates have brought UV APDs into realization. GaN and AlGaN UV <i> p-i-n </i> APDs demonstrated first and record-high true avalanche gain of > 10,000 and 50, respectively. The large stable optical gains are attributed to the improved crystalline quality of epitaxial layers grown on low dislocation density bulk substrates. GaN <i>p-i-n </i> rectifiers have brought much research interest due to its superior physical properties. The AIN-free full-vertical GaN<i> p-i-n </i> rectifiers on<i> n </i>- type 6H-SiC substrates by employing a conducting AIGaN:Si buffer layer provides the advantages of the reduction of sidewall damage from plasma etching and lower forward resistance due to the reduction of current crowding at the bottom<i> n </i> -type layer. The AlGaN:Si nucleation layer was proven to provide excellent electrical properties while also acting as a good buffer role for subsequent GaN growth. The reverse breakdown voltage for a relatively thin 2.5 μm-thick<i> i </i>-region was found to be over -400V.

A new one-dimensional device simulation package developed for the simulation of neutron radiatiol! effects in silicon avalanche photodiodes is described. The software uses a finite difference technique to solve the time-independent semiconductor equations across a user specified structure. Impact ionisation and illumination are included, allowing accurate simulation with minimal assumptions about the device under investigation. The effect of neutron radiation damage is incorporated via the introduction of deep acceptor levels subject to Shockley-Read-Hall statistics. Two models are presented. A reverse reach through model, based on the EG&G C30626E reverse reach through avalanche photo diode originally proposed for use in the CMS electromagnetic calorimeter, and a reach through model, based on widely available commerical devices. A short experimental study on two commercial silicon avalanche photodiodes, a C30719F reverse reach through APD and a C30916E reach through APD, is presented for comparison with the simulation data. To allow full comparison with the simulated predictions, the commercial devices were irradiated at the Rutherford Appleton Laboratory's ISIS facility. The simulated data shows good qualitative agreement with the measurements performed on the commercial devices, quantitative predictions would require exact information about the doping profile. The characteristic behaviour of the devices is predicted over a wide range of conditions both before and after neutron irradiation. The effect of ionised deep acceptors in the bulk of the devices is investigated. The simulation package provides a useful tool for the analysis of semiconductor devices, particularly in areas where a non-ionising radiation damage is prevelent e.g. high energy physics, and provides a good basis for further development.

No description available.

[Truncated abstract] HgCdTe is the leading semiconductor material for the fabrication of high performance infrared photon detectors, in particular, for detection of radiation beyond the near infrared. State-of-the-art infrared detection and imaging systems are currently based around high density focal plane arrays consisting of HgCdTe photodiodes as detector elements. Despite the high performance of HgCdTe infrared detectors, and the many benefits they can offer to industry and society, their utilisation remains limited due to the high cost of production. The chemical composition and narrow bandgap of the HgCdTe material used for infrared detection means that the material is inherently very susceptible to defect formation caused by the processing procedures required for device fabrication. Consequently, fabrication of HgCdTe photodiode arrays have traditionally been characterised by low yields and high costs for arrays that meet required operability specifications. In this thesis a new photodiode fabrication technology with the potential to improve device yields over traditional fabrication technologies is presented. This new fabrication technology is distinguished from others by the use of plasma-induced p-to-n type conversion of HgCdTe for junction formation. This allows great simplification of the fabrication process and avoids high temperature processing during and after junction formation, and keeps the junction protected from the atmosphere at all stages of fabrication. The development of the photodiode fabrication technology using plasma-induced junction formation has involved characterising the electrical transport properties of the type-converted layers, fabrication and characterisation of photodiodes, and photodiode dark current modelling

Thesis (Ph. D.)--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (p. 177-194).