This work explores two very different structural systems: n-type hydrogenated amorphous silicon (a-Si:H) and gold nanoparticles (AuNPs) suspended in a matrix of organic ligands. For a-Si:H, examination of the gas-phase concentration of dopant (1-6% PH3/SiH4) and argon diluent effects includes the temperature dependent conductivity, low-frequency electronic noise, and Raman spectroscopy to examine structure. It is found that a-Si:H samples grown with high dopant concentration or with argon dilution exhibit an anomalous hopping conduction mechanism with an exponent of p=0.75. An experimental approach is used to determine correlations between conduction parameters, such as the pre-exponential factor and the characteristic temperature, rather than an analysis of existing models to explain the anomalous conduction. From these results, the anomalous conduction is a result of a change in the shape of the density of states and not a shift of the Fermi level with dopant. Additionally, it is found that argon dilution increases the carrier mobility, reduces the doping efficiency, and causes a degradation of the short-range order. With AuNPs, a comparison of temperature dependent conductivity and low-frequency noise shows that the temperature coefficient of resistance (TCR) is independent of the length of interparticle distance while the noise magnitude decreases.

O ruído de baixa frequência é um limitador de desempenho em circuitos analógicos, digitais e de radiofrequência, introduzindo ruído de fase em osciladores e reduzindo a estabilidade de células SRAM, por exemplo. Transistores de efeito de campo de metalóxido- semicondutor (MOSFETs) são conhecidos pelos elevados níveis de ruído 1= f e telegráfico, cuja potência pode ser ordens de magnitude maior do que a observada para ruído térmico para frequências de até dezenas de kHz. Além disso, com o avanço da tecnologia, a frequência de corner —isto é, a frequência na qual as contribuições dos ruídos térmico e shot superam a contribuição do ruído 1= f — aumenta, tornando os ruídos 1= f e telegráfico os mecanismos dominantes de ruído na tecnologia CMOS para frequências de até centenas de MHz. Mais ainda, o ruído de baixa frequência em transistores nanométricos pode variar significativamente de dispositivo para dispositivo, o que torna a variabilidade de ruído um aspecto importante para tecnologias MOS modernas. Para assegurar o projeto adequado de circuitos do ponto de vista de ruído, é necessário, portanto, identificar os mecanismos fundamentais responsáveis pelo ruído de baixa frequência em MOSFETs e desenvolver modelos capazes de considerar as dependências do ruído com geometria, polarização e temperatura. Neste trabalho é proposta uma técnica para análise de ruído de baixa frequência baseada na autocorrelação dos espectros de ruído em função de parâmetros como frequência, polarização e temperatura. A metodologia apresentada revela informações importantes sobre os mecanismos responsáveis pelo ruído 1= f que são difíceis de obter de outras formas. As análises de correlação realizadas em três tecnologias CMOS comerciais (140 nm, 65 nm e 45 nm) fornecem evidências contundentes de que o ruído de baixa frequência em transistores MOS tipo-n e tipo-p é composto por um somatório de sinais telegráficos termicamente ativados. / Low-frequency noise (LFN) is a performance limiter for analog, digital and RF circuits, introducing phase noise in oscillators and reducing the stability of SRAM cells, for example. Metal-oxide-semiconductor field-effect-transistors (MOSFETs) are known for their particularly high 1= f and random telegraph noise levels, whose power may be orders of magnitude larger than thermal noise for frequencies up to dozens of kHz. With the technology scaling, the corner frequency — i.e. the frequency at which the contributions of thermal and shot noises to noise power overshadow that of the 1= f noise — is increased, making 1= f and random telegraph signal (RTS) the dominant noise mechanism in CMOS technologies for frequencies up to several MHz. Additionally, the LFN levels from device-to-device can vary several orders of magnitude in deeply-scaled devices, making LFN variability a major concern in advanced MOS technologies. Therefore, to assure proper circuit design in this scenario, it is necessary to identify the fundamental mechanisms responsible for MOSFET LFN, in order to provide accurate LFN models that account not only for the average noise power, but also for its variability and dependences on geometry, bias and temperature. In this work, a new variability-based LFN analysis technique is introduced, employing the autocorrelation of multiple LFN spectra in terms of parameters such as frequency, bias and temperature. This technique reveals information about the mechanisms responsible for the 1= f noise that is difficult to obtain otherwise. The correlation analyses performed on three different commercial mixed-signal CMOS technologies (140-nm, 65-nm and 40-nm) provide strong evidence that the LFN of both n- and p-type MOS transistors is primarily composed of the superposition of thermally activated random telegraph signals (RTS).

O ruído de baixa frequência é um limitador de desempenho em circuitos analógicos, digitais e de radiofrequência, introduzindo ruído de fase em osciladores e reduzindo a estabilidade de células SRAM, por exemplo. Transistores de efeito de campo de metalóxido- semicondutor (MOSFETs) são conhecidos pelos elevados níveis de ruído 1= f e telegráfico, cuja potência pode ser ordens de magnitude maior do que a observada para ruído térmico para frequências de até dezenas de kHz. Além disso, com o avanço da tecnologia, a frequência de corner —isto é, a frequência na qual as contribuições dos ruídos térmico e shot superam a contribuição do ruído 1= f — aumenta, tornando os ruídos 1= f e telegráfico os mecanismos dominantes de ruído na tecnologia CMOS para frequências de até centenas de MHz. Mais ainda, o ruído de baixa frequência em transistores nanométricos pode variar significativamente de dispositivo para dispositivo, o que torna a variabilidade de ruído um aspecto importante para tecnologias MOS modernas. Para assegurar o projeto adequado de circuitos do ponto de vista de ruído, é necessário, portanto, identificar os mecanismos fundamentais responsáveis pelo ruído de baixa frequência em MOSFETs e desenvolver modelos capazes de considerar as dependências do ruído com geometria, polarização e temperatura. Neste trabalho é proposta uma técnica para análise de ruído de baixa frequência baseada na autocorrelação dos espectros de ruído em função de parâmetros como frequência, polarização e temperatura. A metodologia apresentada revela informações importantes sobre os mecanismos responsáveis pelo ruído 1= f que são difíceis de obter de outras formas. As análises de correlação realizadas em três tecnologias CMOS comerciais (140 nm, 65 nm e 45 nm) fornecem evidências contundentes de que o ruído de baixa frequência em transistores MOS tipo-n e tipo-p é composto por um somatório de sinais telegráficos termicamente ativados. / Low-frequency noise (LFN) is a performance limiter for analog, digital and RF circuits, introducing phase noise in oscillators and reducing the stability of SRAM cells, for example. Metal-oxide-semiconductor field-effect-transistors (MOSFETs) are known for their particularly high 1= f and random telegraph noise levels, whose power may be orders of magnitude larger than thermal noise for frequencies up to dozens of kHz. With the technology scaling, the corner frequency — i.e. the frequency at which the contributions of thermal and shot noises to noise power overshadow that of the 1= f noise — is increased, making 1= f and random telegraph signal (RTS) the dominant noise mechanism in CMOS technologies for frequencies up to several MHz. Additionally, the LFN levels from device-to-device can vary several orders of magnitude in deeply-scaled devices, making LFN variability a major concern in advanced MOS technologies. Therefore, to assure proper circuit design in this scenario, it is necessary to identify the fundamental mechanisms responsible for MOSFET LFN, in order to provide accurate LFN models that account not only for the average noise power, but also for its variability and dependences on geometry, bias and temperature. In this work, a new variability-based LFN analysis technique is introduced, employing the autocorrelation of multiple LFN spectra in terms of parameters such as frequency, bias and temperature. This technique reveals information about the mechanisms responsible for the 1= f noise that is difficult to obtain otherwise. The correlation analyses performed on three different commercial mixed-signal CMOS technologies (140-nm, 65-nm and 40-nm) provide strong evidence that the LFN of both n- and p-type MOS transistors is primarily composed of the superposition of thermally activated random telegraph signals (RTS).

<p>Beyond graphene, two-dimensional (2D) atomic layered materials have drawn considerable attention as promising semiconductors for future ultrathin layered nano-electronic device applications, transparent/flexible devices and chemical sensors. But, they exhibit high levels of low-frequency due to interfacial scattering (small thickness) and interlayer coupling (large thickness). The sources and mechanisms of low frequency noise should be comprehensive and controlled to fulfill practical applications of two-dimensional transistors. This work seeks to understand the fundamental noise mechanisms of 2D transistors to find ways to reduce the noise level. It also verifies how noise can provide a spectroscopy for analysis of device quality.</p> <p>Most noise analysis tend to apply classical MOSFET models to the noise and electrical transport of 2D transistors, which put together all possible independent noise sources in 2D transistors, ignoring the contact effects. So this could lead to wrong estimation of the noise analysis in 2D transistors. This work demonstrates how the noise components can come from the channel and contact/access regions, all independently adding to the total noise. Each noise source can contribute and may dominate the total noise behavior under the specific gate voltage bias. Herein, the measured noise amplitude in our MoS₂ and MoSe₂ FETs shows a direct crossover from channel- to contact-dominated noise as the gate voltage is increased. The results can be interpreted in terms of a Hooge relationship associated with the channel noise, a transition region, and a saturated high-gate voltage regime whose characteristics are determined by a voltage-independent conductance and noise source associated with the metallurgical contact and the interlayer resistance. The approach for separating channel contributions from those contact/access region allows clear evaluation of the channel noise mechanism and also can be used to explain the qualitative differences in the transition regions between contact- and channel-dominated regimes for various devices.</p>

No description available.

Scope and contents: The static and dynamic electrical characteristics of silicon n-channel MOS FETs are studied down to cryogenic temperatures. Particular emphasis is directed towards the effect of interface states on the temperature dependence of both the pinch-off voltage and 1/f noise. / No abstract included. / Thesis / Master of Engineering (MEngr)

No description available.

No description available.

Ce mémoire concerne un ensemble d'élaboration et de caractérisation de couches minces à base de ZnO par la pulvérisation cathodique en continu. L'étude structurale montre que le traitement thermique lors du dépôt et post-dépôt à l'air ont une influence similaire sur l'augmentation de la taille de cristallites jusqu'à une température de 250°C. À partir de cette température critique, la taille des cristallites continue à augmenter en fonction de la température de recuit, alors qu'elle diminue légèrement avec la température de dépôt. L'étude morphologique montre que le traitement thermique lors du dépôt a une influence plus marquée sur la rugosité que celui à l'air de l'ambiante à 470°C. En fonction de la température de dépôt la résistivité électrique en continu diminue lorsque celle-ci augmente. Ce phénomène est directement lié à la qualité de la structure cristalline des films. À l'inverse, le recuit post-dépôt à l'air rend le film plus résistif. La deuxième partie de ce travail porte sur des mesures de bruit en 1/f. Nous montrons que le bruit est très sensible à la température de dépôt et à l'orientation des cristallites dans le matériau. Le bruit obtenu dans le sens transversal est plus élevé que celui obtenu dans le sens longitudinal. De plus, le bruit mesuré en présence de lumière peut être beaucoup plus élevé. Par un modèle simple, nous avons montré que ce phénomène est relié à la photoconductivité et à la présence de défauts en surface du matériau. Enfin, une technique photothermique par radiométrie unfrarouge a été utlilisée pour effectuer une caractérisaiton thermophysique du matériau. Cette technique permet de déterminer les paramètres optiques et thermiques de l'échantillon. Une étude théorique de l'évolution du signal photothermique en fonction de la fréquence de modulation a permis de mettre en évidence les conditions dans lesquelles on peut mesurer ces paramètres avec précision. / This memory relates to prepare and study the direct current sputtered ZnO thin films.The structural analysis shows that the heat treatments during the deposition and after deposition in air have the similar influence to increase the grain size until 250 °C. From this critical temperature, the grain size increases when the annealing temperature increases, while it decreases slightly with increasing deposition temperature. The morphology study shows that the deposition temperature has a more significant influence on the surface roughness than that in air from room temperature to 470°C. The elctrical resistivity decreases when the deposition temperature increases, which could be mainly due to the quality of the structure. On the contrary, the annealing in air after deposition degrades the film electrical resistivity. The second part of the electrical study is the 1/f noise measurement. The resuts show that the noise is very sensitive to the deposition temperature, which influence directly the samples crystal structure. The value measured in different directions, parallel or perpendicular to the growth orientation, are different. Furthermore the noise density could be much higher under UV illumination, which is explaines by a developed model based on the film photoconductivity and the defects in the material. The photothermal infrared radiometry has been used to analysis the material thermophysical characterization. This technique permits to determine the optical and thermal parameters of the sample. The theoretical study of the photothermal signal evolution as a functionof the modulated frequency has shown the conditions where the parameters could be measured accurately.

Depuis quelques décennies, la technologie de contrôle de la fréquence a été au coeur de l'électronique des tempsmodernes grâce à son vaste domaine d'applications dans les systèmes de communication, les ordinateurs, les systèmesde navigation ou de défense militaire. Les dispositifs temps-fréquence fournissent des stabilités de fréquence et despuretés spectrales élevées dans le domaine de la stabilité court-terme. L'amélioration de la performance de cesdispositifs reste un grand défi pour les chercheurs. La réduction du bruit afin d'augmenter cette stabilité court-terme etd'éviter les commutations non souhaitées entre les canaux est donc très souhaitable. Il est communément admis que lalimitation fondamentale à cette stabilité court-terme est due au bruit flicker de fréquence des résonateurs. Dans cemanuscrit, un premier chapitre rappelle quelques faits de base sur l’acoustique, la cristallographie et les définitions dudomaine temps-fréquence nécessaires à l’étude des résonateurs et oscillateurs ultra-stables. Le deuxième chapitre estconsacré à un résumé de la littérature sur le bruit de fréquence en 1/f. Ensuite, le troisième chapitre concerne nos étudessur le modèle quantique de bruit en 1/f du Pr. Handel, qui, bien que critiqué par beaucoup, est encore le seul qui fournitune estimation de l'amplitude de plancher de bruit en 1/f et qui n'est pas infirmé par les données expérimentales. Dans lequatrième chapitre, une autre approche, basée sur le théorème de fluctuation-dissipation, est utilisée afin de mettre descontraintes numériques sur un modèle de bruit en 1/f causé par une dissipation interne (ou de structure) proportionnelleà l'amplitude, et non à la vitesse. Le dernier chapitre est consacré aux résultats expérimentaux. Le design et lesparamètres du résonateur ultra-stable utilisé lors de cette étude sont décrits. Les mesures de bruit de phase sur plusieurslots de résonateurs sont données. Les mesures des paramètres de résonateur ont été effectuées à basse température afinde les corréler avec les résultats de bruit. Afin d'évaluer rapidement la qualité des différents résonateurs, une autreapproche dans le domaine temporel a été testée. Elle utilise des oscillations pseudo-périodiques transitoires mettant lesoscilloscopes numériques actuellement disponibles à leurs limites de capacité. Enfin, les conclusions et perspectivessont présentées. / Since a few decades, frequency control technology has been at the heart of modern day electronics due to its huge areaof applications in communication systems, computers, navigation systems or military defense. Frequency controldevices provide high frequency stabilities and spectral purities in the short term domain. However, improvement of theperformance of these devices, in terms of frequency stability, remains a big challenge for researchers. Reducing noise inorder to increase the short term stability and avoid unwanted switching between channels is thus very desirable. It iscommonly admitted that the fundamental limitation to this short-term stability is due to flicker frequency noise in theresonators. In this manuscript, a first chapter recalls some basic facts about acoustic, crystallography and definitions oftime and frequency domain needed to explore ultra-stable resonators and oscillators. The second chapter is devoted to asummary of the literature on flicker frequency noise. Then, the third chapter concerns our studies on Handel’s quantum1/f noise model, which although criticized by many, is still the only one that provides an estimation of the flooramplitude of 1/f noise that is not invalidated by experimental data. In the fourth chapter, another approach, based on thefluctuation-dissipation theorem, is used in order to put numerical constraints on a model of 1/f noise caused by aninternal (or structural) dissipation proportional to the amplitude and not to the speed. The last chapter is devoted toexperimental results. An ultra-stable resonator used during this study is described. Phase noise measurements on severalbatches of resonators are given. Measurements of resonator parameters have been done at low temperature in order tocorrelate them with noise results. Another approach with a procedure that use transient pseudo periodic oscillations andput to their limits the capacities of presently available digital oscilloscopes, is presented, in order to assess rapidly thequality of various resonators. Finally, conclusions and perspectives are given.