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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
881

Från 2D till 3D : Reflektioner kring arbetsprocessen bakom filmtrailern till Gabriel Glömmer

Högnäs, Jerry January 2008 (has links)
<p>Detta är en reflexiv rapport om arbetsmetoden bakom skapandet av en filmtrailer som ska marknadsföra den fiktiva filmen om Gabriel Glömmer baserad på en bok av Ulf Löfgren. Boken handlar om en tillbakadragen pojke med en livlig fantasi som drömmer sig till en sagovärld där han får uppleva äventyr och möta nya vänner. Texten har ett fokus på skapandet av miljöer i 3D, med mål att behålla den grafiska stilen från 2D illustrationer som finns i boken. Resultatet av projektet är en filmtrailer med längden 1 minut och 40 sekunder. Filmtrailerns bilder har en uppbyggnad som försöker efterlikna de illustrationer som finns i boken.</p>
882

Μελέτη και ανάπτυξη αλληλεπιδραστικών χαρακτήρων για την ενσωμάτωσή τους σε περιβάλλον εικονικού μουσείου

Δημητρόπουλος, Λουκάς-Κίμωνας 08 February 2010 (has links)
Η διπλωματική αυτή εργασία εκπονήθηκε στο Εργαστήριο της Ερευνητικής Ομάδας Αλληλεπίδρασης Ανθρώπου-Υπολογιστή του Τμήματος Ηλεκτρολόγων Μηχανικών και Τεχνολογίας Πατρών του Πανεπιστημίου Πατρών. Στόχος της εργασίας είναι η μελέτη και η ανάπτυξη δύο εικονικών χαρακτήρων, μιας ξεναγού και ενός παιδιού-επισκέπτη, καθώς και των συμπεριφορών τους, με αποτέλεσμα την ενσωμάτωσή τους σε μια εφαρμογή ενός εικονικού μουσείου. Ο χρήστης της εφαρμογής-επισκέπτης του μουσείου θα μπορεί να περιηγείται στους χώρους του, να αλληλεπιδρά με τα αντικείμενα του μουσείου και να πληροφορείται με τη βοήθεια της εικονικής ξεναγού σχετικά με αυτά. Το μουσείο στο οποίο αναφέρεται η διπλωματική εργασία είναι το “Μουσείο Σολωμού και Επιφανών Ζακυνθίων” που βρίσκεται στην Ζάκυνθο. / -
883

Three-dimensional pavement surface texture measurement and statistical analysis

Liu, Qingfan 09 January 2016 (has links)
Pavement texture has been measured predominantly by using two-dimensional (2D) profile methods. The 2D profile based mean profile depth (MPD) is still the well accepted texture index which has been found inadequate to characterize pavement texture especially when tire/pavement friction and noise are involved. There is a lack of standard 3D texture indices which show strong correlation with pavement friction and noise. There is a need to use 3D texture measurement for more comprehensive understanding of texture. The objectives of this thesis are to characterize pavement surfaces using 3D texture parameters based on 3D texture measurement and to explore the relationship between 3D texture parameters, pavement friction, and pavement noise. Field tests are conducted at various pavement sections for the measurements of texture, friction, and noise. The tested pavements include Interstate highway, MnROAD test facilities, airport runway, and municipal streets. The findings and contributions of this thesis are: • The pavement surface texture is measured in a 3D manner by using a line-laser scanner with both horizontal sample interval and vertical accuracy better than 0.05 mm. • A 3D texture analysis procedure with discrete wavelet transform (DWT) is proposed to separate macrotexture from microtexture and to define texture indices independently. • 3D parameters for macrotextures and microtexture are proposed and verified by field tests. • The relationship between 3D and 2D macrotexture indices [i.e. SMTD and MPD; Sq and root mean square roughness (RMSR)] are established, which is useful for the purposes of data comparison between 3D and 2D methods. • The relationship is investigated between 3D macrotexture parameters (SMTD and Sq) and pavement friction and noise. • It is found that texture distribution indices (i.e. Ssk and Sku) are significant contributors to pavement friction and noise. The new 3D texture analysis procedure and texture indices proposed in this thesis can be used to characterize various pavement textures (concrete pavement, asphalt pavement, and pavement contains recycled materials) in 3D manner, to compare 3D with 2D texture measurement/indices for quality control purposes, and to evaluate and predict pavement friction and noise. / February 2016
884

Development of a Framework for 3D Dynamic User Interface Applications in Vehicles

Santoso, Bramastyo Harimukti 22 January 2016 (has links) (PDF)
The automotive industry today is getting more and more competitive with accelerating demand to attract car consumer with new technologies. Three-dimensional user interfaces (3D UIs) support user tasks in many non-traditional interactive systems such as augmented reality and virtual environments. Although 3D UI researchers and developers have been successfully identified basic user tasks, evaluating the usability of 3D interaction techniques, as well as finding an improvement of the usability of many applications, the researches and developments are still in the direction of finding better approaches and to be more innovative to fulfill the demands in the context of automotive user interface. The concept of a framework presented in this master thesis is to integrate technology of the Qt framework that is widely used for traditional 2D interfaces on different platforms and operating systems with the availability of open sources in order to realize the goal of having the ability to import the external 3D asset completely, specifically in FBX format by Autodesk that is widely used in the automotive industry. In addition, QML as part of the Qt framework that include JavaScript as an easy Object-Oriented scheme to manipulate object properties such as position and color of the graphical object is also integrated. The main aim of the framework is to have a full access to the imported FBX asset that is created by digital content creation applications such as Autodesk 3Ds Max or Autodesk Maya and visualize them within the Qt framework. With the newest technology of the Qt framework, it seems to be a promising solution to develop an interactive user interface. Hence, the framework approach of this master thesis is based on the Qt framework and Qt3D 2.0, in order to satisfy the requirements and introduces a solution to satisfy the demands in multimedia and 3D user experiences in the automotive industry. In the last fifteen years, Qt has proven as a robust development environment that produces powerful and stable software applications. Together with the abilities of Qt3D 2.0 that offers several abstract ways to control the rendering setup that helps the framework to realize the aim of this master thesis. This master thesis contains a detailed specification and concept for the development of a framework for 3D dynamic user interface application in vehicles. As the result of this master thesis, some typical use cases for automotive industry are realized as prototype applications in order to prove that the framework has the ability to load the 3D asset, specifically in FBX format, into the Qt framework and rendered together with the components of the Qt framework as an interactive and dynamic 3D user interface.
885

An application of photogrammetry in the petrochemical industry

Singels, Wynand 03 1900 (has links)
Thesis (MScEng (Mathematical Sciences. Applied Mathematics))--Stellenbosch University, 2008. / When building or improving a petrochemical plant, drawings are used extensively in the design process. However, existing petrochemical plants seldom match their drawings, or the drawings are lost, forcing the need to generate a 3D model of the structure of the plant. In this thesis photogrammetry is investigated as a method of generating a digital 3D model of an existing plant. Camera modeling, target extraction and 3D reconstruction are discussed in detail, and a real-world system is investigated.
886

Graphe de surface orientée : un modèle opérationnel de segmentation d'image 3D

Baldacci, Fabien 09 December 2009 (has links)
Dans ce travail nous nous intéressons à la segmentation d’image 3D. Le but est de définir un cadre permettant, étant donnée une problématique de segmentation, de développer rapidement un algorithme apportant une solution à cette problématique. Afin de ne pas être restreint à un sous ensemble des types de problématique de segmentation, ce cadre doit permettre de mettre en oeuvre efficacement les différentes méthodes et les différents critères de segmentation existants, dans le but de les combiner pour définir les nouveaux algorithmes. Ce cadre doit reposer sur un modèle de structuration d’image qui représente la topologie et la géométrie d’une partition et permet d’en extraire efficacement les informations requises. Dans ce document, les différentes méthodes de segmentation existantes sont présentées afin de définir un ensemble d’opération nécessaire à leur implémentation. Une présentation des modèles existants est faite pour en déterminer avantages et inconvénients, puis le nouveau modèle est ensuite défini. Sa mise en oeuvre complète est détaillée ainsi qu’une analyse de sa complexité en temps et en mémoire pour l’ensemble des opérations précédemment définies. Des exemples d’utilisation du modèle sur des cas concrets sont ensuite décrits, ainsi que les possibilités d’extension du modèle et d’implémentation sur architecture parallèle. / In this work we focus on 3D image segmentation. The aim consists in defining a framework which, given a segmentation problem, allows to design efficiently an algorithm solving this problem. Since this framework has to be unspecific according to the kind of segmentation problem, it has to allow an efficient implementation of most segmentation techniques and criteria, in order to combine them to define new algorithms. This framework has to rely on a structuring model both representing the topology and the geometry of the partition of an image, in order to efficiently extract required information. In this document, different segmentation techniques are presented in order to define a set of primitives required for their implementation. Existing models are presented with their advantages and drawbacks, then the new structuring model is defined. Its whole implementation including details of its memory consumption and time complexity for each primitives of the previously defined set of requirements is given. Some examples of use with real image analysis problems are described, with also possible extensions of the model and its implementation on parallel architecture.
887

Determinação de área, volume e massa em animais de interesse zootécnico / Determination of area, volume and massa in livestock

Simão, Bruno Rodrigo 05 December 2017 (has links)
Submitted by BRUNO RODRIGO SIMÃO null (bruno@ufersa.edu.br) on 2017-12-15T12:00:08Z No. of bitstreams: 1 Tese_Bruno_Rodrigo_Simao.pdf: 4039244 bytes, checksum: 1f0f7b13d757bcb95d5e59f2107310ea (MD5) / Approved for entry into archive by Alexandra Maria Donadon Lusser Segali null (alexmar@fcav.unesp.br) on 2017-12-15T16:22:44Z (GMT) No. of bitstreams: 1 simão_br_dr_jabo.pdf: 4039244 bytes, checksum: 1f0f7b13d757bcb95d5e59f2107310ea (MD5) / Made available in DSpace on 2017-12-15T16:22:44Z (GMT). No. of bitstreams: 1 simão_br_dr_jabo.pdf: 4039244 bytes, checksum: 1f0f7b13d757bcb95d5e59f2107310ea (MD5) Previous issue date: 2017-12-05 / Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) / Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES) / A fim de utilizar a modelagem tridimensional (3D) para estimar área, volume e massa, bem como avaliar o impacto dos desvios envolvidos nas equações empíricas disponíveis na literatura, em animais, foram utilizados seis ovinos Corriedale tosqueados com massa entre 10 e 105 kg e cinco bovinos Nelore com massa entre 600 a 800 kg. Os animais foram treinados utilizando os princípios de habituação e condicionamento, a fim de reduzir a reatividade dos animais. Para medição da área de superfície, utilizaram-se basicamente três procedimentos: equação empírica (EE) para cada espécie, instrumento manual de medição (IMM) e modelagem 3D do animal por fotogrametria (AR) e escaneamento com sensor kinect (AS_KS). Foi realizada uma análise de covariância, sendo a massa a covariável e uma análise de regressão não linear foi ajustada como uma função potência (alometria). Analisando as médias de área de superfície, para ovinos, em relação aos procedimentos utilizados não houve diferença entre IMM e modelos 3D, bem como entre os modelos 3D, enquanto entre IMM e EE houve diferença significativa. Para os bovinos, observou-se que os procedimentos 3D foram, em média, superiores às estimativas de área de superfície pela EE (a=5%). Quando se plotou os dados de área de superfície, de ovinos, dos métodos testados em função da massa corporal, obteve-se aproximações empíricas distintas daquelas estimadas pela EE em mais de 11% para animais acima de 100kg, enquanto que para os bovinos a diferença média entre os modelos 3D e EE foi de mais de 18%. Como os ajustes das equações com IMM e por modelos 3D tiveram taxas de crescimento muito próximas e os desvios entre elas foram inferiores a 2%, constatou-se que o uso de modelos 3D foi ratificado. Quando se plotou os dados de ambas as espécies, observou-se excelentes ajustes (R²=0.99) e estimativas consistentes com aquelas obtidas pelas equações específicas para cada raça, com desvios inferiores a 3,2%. Outras relações, como volume em função da área de superfície, foram estabelecidas, resultando em aproximações consistentes quando utilizada para estimar o volume do animal. Quando se considerou o animal como um Cilindro Horizontal Padrão (CHP), sua área de superfície foi estimada, em média, 36% abaixo daquelas observadas para os modelos 3D e IMM. Por meio da simulação da transferência de calor por convecção, obteve-se uma diferença de mais 56% na taxa de convecção quando se considerou o animal como um CHP em relação aos modelos 3D e cilindro horizontal completo (CHC). Quando se relacionou as informações das imagens bidimensionais (2D) com as informações dos modelos 3D, foi possível encontrar equações para estimar área, volume e massa dos animais. Outra abordagem que ficou constatada foi a utilização de modelos 3D para avaliação em melhoramento genético, como pelo método EPMURAS. O uso de modelos 3D para estimar a área de superfície e volume em animais foi validado. O método parece ser o melhor meio para estimar a área de superfície e volume, e certamente aparece como uma ferramenta para melhorar as pesquisas envolvendo transferência de calor e massa, bem como o melhoramento genético. / In order to use three-dimensional (3D) modeling to estimate area, volume and mass, as well as to evaluate the impact of the deviations involved in the empirical equations available in the literature, in livestock, six shorn Corriedale sheep were weighed with mass between 10 and 105 kg and five Nelore cattle with mass between 600 and 800 kg. The animals were trained using the principles of habituation and conditioning in order to reduce the reactivity of the animals. For the measurement of the surface area, three procedures were used: empirical equation (EE) for each species, manual measurement instrument (IMM) and 3D animal modeling by photogrammetry (AR) and kinect sensor (AS_KS) scanning. A covariance analysis was performed, with the mass being covariable and a non-linear regression analysis was adjusted as a power function (allometry). Analyzing the surface area averages for sheep, in relation to the procedures used there was no difference between IMM and 3D models, as well as between 3D models, while between IMM and EE there was a significant difference. For cattle, it was observed that the 3D procedures were, on average, higher than the surface area estimates by EE (a=5%). When data were plotted on the surface area of sheep and the methods tested for body mass, empirical approximations were obtained, different from those estimated by EE in more than 11% for animals over 100 kg, while for cattle the difference between 3D and EE models was over 18%. As the adjustments of the equations with IMM and 3D models had very close growth rates and deviations between them were lower than 2%, it was verified that the use of 3D models was ratified. When plotting the data of both species, we observed excellent adjustments (R² = 0.99) and estimates consistent with those obtained by the specific equations for each breed, with deviations lower than 3.2%. Other relationships, such as volume versus surface area, were established, resulting in consistent approximations when used to estimate the volume of the animal. When the animal was considered as a Standard Horizontal Cylinder (CHP), its surface area was estimated, on average, 36% lower than those observed for the 3D and IMM models. Simulation of the heat transfer by convection gave a difference of 56% in the convection rate when the animal was considered as a CHP in relation to the 3D models and the full horizontal cylinder (HCC). When the information of the two-dimensional images (2D) was related to the information of the 3D models, it was possible to find equations to estimate area, volume and mass of the animals. Another approach that was verified was the use of 3D models for evaluation in genetic improvement, as by the EPMURAS method. The use of 3D models to estimate surface area and volume in animals was validated. The method seems to be the best medium for estimating surface area and volume, and it certainly appears as a tool to improve research involving heat and mass transfer as well as genetic improvement. / CAPES 1367458 / CAPES 1443570 / CAPES 1707637 / CNPq 166449/2017-2
888

Génération de cellules souches pluripotentes induites de patients Alzheimer et production d'un modèle de culture en trois dimensions de neurones pour les recherches diagnostiques et thérapeutiques de la maladie d’Alzheimer / Generation of Alzheimer´s disease (AD) patients' induced pluripotent stem cells (iPSC) derived neurons and production of a three-dimensional culture of neural networks for diagnostic and therapeutic research of AD

Auboyer, Laura 06 April 2018 (has links)
La maladie d’Alzheimer est une maladie très complexe, aujourd’hui encore mal comprise et cette démence est devenue un réel problème de santé publique. La protéine précurseur de l’amyloïde (APP) et la protéine Tau sont deux acteurs majeurs impliqués dans la maladie. De nombreuses recherches se sont investies dans la compréhension du métabolisme, de l’action et de l’implication de ces deux protéines dans les mécanismes pathologiques de la maladie et d’autres maladies neurodégénératives. Elles sont notamment l’objet de la plupart des approches thérapeutiques passées et actuelles, et étudiées pour le diagnostic biologique de la maladie. Dans ce projet de thèse, notre objectif fut d’explorer le métabolisme des protéines APP et Tau au cours de la différenciation neuronale à l’aide d’outils biochimiques et de systèmes innovants d’immunodétection multiplex très sensibles (MSD®) dans plusieurs modèles de culture cellulaire de la maladie. L’objectif était d’obtenir une vision globale des processus physiopathologiques au travers d’analyses d’échantillons générés au cours de la différenciation neuronale de cellules souches pluripotentes induites (iPSC) de patients Alzheimer comparées aux cellules souches embryonnaires humaines (hESC). Nous avons ainsi généré et caractérisé plusieurs lignées cellulaires d’IPSC d’une personne saine contrôle et de patients atteints des formes sporadiques et familiales de la maladie. Ce projet offre l’opportunité unique de combiner des approches innovantes pour tenter de comprendre comment les fragments et les peptides Ab sont générés, ainsi que les modifications de Tau en conditions normales et pathologiques. / Amyloid precursor protein (APP) and Tau protein are two main molecular actors of the Alzheimer’s disease (AD), which is of prime importance in Human Health. Intensive research is ongoing to understand these proteins’ metabolism, action and implication in the pathological mechanism of these affections. They are the target of most therapeutic approaches and are used for biological diagnosis. In the present PhD project, our objective was to investigate neuronal APP and Tau protein processing and metabolism using biochemical tools and innovative multiplex immunodetection system (MSD®) in diverse cell culture models of AD. The goal was to get a comprehensive view oh physiopathological processes based on the analysis of samples generated in neuronal differentiated human embryonic stem cell and induced pluripotent stem cells derived from AD-patients. We generated several cell lines from an healthy control individual, and AD patients showing sporadic and familial forms of the disease. This project offer the unique opportunity to combine state-to-the-art approaches to understand how the APP fragments and peptides are generated as well as the modifications of the Tau protein in normal and pathological situation.
889

Etude et optimisation de capacités MIM 3D à haute densité d'énergie fortement intégrées sur silicium / Study and optimization of 3D MIM capacitors highly integrated on silicon substrate with high energy storage

Madassamy, Sandrine 24 June 2016 (has links)
Le stockage de l’énergie reste une problématique majeure pour le développement d’objets embarqués (Internet of Things) à faible facteur de forme. En effet, pour le stockage et la restitution d’énergie électrique, les dispositifs les plus couramment utilisés sont les batteries, les supercondensateurs et les condensateurs électrochimiques ou céramiques. Toutefois, le contexte de la miniaturisation nécessite de fabriquer des systèmes de stockage à forte densité d’intégration, compatibles avec des techniques d’intégration de type SIP (System in Package) et ultimement SoC (System on Chip). Or, les technologies connues dans l’art antérieur produisent des composants à forte épaisseur, via des filières technologiques exotiques, incompatibles avec une co-intégration directe sur des composants silicium. Pour répondre à ces exigences, nous proposons une nouvelle approche pour l’intégration de condensateurs de très faible épaisseur sur silicium. Ces condensateurs présentent une meilleure fiabilité et de meilleures performances en linéarité que les condensateurs céramiques et peuvent stocker une densité énergétique proche de celle d’un condensateur électrochimique.Cette thèse est axée sur la conception, le développement, la réalisation, la caractérisation électrique et fiabilité de capacités MIM (Métal/Isolant/Métal) à forte densité d’intégration et présentant une forte densité énergétique. Ces condensateurs sont modelés dans une nanostructure poreuse ordonnée et développée par un procédé électrochimique. Cette nanostructure 3D permet de décupler la surface spécifique développée, par rapport à une structure planaire simple ou une microstructure 3D telle qu’actuellement exploitée par la société IPDIA. Ce nanocomposant MIM comportant un isolant à base d’alumine, déposé par ALD (Atomic Layer Deposition) d’une épaisseur variant entre 15nm et 21nm. Pour cette gamme d’épaisseur, une densité de capacité de l’ordre de 200nF/mm² à 300nF/mm² est obtenue sur une simple structure MIM, avec un champ de claquage de l’ordre de 7MV/cm et une densité d’énergie volumique maximale de 1.3mWh/cm3. Cette dernière valeur est supérieure d’une décade aux technologies actuellement exploitées par la société IPDIA. Une attention particulière a été apportée à la réduction des parasites de la structure, et lui permettant ainsi de répondre à des transitions rapide en courant. Pour cela, la résistance série de ces structures a été optimisée par l’amélioration du contact entre les nanostructures MIM et les électrodes externes. La stabilité de la capacité MIM en température et en tension est comparable aux performances des technologies de référence IPDIA (respectivement avec un coefficient thermique de 193ppm/°C et un coefficient de tension de 489 ppm/V2), lesquelles sont basées sur une structure composite de type ONO (multicouche oxyde-nitrure). Elle est par ailleurs meilleure que celle observée pour les condensateurs céramiques multicouches disponibles sur le marché. Notre capacité présente également, une excellente robustesse en température et a été utilisée jusqu’à 375°C. Les performances démontrées sur les prototypes réalisés au cours de ce travail, permettent d’envisager un vaste domaine d’applications, incluant des applications de stockage, de filtrage de rails d’alimentation, de mise en forme de signaux analogiques et de puissance. Le niveau de maturité atteint sur les premiers démonstrateurs permet d’envisager un transfert industriel dans les mois à venir. / The energy storage components remain one of the limiting features for scaling of the Internet of Things objects. Indeed, the storage devices nowadays available as batteries, supercapacitors and electrochemical or ceramic capacitors are still quite bulky and remain incompatible with reduced aspect ratio, while roadmap toward miniaturization requires concept with high integration density compatible with integration techniques like SiP ((System in Package) and on longer term SoC (System on Chip). However, technologies known from the prior art, produce components with too large thickness, inflexible shape (mostly circular or rectangular), through exotic technologies that are incompatible with direct co-integration on silicon components. To overcome those limitations, we have proposed a novel approach for the integration of very low thickness capacitors. Those capacitors have better reliability and stability performances than ceramic capacitors and are able to store energy density approaching electrochemical capacitor.This thesis is focused on the development of the capacitive structure, the processing steps, its electrical and reliability characterization and finally the electrical optimization of MIM (Metal/Isolator/Metal) capacitors. Those capacitive structures are based on a porous and self-arranged nano-template obtained by an electrochemical process. Those nanostructures allow to increase the specific surface density with respect to conventional planar or microstructures that are currently exploited by IPDIA. The MIM structure consists of alumina dielectric, deposited by ALD (Atomic Layer Deposition) with a thickness between 15nm and 21nm. For this thickness, capacitance density is obtained in the range of 200nF/mm² and 300nF/mm² for a simple MIM nanostructure, with a breakdown field about 7 MV/cm and a maximum volumetric energy density of about 1.3mWh/cm3. This last value corresponds to a decade higher with respect to current IPDIA technologies. A specific optimization has been conducted to reduce structure parasitic, and thus enable faster current transition on switching events. For that, a technic to reduce the serial resistance between the MIM nanostructure and the external electrodes has been investigated. The temperature and voltage linearity of this MIM capacitor is on par with actual IPDIA reference technologies (respectively thermal coefficient of 193ppm/°C and quadratic voltage coefficient of 489 ppm/V²), which are based on an ONO composite dielectric (multi-layer nitride oxide). This performance is outperforming the Multi-Layer Ceramic Capacitors that are currently used for equivalent application. Furthermore, demonstration of operation up to 375°C has been demonstrated for this structure. With these capacitors it is envisioned to address a large span of applications, ranging from energy storage, to filtering of power rails, or analogic and power signal conditioning. The maturity obtained on demonstrators allows to envisage an industrial transfer in the coming months.
890

Fabrication de CMOS à basse température pour l'intégration 3D séquentielle / Low thermal budget CMOS processing for 3D Sequential Integration

Lu, Cao-Minh 24 October 2017 (has links)
Alors que la miniaturisation des transistors suivant la loi de Moore semble ralentir dû à des limites physique, technologique et économique, il devient essentiel de trouver des alternatives afin de répondre à la demande croissante en électronique : informatique et télécommunication, objets intelligents et interconnectés, domaine médical et biologique… En cela, l’utilisation de la troisième dimension, par opposition à la fabrication planaire de composants électrique, semble être une option prometteuse. L’intégration 3D permet en effet d’incorporer plus de composants sur une même surface en les empilant à un coût technologique et économique plus faibles que celui de la miniaturisation. En particulier, l’intégration séquentielle ou CoolCubeTM au CEA-Leti permet de profiter pleinement de la troisième dimension en fabriquant successivement les uns sur les autres chaque étage d’une puce, permettant un alignement optimal des transistors unitaires à chaque niveau. Néanmoins, plusieurs verrous technologiques particuliers à l’intégration 3D Séquentielle doivent alors être levés.Dans ce manuscrit, nous nous intéresserons à la réduction du budget thermique pour la fabrication des transistors supérieurs, nécessaire afin de ne pas endommager les étages inférieurs lors de la réalisation des composants sus-jacents. Nous commencerons par définir le budget thermique maximal afin de ne pas dégrader les couches inférieures avant d’identifier les briques technologiques impactées lors de la fabrication d’un transistor. Nous verrons alors dans ce manuscrit qu’il sera non seulement nécessaire d’étudier de nouveaux matériaux, mais aussi de nouveaux procédés voire de nouvelles techniques de recuit. Plus particulièrement, nous évaluerons tout d’abord l’utilisation des diélectriques low-k comme espaceurs de grille permettant notamment d’améliorer les performances dynamiques des composants. Ensuite, nous présenterons différentes stratégies de préparation de surface et de croissance épitaxiale à basse température pour la réalisation des sources et drains surélevés. Enfin, nous étudierons l’impact d’un budget thermique faible ainsi que de nouvelles techniques de recuits micro-onde et laser sur les propriétés de l’empilement de grille. Nous verrons en particulier que la difficulté principale d’une intégration à bas budget thermique est l’obtention d’une bonne fiabilité des transistors. Toute cette étude nous permettra alors de proposer des solutions à l’intégration d’un transistor à un bas budget thermique compatible avec l’intégration 3D Séquentielle. / As the scaling of transistors following Moore’s law seems to slow down due to physical, technological and economical barriers, it becomes mandatory to find alternatives to cope with the increasing demand in electronics: computing and telecommunication, smart and interconnected objects, medical and biological fields… To that end, the use of the third dimension, in opposition to the planar processing of electronical devices, appears to be a promising option. Indeed, 3D integration allows incorporating more devices per area by stacking them at a lower technological and economical cost than scaling. More specifically, 3D sequential or CoolCubeTM at CEA-Leti allows benefiting fully from the third dimension by processing successively one on top of each other each level of a die, allowing an optimal alignment of single transistors at each layer. However, several technological barriers specific to 3D Sequential Integration need then to be alleviated.In this work, we will study the reduction of thermal budget for the transistors fabrication, which is required to not damage bottom levels during the processing of top devices. First, we will define the maximal thermal budget in order not to degrade bottom layers prior to identifying the technological modules impacted during the fabrication of a transistor. We will then see in this work that not only new materials need to be studied, but also new processes and new annealing techniques. Specifically, we will first evaluate the use of low-k dielectrics as gate offset spacers, allowing the improvement of devices dynamic performance. Then we will present different strategies of surface preparation and epitaxial growth at low temperature for the formation of raised sources and drains. Finally, we will study the impact of a low thermal budget process flow along with novel microwaves and laser annealing techniques on the gate stack properties. In particular, we will see that the biggest challenge in a low thermal budget integration is to get a good reliability of transistors. This study leads to a proposed low thermal budget process flow for transistor fabrication compatible with 3D Sequential Integration.

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