Image sensors play a vital role in many image sensing and capture applications. Among the various types of image sensors, complementary metal oxide semiconductor (CMOS) based active pixel sensors (APS), which are characterized by reduced pixel size, give fast readouts and reduced noise. APS are used in many applications such as mobile cameras, digital cameras, Webcams, and many consumer, commercial and scientific applications. With these developments and applications, CMOS APS designs are challenging the old and mature technology of charged couple device (CCD) sensors. With the continuous improvements of APS architecture, pixel designs, along with the development of nanometer CMOS fabrications technologies, APS are optimized for optical sensing. In addition, APS offers very low-power and low-voltage operations and is suitable for monolithic integration, thus allowing manufacturers to integrate more functionality on the array and building low-cost camera-on-a-chip. In this thesis, I explore the current state-of-the-art of CMOS APS by examining various types of APS. I show design and simulation results of one of the most commonly used APS in consumer applications, i.e. photodiode based APS. We also present an approach for technology scaling of the devices in photodiode APS to present CMOS technologies. Finally, I present the most modern CMOS APS technologies by reviewing different design models. The design of the photodiode APS is implemented using commercial CAD tools.

Rapid progress over the last decade on large area thin film transistor (TFT) arrays led to the emergence of high-performance, low-power, low-cost active matrix flat panel imagers. Despite the shortcomings associated with the instability and low mobility of TFTs, the amorphous silicon TFT technology still remains the primary solution for the backplane of flat panel imagers. The use of a-Si:H TFTs as the building block of the large area integrated circuit becomes challenging particularly when the role of the TFT is extended from traditional switching applications to on-pixel signal amplifier for large area digital imaging. This is the idea behind active pixel sensor (APS) architectures in which under each pixel an amplifier circuit consisting of one or two switching TFTs integrated with one amplifying TFT is fabricated. To take advantage of the full potential of these amplifiers, it is crucial to develop APS architectures to compensate for the limitations of the TFTs. In this thesis several APS architectures are designed, simulated, fabricated, and tested addressing these challenges using the mask sets presented in Appendix A. The proposed APS architectures can compensate for inherent stabilities of the comprising TFTs. Therefore, the sensitivity of their output data to the transistor variations is significantly suppressed. This is achieved by using a well defined external current source instead of the traditional voltage source to reset the APS architectures during the reset cycle of their periodic operation. The performance of these circuits is analyzed in terms of their stability, settling time, noise, and temperature-dependence. For appropriate readout of the current mode APS architectures, high gain transresistance amplifiers with correlated double sampling capability is designed, simulated and fabricated in CMOS technology. Measurement and measurement based calculation results reveal that the proposed APS architectures can meet even the stringent requirements of low noise, real-time digital fluoroscopy.

Rapid progress over the last decade on large area thin film transistor (TFT) arrays led to the emergence of high-performance, low-power, low-cost active matrix flat panel imagers. Despite the shortcomings associated with the instability and low mobility of TFTs, the amorphous silicon TFT technology still remains the primary solution for the backplane of flat panel imagers. The use of a-Si:H TFTs as the building block of the large area integrated circuit becomes challenging particularly when the role of the TFT is extended from traditional switching applications to on-pixel signal amplifier for large area digital imaging. This is the idea behind active pixel sensor (APS) architectures in which under each pixel an amplifier circuit consisting of one or two switching TFTs integrated with one amplifying TFT is fabricated. To take advantage of the full potential of these amplifiers, it is crucial to develop APS architectures to compensate for the limitations of the TFTs. In this thesis several APS architectures are designed, simulated, fabricated, and tested addressing these challenges using the mask sets presented in Appendix A. The proposed APS architectures can compensate for inherent stabilities of the comprising TFTs. Therefore, the sensitivity of their output data to the transistor variations is significantly suppressed. This is achieved by using a well defined external current source instead of the traditional voltage source to reset the APS architectures during the reset cycle of their periodic operation. The performance of these circuits is analyzed in terms of their stability, settling time, noise, and temperature-dependence. For appropriate readout of the current mode APS architectures, high gain transresistance amplifiers with correlated double sampling capability is designed, simulated and fabricated in CMOS technology. Measurement and measurement based calculation results reveal that the proposed APS architectures can meet even the stringent requirements of low noise, real-time digital fluoroscopy.

Abstract Research on X-ray imaging sensors and systems have been carried out for several decades. To make these X-ray scanners smaller with better performance and higher operating speed is an important subject for scientific research and industrial applications. This thesis covers a whole X-ray line-scan camera system. Special attention is given to the smart sensor micromodule design and processing technology. The smart sensor micromodule is an integrated sensor card that includes both silicon X-ray sensor array and signal-processing integrated circuits, which can perform the functions of both an optical sensor and an analog signal processor. Digital signal processing (DSP) made by application specific integrated circuits (ASICs) is also covered in this thesis. Processing technology of the photodiode array, design of the integrated circuit, design and packaging of the micromodules are presented in this thesis. The mechanism of photodiode leakage current is studied in detail. Measured results show that the leakage current level of the photodiode array achieves 80 pA/cm2 under zero bias condition, which outperforms the best photodiode reported so far. The algorithm of the digital signal processing is also studied. The X-ray scanning system can achieve 2 m/s scanning speed with a spatial resolution of 400 mm.

No description available.

The goal of this work is to extend the state-of-the-art in digital medical X-ray imaging as it pertains to real-time, low-noise imaging and multi-mode imager functionality. One focus of this research in digital flat-panel imagers is to increase the detective quantum efficiency, particularly at low X-ray exposures, in order to enable low-noise imaging applications such as fluoroscopy or tomographic mammography. Another focus of this research is in the creation of a multi-mode imager, such as a combined radiographic and fluoroscopic (R&F) imager, which will reduce hospital costs, both in terms of equipment acquisition and storage space. To that end, we propose a novel three-transistor multi-mode digital flat-panel imager with a dynamic range capable for use in R&F applications, with a particular focus on noise optimization for low-noise real-time digital flat-panel X-ray fluoroscopy. This work involves the derivation and optimization of the total input referred noise of an active pixel sensor (APS) in terms of the on-pixel thin-film transistor device dimensions. It is determined that in order to minimize noise, all non-transistor capacitances at the pixel sense node needed to be minimized. This leads to a design where the on-pixel storage capacitance is eliminated; and instead the gate capacitance of the sense-node transistor is used to store the incoming X-ray converted charge. This work allows researchers to gain insight into the fundamental noise operation of active pixels used in medical imaging, and to appropriately choose device dimensions. Due to the inherent large feature sizes of thin-film transistors, active pixel flat-panel X-ray medical imagers offer lower resolution than their film-screen counterparts. By demonstrating the desirability of smaller device dimensions for reduced noise and the elimination of a storage capacitor, this research frees some of the area constraints that exist in active pixel flat-panel imagers, allowing for smaller pixels, and thus higher resolution medical imagers. The noise analysis and optimization as a function of pixel TFT device dimensions in this work is applicable to any amorphous silicon (a-Si) based charge-sensitive pixel, and is easily extended to other device technologies such as polysilicon (poly-Si). iv In addition, experimental results of a 64x64 pixel four-transistor APS imaging array fabricated in a-Si technology and mated with an a-Se photoconductor for use in medical X-ray imaging is presented. MTF results and transient response in the presence of X-rays (image lag) for the APS array are poor, which is ascribed to high charge trapping at the silicon nitride/a-Se interface. Improvements to the silicon nitride passivation layer and pixel layout are suggested to reduce this charge trapping. The prototype imager is compared directly with a state-of-the-art a-Si PPS imaging array and demonstrates good SNR performance for X-ray exposures down to 1.5μR. Pixel design and fabrication process improvements are suggested for low-exposure APS testing and improved low-noise performance.

The goal of this work is to extend the state-of-the-art in digital medical X-ray imaging as it pertains to real-time, low-noise imaging and multi-mode imager functionality. One focus of this research in digital flat-panel imagers is to increase the detective quantum efficiency, particularly at low X-ray exposures, in order to enable low-noise imaging applications such as fluoroscopy or tomographic mammography. Another focus of this research is in the creation of a multi-mode imager, such as a combined radiographic and fluoroscopic (R&F) imager, which will reduce hospital costs, both in terms of equipment acquisition and storage space. To that end, we propose a novel three-transistor multi-mode digital flat-panel imager with a dynamic range capable for use in R&F applications, with a particular focus on noise optimization for low-noise real-time digital flat-panel X-ray fluoroscopy. This work involves the derivation and optimization of the total input referred noise of an active pixel sensor (APS) in terms of the on-pixel thin-film transistor device dimensions. It is determined that in order to minimize noise, all non-transistor capacitances at the pixel sense node needed to be minimized. This leads to a design where the on-pixel storage capacitance is eliminated; and instead the gate capacitance of the sense-node transistor is used to store the incoming X-ray converted charge. This work allows researchers to gain insight into the fundamental noise operation of active pixels used in medical imaging, and to appropriately choose device dimensions. Due to the inherent large feature sizes of thin-film transistors, active pixel flat-panel X-ray medical imagers offer lower resolution than their film-screen counterparts. By demonstrating the desirability of smaller device dimensions for reduced noise and the elimination of a storage capacitor, this research frees some of the area constraints that exist in active pixel flat-panel imagers, allowing for smaller pixels, and thus higher resolution medical imagers. The noise analysis and optimization as a function of pixel TFT device dimensions in this work is applicable to any amorphous silicon (a-Si) based charge-sensitive pixel, and is easily extended to other device technologies such as polysilicon (poly-Si). iv In addition, experimental results of a 64x64 pixel four-transistor APS imaging array fabricated in a-Si technology and mated with an a-Se photoconductor for use in medical X-ray imaging is presented. MTF results and transient response in the presence of X-rays (image lag) for the APS array are poor, which is ascribed to high charge trapping at the silicon nitride/a-Se interface. Improvements to the silicon nitride passivation layer and pixel layout are suggested to reduce this charge trapping. The prototype imager is compared directly with a state-of-the-art a-Si PPS imaging array and demonstrates good SNR performance for X-ray exposures down to 1.5μR. Pixel design and fabrication process improvements are suggested for low-exposure APS testing and improved low-noise performance.

abstract: Due to diminishing availability of 3He, which is the critical component of neutron detecting proportional counters, large area flexible arrays are being considered as a potential replacement for neutron detection. A large area flexible array, utilizing semiconductors for both charged particle detection and pixel readout, ensures a large detection surface area in a light weight rugged form. Such a neutron detector could be suitable for deployment at ports of entry. The specific approach used in this research, uses a neutron converter layer which captures incident thermal neutrons, and then emits ionizing charged particles. These ionizing particles cause electron-hole pair generation within a single pixel's integrated sensing diode. The resulting charge is then amplified via a low-noise amplifier. This document begins by discussing the current state of the art in neutron detection and the associated challenges. Then, for the purpose of resolving some of these issues, recent design and modeling efforts towards developing an improved neutron detection system are described. Also presented is a low-noise active pixel sensor (APS) design capable of being implemented in low temperature indium gallium zinc oxide (InGaZnO) or amorphous silicon (a-Si:H) thin film transistor process compatible with plastic substrates. The low gain and limited scalability of this design are improved upon by implementing a new multi-stage self-resetting APS. For each APS design, successful radiation measurements are also presented using PiN diodes for charged particle detection. Next, detection array readout methodologies are modeled and analyzed, and use of a matched filter readout circuit is described as well. Finally, this document discusses detection diode integration with the designed TFT-based APSs. / Dissertation/Thesis / Doctoral Dissertation Electrical Engineering 2014

No description available.

Weak optical signals have to be measured in different fields of sciences including chemistry and biology. For example, very low levels of fluorescence emission should be detected from the spots on a DNA microarray that correspond to weakly expressed genes. High sensitivity charge-coupled devices (CCDs) are used in these applications. CCDs require special fabrication and are difficult to integrate with other circuits. CMOS is the technology used for fabrication of CPUs and other widely used digital components. CMOS is not optimized for light detection. CMOS circuits are however cheap, low power and can integrate several components. Active pixel sensor (APS) is the most common pixel structure for CMOS photodetector arrays. In this work we provide an accurate analysis of the APS signal using new models for the capacitance of the photodiode. We also provide a complete noise analysis of the pixel to calculate the SNR of the pixel and provide optimum operation points. We propose a new mode of operation for APS that can achieve at least l 0 dB higher SNR, than conventional APS, at light levels of less than 1 μW/cm^2. We fabricated several APS pixels in CMOS 0.18 μm technology and measured them to confirm the proposed analyzes. There are applications like fluorescence lifetime imaging that require both sensitivity and fast response. Photomultiplier tubes (PMTs) are commonly used in these applications to detect single photons in pico- to nano-seconds regime. PMTs are bulky and require high voltage levels. Avalanche photodiodes (APDs) are the semiconductor equivalent of PMTs. We have fabricated different APDs along with different peripheral circuitries in CMOS 0.18 μm technology. Our APDs have a 5.5 percent peak probability of detection of a photon at an excess bias of 2 V, and a 30 ns dead time, which is less than the previously reported results. The low price of CMOS makes modem diagnosis devices more available. The low power of CMOS leads to battery-driven hand-held imaging solutions, and its high integration leads to miniaturized imaging and diagnosis systems. A low-light-level CMOS imager paves the way for the future generation of biomedical diagnosis solutions. / Thesis / Doctor of Philosophy (PhD)