Aborda-se, nesse trabalho, o fenômeno de envelhecimento de transistores MOS por bias temperature instability (BTI), relevante fator de degradação da confiabilidade e de redução do tempo de vida de circuitos integrados CMOS. Uma nova modelagem matemática determinística para BTI é introduzida, proporcionando, rapidamente, informação acerca do desvio na tensão de limiar de um transistor em decorrência da ação de BTI. O modelo é, então, implementado em uma ferramenta comercial SPICE, com o intuito de se verificarem, através de simulações transientes, os efeitos de BTI em circuitos CMOS; nesse sentido, a abordagem determinística representa um enorme avanço em relação à modelagem estocástica tradicional, que, muitas vezes, não pode ser aplicada em simulações transientes de circuitos complexos, devido ao seu vultoso custo computacional. O fenômeno de alargamento de pulso induzido pela propagação (PIPB) de single event transients (SETs), verificado experimentalmente na literatura, é estudado e tido como resultado da ação de BTI nas bordas de subida e descida do pulso transiente. À vista disso, simula-se a propagação de um pulso SET injetado na entrada de uma cadeia de 10000 inversores lógicos de tecnologia PTM bulk 90nm, verificando a dependência do alargamento de pulso com a tensão de alimentação, com o tempo de estresse DC anterior à aplicação do pulso e com a frequência do sinal de entrada. O aumento do atraso de portas lógicas em decorrência da ação de bias temperature instability é abordado, também, através da simulação da aplicação de um pulso nas entradas de uma porta NAND, medindo-se a variação do tempo de atraso de propagação devido à inserção da modelagem matemática para BTI. Utiliza-se novamente o modelo de transistores PTM bulk 90nm, e apuram-se os efeitos da variação da tensão de alimentação e do tempo de estresse DC no tempo de atraso de propagação. Por fim, as disparidades na variação do atraso para as bordas de subida e descida de pulsos lógicos de nível alto-baixo-alto (“101”) e baixo-alto-baixo (“010”) são verificadas, sendo explicadas em termos do diferente impacto de BTI para os períodos de estresse e de relaxação e, também, para transistores PMOS e NMOS. / This work addresses the aging of MOS transistors by bias temperature instability (BTI), which is a key factor to the degradation of the reliability and of the lifetime of CMOS integrated circuits. A novel deterministic mathematical model is presented, providing fast information about the impact of BTI in the transistors threshold voltage shifts. The model is implemented in a commercial SPICE tool, in order to verify the effects of BTI in CMOS circuits through transient simulations; in this sense, the deterministic approach represents a great advance compared to the traditional stochastic modelling, that may result in prohibitively long transient simulations for complex circuits, due to its huge computation cost. The phenomenon of propagation induced pulse broadening (PIPB) of single event transients (SETs), verified experimentally in the literature, is studied and understood as the result of the BTI effect on the rising and falling edges of the transient pulse. Therefore, the propagation of a SET injected in the input of a 10,000-inverters chain is simulated, using the PTM bulk 90nm technology model, verifying the dependence of the pulse broadening on the supply voltage, on the DC stress time previous to the application of the pulse and on the input signal frequency. The increase of the propagation delay of logic gates due the action of bias temperature instability is also studied through the simulation of the injection of a pulse in the inputs of a NAND gate, and the variation of the propagation delay time due to the BTI effect is evaluated. The PTM bulk 90nm model is used once again, and the outcome of variations on the supply voltage and on the DC stress time on the propagation delay is measured. Finally, the disparities on the delay variation for the rising and falling edges of high-low-high (“101”) and low-high-low (“010”) input logic pulses are verified, and they are explained as the result of the different impact of BTI for the stress and recovery periods and also for PMOS and NMOS transistors.

O trabalho propõe um circuito para caracterização estatística do fenômeno Bias Temperature Instability (BTI). O circuito tem como base uma matriz de transistores para caracterização eficiente em larga escala de BTI. O design proposto visa o estudo da variabilidade de BTI dependente do tempo em dispositivos altamente miniaturizados. Para tanto se necessita medir centenas de dispositivos, a fim de se obter uma amostra estatisticamente significante. Uma vez que variações nos tempos de estresse e medida dos dispositivos podem gerar erros no processo de caracterização, o circuito implementa em chip (on-chip) o controle dos tempos de estresse e de medida, para que ocorra uma caracterização estatística precisa. O circuito de controle implementado faz com que todos dispositivos testados tenham os mesmos tempos de estresse e os mesmos tempos de recuperação (relaxamento). Desta forma, o circuito proposto melhora significantemente tanto a área utilizada quanto o tempo de medida, quando comparado a alternativas anteriormente implementadas. O leiaute do circuito foi realizado no novo nó tecnológico de 28 nanômetros do IMEC. / This work proposes an array-based evaluation circuit for efficient and massively parallel characterization of Bias Temperature Instability (BTI). This design is highly efficient when studying the BTI time-dependent variability in deeply-scaled devices, where hundreds of devices should be electrically characterized in order to obtain a statistically significant sample size. The circuit controls stress and measurement times for accurate statistical characterization, making sure all the devices characterized have the same stress and recovery times. It significantly improves both area and measurement time. The circuit layout is laid out in the new 28nm node IMEC technology.

O trabalho propõe um circuito para caracterização estatística do fenômeno Bias Temperature Instability (BTI). O circuito tem como base uma matriz de transistores para caracterização eficiente em larga escala de BTI. O design proposto visa o estudo da variabilidade de BTI dependente do tempo em dispositivos altamente miniaturizados. Para tanto se necessita medir centenas de dispositivos, a fim de se obter uma amostra estatisticamente significante. Uma vez que variações nos tempos de estresse e medida dos dispositivos podem gerar erros no processo de caracterização, o circuito implementa em chip (on-chip) o controle dos tempos de estresse e de medida, para que ocorra uma caracterização estatística precisa. O circuito de controle implementado faz com que todos dispositivos testados tenham os mesmos tempos de estresse e os mesmos tempos de recuperação (relaxamento). Desta forma, o circuito proposto melhora significantemente tanto a área utilizada quanto o tempo de medida, quando comparado a alternativas anteriormente implementadas. O leiaute do circuito foi realizado no novo nó tecnológico de 28 nanômetros do IMEC. / This work proposes an array-based evaluation circuit for efficient and massively parallel characterization of Bias Temperature Instability (BTI). This design is highly efficient when studying the BTI time-dependent variability in deeply-scaled devices, where hundreds of devices should be electrically characterized in order to obtain a statistically significant sample size. The circuit controls stress and measurement times for accurate statistical characterization, making sure all the devices characterized have the same stress and recovery times. It significantly improves both area and measurement time. The circuit layout is laid out in the new 28nm node IMEC technology.

Aborda-se, nesse trabalho, o fenômeno de envelhecimento de transistores MOS por bias temperature instability (BTI), relevante fator de degradação da confiabilidade e de redução do tempo de vida de circuitos integrados CMOS. Uma nova modelagem matemática determinística para BTI é introduzida, proporcionando, rapidamente, informação acerca do desvio na tensão de limiar de um transistor em decorrência da ação de BTI. O modelo é, então, implementado em uma ferramenta comercial SPICE, com o intuito de se verificarem, através de simulações transientes, os efeitos de BTI em circuitos CMOS; nesse sentido, a abordagem determinística representa um enorme avanço em relação à modelagem estocástica tradicional, que, muitas vezes, não pode ser aplicada em simulações transientes de circuitos complexos, devido ao seu vultoso custo computacional. O fenômeno de alargamento de pulso induzido pela propagação (PIPB) de single event transients (SETs), verificado experimentalmente na literatura, é estudado e tido como resultado da ação de BTI nas bordas de subida e descida do pulso transiente. À vista disso, simula-se a propagação de um pulso SET injetado na entrada de uma cadeia de 10000 inversores lógicos de tecnologia PTM bulk 90nm, verificando a dependência do alargamento de pulso com a tensão de alimentação, com o tempo de estresse DC anterior à aplicação do pulso e com a frequência do sinal de entrada. O aumento do atraso de portas lógicas em decorrência da ação de bias temperature instability é abordado, também, através da simulação da aplicação de um pulso nas entradas de uma porta NAND, medindo-se a variação do tempo de atraso de propagação devido à inserção da modelagem matemática para BTI. Utiliza-se novamente o modelo de transistores PTM bulk 90nm, e apuram-se os efeitos da variação da tensão de alimentação e do tempo de estresse DC no tempo de atraso de propagação. Por fim, as disparidades na variação do atraso para as bordas de subida e descida de pulsos lógicos de nível alto-baixo-alto (“101”) e baixo-alto-baixo (“010”) são verificadas, sendo explicadas em termos do diferente impacto de BTI para os períodos de estresse e de relaxação e, também, para transistores PMOS e NMOS. / This work addresses the aging of MOS transistors by bias temperature instability (BTI), which is a key factor to the degradation of the reliability and of the lifetime of CMOS integrated circuits. A novel deterministic mathematical model is presented, providing fast information about the impact of BTI in the transistors threshold voltage shifts. The model is implemented in a commercial SPICE tool, in order to verify the effects of BTI in CMOS circuits through transient simulations; in this sense, the deterministic approach represents a great advance compared to the traditional stochastic modelling, that may result in prohibitively long transient simulations for complex circuits, due to its huge computation cost. The phenomenon of propagation induced pulse broadening (PIPB) of single event transients (SETs), verified experimentally in the literature, is studied and understood as the result of the BTI effect on the rising and falling edges of the transient pulse. Therefore, the propagation of a SET injected in the input of a 10,000-inverters chain is simulated, using the PTM bulk 90nm technology model, verifying the dependence of the pulse broadening on the supply voltage, on the DC stress time previous to the application of the pulse and on the input signal frequency. The increase of the propagation delay of logic gates due the action of bias temperature instability is also studied through the simulation of the injection of a pulse in the inputs of a NAND gate, and the variation of the propagation delay time due to the BTI effect is evaluated. The PTM bulk 90nm model is used once again, and the outcome of variations on the supply voltage and on the DC stress time on the propagation delay is measured. Finally, the disparities on the delay variation for the rising and falling edges of high-low-high (“101”) and low-high-low (“010”) input logic pulses are verified, and they are explained as the result of the different impact of BTI for the stress and recovery periods and also for PMOS and NMOS transistors.

Aborda-se, nesse trabalho, o fenômeno de envelhecimento de transistores MOS por bias temperature instability (BTI), relevante fator de degradação da confiabilidade e de redução do tempo de vida de circuitos integrados CMOS. Uma nova modelagem matemática determinística para BTI é introduzida, proporcionando, rapidamente, informação acerca do desvio na tensão de limiar de um transistor em decorrência da ação de BTI. O modelo é, então, implementado em uma ferramenta comercial SPICE, com o intuito de se verificarem, através de simulações transientes, os efeitos de BTI em circuitos CMOS; nesse sentido, a abordagem determinística representa um enorme avanço em relação à modelagem estocástica tradicional, que, muitas vezes, não pode ser aplicada em simulações transientes de circuitos complexos, devido ao seu vultoso custo computacional. O fenômeno de alargamento de pulso induzido pela propagação (PIPB) de single event transients (SETs), verificado experimentalmente na literatura, é estudado e tido como resultado da ação de BTI nas bordas de subida e descida do pulso transiente. À vista disso, simula-se a propagação de um pulso SET injetado na entrada de uma cadeia de 10000 inversores lógicos de tecnologia PTM bulk 90nm, verificando a dependência do alargamento de pulso com a tensão de alimentação, com o tempo de estresse DC anterior à aplicação do pulso e com a frequência do sinal de entrada. O aumento do atraso de portas lógicas em decorrência da ação de bias temperature instability é abordado, também, através da simulação da aplicação de um pulso nas entradas de uma porta NAND, medindo-se a variação do tempo de atraso de propagação devido à inserção da modelagem matemática para BTI. Utiliza-se novamente o modelo de transistores PTM bulk 90nm, e apuram-se os efeitos da variação da tensão de alimentação e do tempo de estresse DC no tempo de atraso de propagação. Por fim, as disparidades na variação do atraso para as bordas de subida e descida de pulsos lógicos de nível alto-baixo-alto (“101”) e baixo-alto-baixo (“010”) são verificadas, sendo explicadas em termos do diferente impacto de BTI para os períodos de estresse e de relaxação e, também, para transistores PMOS e NMOS. / This work addresses the aging of MOS transistors by bias temperature instability (BTI), which is a key factor to the degradation of the reliability and of the lifetime of CMOS integrated circuits. A novel deterministic mathematical model is presented, providing fast information about the impact of BTI in the transistors threshold voltage shifts. The model is implemented in a commercial SPICE tool, in order to verify the effects of BTI in CMOS circuits through transient simulations; in this sense, the deterministic approach represents a great advance compared to the traditional stochastic modelling, that may result in prohibitively long transient simulations for complex circuits, due to its huge computation cost. The phenomenon of propagation induced pulse broadening (PIPB) of single event transients (SETs), verified experimentally in the literature, is studied and understood as the result of the BTI effect on the rising and falling edges of the transient pulse. Therefore, the propagation of a SET injected in the input of a 10,000-inverters chain is simulated, using the PTM bulk 90nm technology model, verifying the dependence of the pulse broadening on the supply voltage, on the DC stress time previous to the application of the pulse and on the input signal frequency. The increase of the propagation delay of logic gates due the action of bias temperature instability is also studied through the simulation of the injection of a pulse in the inputs of a NAND gate, and the variation of the propagation delay time due to the BTI effect is evaluated. The PTM bulk 90nm model is used once again, and the outcome of variations on the supply voltage and on the DC stress time on the propagation delay is measured. Finally, the disparities on the delay variation for the rising and falling edges of high-low-high (“101”) and low-high-low (“010”) input logic pulses are verified, and they are explained as the result of the different impact of BTI for the stress and recovery periods and also for PMOS and NMOS transistors.

In this dissertation, we investigates the electrical stress induced degradation in low-temperature polycrystalline-silicon thin film transistors (LTPS TFTs) applied for system-on-panel (SOP), including the electrical degradations of device for switch operation in active matrix flat-panel displays, driving circuit and nonvolatile memory. Finally, we also present the reliability of LTPS TFTs applied for flexible displays. In first part, electrical degradation of conventional and pattered metal-shielding LTPS TFTs under darkened and illuminated dynamic AC stresses are investigated. Experimental results reveal that competitive mechanisms are generated in conventional LTPS TFTs during illuminated stress, namely, carrier increase and electric field weakening. This phenomenon is verified by stressing the patterned source/drain open metal-shielding LTPS TFTs, which determines that the electric field weakening dominates; conversely, the carrier increase is dominated the electrical degradation in channel open metal-shielding device under illuminated stress. In addition, an improvement in anomalous on-current and subthreshold swing (S.S.) in n-channel LTPS TFTs after positive gate bias stress are studied. These improved electric properties are due to the hole trapping at SiO2 above the lightly doped drain regions, which causes a strong electric field at the gate corners. The effect of the hole trapping is to reduce the effective channel length and the S.S.. Besides, the stress-related electric field was also simulated by TCAD software to verify the mechanism above. Secondly, a mechanism of anomalous capacitance in p-channel LTPS TFTs was investigated. In general, the effective capacitance of the LTPS TFTs was only dependent with the overlap area between gate and source/drain under the off-state. However, the experimental results reveal that the off-state capacitance was increased with decreasing measurement frequency and/or with increasing measurement temperature. Besides, by fitting the curve of drain current versus electric field under off-state region, it was verified that the TAGIDL is consisted of the Pool-Frenkel emission and Thermal-Field emission. In addition, the charge density calculated from the Cch-Vg measurement also the same dependence with electric field. This result demonstrates that the anomalous capacitance is mainly due to the trap-assisted-gate-induced-drain-leakage (TAGIDL). In order to suppress the anomalous capacitance, a band-to-band hot electron (BTBHE) stress was utilized to reduce the vertical electric field between the gate and the drain. In third part, in order to realize the reliability in p-channel TFTs under illuminated environment operation, the degradation of negative bias temperature instability (NBTI) with illumination effect is investigated. The generations of interface state density (Nit) are identical under various illuminated intensity DC NBTI stresses. Nevertheless, the degradation of the grain boundary trap (Ntrap) under illumination was more significant than for the darkened environment, with degradation increasing as illumination intensity increases. This phenomenon is mainly caused by the extra number of holes generated during the illuminated NBTI stress. The increased Ntrap degradation leads to an increase in the darkened environment leakage current. This indicates that more traps are generated in the drain junction region that from carrier tunneling via the trap, resulting in leakage current. Conversely, an increase of Ntrap degradation results in a decrease in the photoleakage current. This indicates that the number of recombination centers increases in poly-Si bulk, affecting photosensitivity in LTPS TFTs. Besides, the transient effect assisted NBTI degradation in p-channel LTPS TFTs under dynamic stress is also presented, in which the degradation of the Ntrap becomes more significant as rise time decreases to 1 £gs. Because the surface inversion layer cannot form during the short rise time, transient bulk voltage will cause excess holes to diffuse into the poly-Si bulk. Therefore, the significant Ntrap increase is assisted by this transient effect. Fourthly, we study the electric properties of n- and p-channel LTPS TFTs under the mechanical tensile strain. The improved on-current for tensile strained n-channel TFTs is originated form an increase in energy difference between 2- and 4-fold valleys, reducing the inter-valley scattering and further improving the carrier mobility. On the contrary, the hole mobility decreases in p-channel, suggesting the split between the light hole and heavy hole energy bands and an increase in hole population on the heavy hole energy band of poly-Si when the uniaxial tensile strain is parallel to the channel direction. In addition, the Nit and Ntrap degradations induced by NBTI for tensile strained LTPS TFTs are more pronounced than in the unstrained. Extracted density-of-states (DOS) and conduction activation energy (EA) both show increases due to the strained Si-Si bonds, which implies that strained Si-Si bonds are able to react with dissociated H during the NBTI stress. Therefore, the NBTI degradation is more significant after tensile strain than in an unstrained condition. Finally, the SONOS-TFT applied to nonvolatile memory is prepared and studied. In the gate disturb stress, a parasitic capacitance and resistance in off-state region are identified as electrons trapped in the gate-insulator (GI) near the defined gate region. Meanwhile, these trapping electrons induced depletions in source/drain also degraded the I-V characteristic when the gate bias is larger than the threshold voltage. However, these degradations slightly recover when the trapped electrons are removed after negative bias stress. The electric field in the undefined gate region is also verified by TCAD simulation software.

Actuellement, les circuits numériques nécessitent d'être de plus en plus performants. Aussi, les produits doivent être conçus le plus rapidement possible afin de gagner les précieuses parts de marché. Les méthodes rapides de conception et l'utilisation de MPSoC ont permis de satisfaire à ces exigences, mais sans tenir compte précisément de l'impact du vieillissement des circuits sur la conception. Or les MPSoC utilisent les technologies de fabrication les plus récentes et sont de plus en plus soumis aux défaillances matérielles. De nos jours, les principaux mécanismes de défaillance observés dans les transistors des MPSoC sont le HCI et le NBTI. Des marges sont alors ajoutées pour que le circuit soit fonctionnel pendant son utilisation, en considérant le cas le plus défavorable pour chaque mécanisme. Ces marges deviennent de plus en plus importantes et diminuent les performances attendues. C'est pourquoi les futures méthodes de conception nécessitent de tenir compte des dégradations matérielles en fonction de l'utilisation du circuit. Dans cette thèse, nous proposons une méthode originale pour simuler le vieillissement des MPSoC à haut niveau d'abstraction. Cette méthode s'applique lors de la conception du système c.-à-d. entre l'étape de définition des spécifications et la mise en production. Un modèle empirique permet d'estimer les dégradations temporelles en fin de vie d'un circuit. Un exemple d'application est donné pour un processeur embarqué et les résultats pour un ensemble d'applications sont reportés. La solution proposée permet d'explorer différentes configurations d'une architecture MPSoC pour comparer le vieillissement. Aussi, l'application la plus sévère pour le vieillissement peut être identifiée.

abstract: The aging process due to Bias Temperature Instability (both NBTI and PBTI) and Channel Hot Carrier (CHC) is a key limiting factor of circuit lifetime in CMOS design. Threshold voltage shift due to BTI is a strong function of stress voltage and temperature complicating stress and recovery prediction. This poses a unique challenge for long-term aging prediction for wide range of stress patterns. Traditional approaches usually resort to an average stress waveform to simplify the lifetime prediction. They are efficient, but fail to capture circuit operation, especially under dynamic voltage scaling (DVS) or in analog/mixed signal designs where the stress waveform is much more random. This work presents a suite of modelling solutions for BTI that enable aging simulation under all possible stress conditions. Key features of this work are compact models to predict BTI aging based on Reaction-Diffusion theory when the stress voltage is varying. The results to both reaction-diffusion (RD) and trapping-detrapping (TD) mechanisms are presented to cover underlying physics. Silicon validation of these models is performed at 28nm, 45nm and 65nm technology nodes, at both device and circuit levels. Efficient simulation leveraging the BTI models under DVS and random input waveform is applied to both digital and analog representative circuits such as ring oscillators and LNA. Both physical mechanisms are combined into a unified model which improves prediction accuracy at 45nm and 65nm nodes. Critical failure condition is also illustrated based on NBTI and PBTI at 28nm. A comprehensive picture for duty cycle shift is shown. DC stress under clock gating schemes results in monotonic shift in duty cycle which an AC stress causes duty cycle to converge close to 50% value. Proposed work provides a general and comprehensive solution to aging analysis under random stress patterns under BTI. Channel hot carrier (CHC) is another dominant degradation mechanism which affects analog and mixed signal circuits (AMS) as transistor operates continuously in saturation condition. New model is proposed to account for e-e scattering in advanced technology nodes due to high gate electric field. The model is validated with 28nm and 65nm thick oxide data for different stress voltages. It demonstrates shift in worst case CHC condition to Vgs=Vds from Vgs=0.5Vds. A novel iteration based aging simulation framework for AMS designs is proposed which eliminates limitation for conventional reliability tools. This approach helps us identify a unique positive feedback mechanism termed as Bias Runaway. Bias runaway, is rapid increase of the bias voltage in AMS circuits which occurs when the feedback between the bias current and the effect of channel hot carrier turns into positive. The degradation of CHC is a gradual process but under specific circumstances, the degradation rate can be dramatically accelerated. Such a catastrophic phenomenon is highly sensitive to the initial operation condition, as well as transistor gate length. Based on 65nm silicon data, our work investigates the critical condition that triggers bias runaway, and the impact of gate length tuning. We develop new compact models as well as the simulation methodology for circuit diagnosis, and propose design solutions and the trade-offs to avoid bias runaway, which is vitally important to reliable AMS designs. / Dissertation/Thesis / Doctoral Dissertation Electrical Engineering 2014

The growing interest in high speed and RF technologies assert for the importance of reliability characterization beyond the conventional DC methodology. In this work, the influence of bias temperature instability (BTI) stress on RF small signal parameters is shown. The correlation between degradation of DC and RF parameters is established which enables the empirical modelling of stress induced changes. Furthermore, S-Parameters characterization is demonstrated as the tool to qualitatively distinguish between HCI and BTI degradation mechanisms with the help of extracted small signal gate capacitances.

Modern technology needs and advancements have introduced various new concepts such as Internet-of-Things, electric automotive, and Artificial intelligence. This implies an increased activity in the electronics domain of analog and high frequency. Silicon devices have emerged as a cost-effective solution for such diverse applications. As these silicon devices are pushed towards higher performance, there is a continuous need to improve fabrication, power efficiency, variability, and reliability. Often, a direct trade-off of higher performance is observed in the reliability of semiconductor devices. The acceleration-based methodologies used for reliability assessment are the adequate time-saving solution for the lifetime's extrapolation but come with uncertainty in accuracy. Thus, the efforts to improve the accuracy of reliability characterization methodologies run in parallel. This study highlights two goals that can be achieved by incorporating high-frequency characterization into the reliability characteristics. The first one is assessing high-frequency performance throughout the device's lifetime to facilitate an accurate description of device/circuit functionality for high-frequency applications. Secondly, to explore the potential of high-frequency characterization as the means of scanning reliability effects within devices. S-parameters served as the high-frequency device's response and mapped onto a small-signal model to analyze different components of a fully depleted silicon-on-insulator MOSFET. The studied devices are subjected to two important DC stress patterns, i.e., Bias temperature instability stress and hot carrier stress. The hot carrier stress, which inherently suffers from the self-heating effect, resulted in the transistor's geometry-dependent magnitudes of hot carrier degradation. It is shown that the incorporation of the thermal resistance model is mandatory for the investigation of hot carrier degradation. The property of direct translation of small-signal parameter degradation to DC parameter degradation is used to develop a new S-parameter based bias temperature instability characterization methodology. The changes in gate-related small-signal capacitances after hot carrier stress reveals a distinct signature due to local change of flat-band voltage. The measured effects of gate-related small-signal capacitances post-stress are validated through transient physics-based simulations in Sentaurus TCAD.:Abstract Symbols Acronyms 1 Introduction 2 Fundamentals 2.1 MOSFETs Scaling Trends and Challenges 2.1.1 Silicon on Insulator Technology 2.1.2 FDSOI Technology 2.2 Reliability of Semiconductor Devices 2.3 RF Reliability 2.4 MOSFET Degradation Mechanisms 2.4.1 Hot Carrier Degradation 2.4.2 Bias Temperature Instability 2.5 Self-heating 3 RF Characterization of fully-depleted Silicon on Insulator devices 3.1 Scattering Parameters 3.2 S-parameters Measurement Flow 3.2.1 Calibration 3.2.2 De-embedding 3.3 Small-Signal Model 3.3.1 Model Parameters Extraction 3.3.2 Transistor Figures of Merit 3.4 Characterization Results 4 Self-heating assessment in Multi-finger Devices 4.1 Self-heating Characterization Methodology 4.1.1 Output Conductance Frequency dependence 4.1.2 Temperature dependence of Drain Current 4.2 Thermal Resistance Behavior 4.2.1 Thermal Resistance Scaling with number of fingers 4.2.2 Thermal Resistance Scaling with finger spacing 4.2.3 Thermal Resistance Scaling with GateWidth 4.2.4 Thermal Resistance Scaling with Gate length 4.3 Thermal Resistance Model 4.4 Design for Thermal Resistance Optimization 5 Bias Temperature Instability Investigation 5.1 Impact of Bias Temperature Instability stress on Device Metrics 5.1.1 Experimental Details 5.1.2 DC Parameters Drift 5.1.3 RF Small-Signal Parameters Drift 5.2 S-parameter based on-the-fly Bias Temperature Instability Characterization Method 5.2.1 Measurement Methodology 5.2.2 Results and Discussion 6 Investigation of Hot-carrier Degradation 6.1 Impact of Hot-carrier stress on Device performance 6.1.1 DC Metrics Degradation 6.1.2 Impact on small-signal Parameters 6.2 Implications of Self-heating on Hot-carrier Degradation in n-MOSFETs 6.2.1 Inclusion of Thermal resistance in Hot-carrier Degradation modeling 6.2.2 Convolution of Bias Temperature Instability component in Hot-carrier Degradation 6.2.3 Effect of Source and Drain Placement in Multi-finger Layout 6.3 Vth turn-around effect in p-MOSFET 7 Deconvolution of Hot-carrier Degradation and Bias Temperature Instability using Scattering parameters 7.1 Small-Signal Parameter Signatures for Hot-carrier Degradation and Bias Temperature Instability 7.2 TCAD Dynamic Simulation of Defects 7.2.1 Fixed Charges 7.2.2 Interface Traps near Gate 7.2.3 Interface Traps near Spacer Region 7.2.4 Combination of Traps 7.2.5 Drain Series Resistance effect 7.2.6 DVth Correction 7.3 Empirical Modeling based deconvolution of Hot-carrier Degradation 8 Conclusion and Recommendations 8.1 General Conclusions 8.2 Recommendations for Future Work A Directly measured S-parameters and extracted Y-parameters B Device Dimensions for Thermal Resistance Modeling C Frequency response of hot-carrier degradation (HCD) D Localization Effect of Interface Traps Bibliography