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Atmospheric pressure chemical vapour deposition of the nitrides and oxynitrides of vanadium, titanium and chromiumElwin, Gareth Steven January 1999 (has links)
No description available.
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Structure of organic molecular thin films vapour deposited on III-V semiconductor surfacesCox, Jennifer Jane January 1999 (has links)
No description available.
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Aluminum and Copper Chemical Vapor Deposition on Fluoropolymer Dielectrics and Subsequent Interfacial InteractionsSutcliffe, Ronald David 12 1900 (has links)
This study is an investigation of the chemical vapor deposition (CVD) of aluminum and copper on fluoropolymer surfaces and the subsequent interfacial interactions.
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"Películas Espessas de Carbeto de Silício, SiC, sobre Mulita" / Silicon carbide, SiC, thick films over mullite.Regiani, Inacio 19 November 2001 (has links)
Filmes de carbeto de silício, SiC, cristalinos foram depositados sobre peças de mulita por meio da técnica de deposição química por vapor (CVD) a pressão atmosférica. As características da superfície do substrato determinam se o filme será denso ou poroso, enquanto a temperatura define a cristalinidade e a taxa de nucleação para formação do filme. Durante os procedimentos de preparação do substrato de mulita para a deposição do filme, observou-se o fenômeno da formação de whiskers de mulita quando adicionados 3%mol de terras raras a peça. O fenômeno de crescimento destes whiskers foi sistematicamente estudado para sua caracterização e compreensão do mecanismo de formação. A adição de terras raras promoveu um abaixamento na temperatura de mulitização e a formação de whiskers com uma composição cuja razão alumina / sílica é de 1,3, uma das mais baixas observadas. / Crystalline silicon carbide, SiC, films were deposited on mullite by atmospheric pressure chemical vapor deposition (CVD) method. The characteristic of substrate surface determinate if the film will be dense or porous, while the deposition temperature defines its crystalinity and nucleation rate in film formation. During the mullite substrate preparation process for film deposition, it was observed a whisker formation phenomenon when the piece was doped with 3%mol of rare earth. The growth phenomenon of these whiskers was studied systematically to its characterization and comprehension of its formation mechanism. The addiction of rare earth promote a reduction in mullitization temperature and the formation of whiskers with a composition that alumina / silica ration was 1.3, one of the lowest one ever observed.
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Elaboration de tubes épais de SiC par CVD pour applications thermostructurales / Synthesis of tubular SiC thick CVD coatings for thermostructural applicationsDrieux, Patxi 19 December 2013 (has links)
L'objectif de la thèse était de synthétiser des tubes de SiC monolithiques pour améliorer l'étanchéité de la structure composite SiC/SiC d'une gaine de combustible nucléaire. Des revêtements tubulaires de 8 mm de diamètre et quelques centaines de micromètres d'épaisseur ont été produits par dépôt chimique en phase vapeur à pression atmosphérique à partir d'un mélange CH3SiHCl2/H2. Le procédé a été développé de manière à réaliser en continu des tubes de SiC de plusieurs dizaines de centimètres de long. La composition chimique et la microstructure des tubes ont été déterminées par microsonde de Castaing, spectroscopie Raman, DRX et microscopie électronique (MEB, MET). Les propriétés mécaniques des tubes ont été caractérisées par nanoindentation et à travers des essais de compression C-ring. Le comportement thermomécanique a également été étudié. L'étude du procédé comprend une étude thermocinétique, un suivi de la phase gazeuse par IRTF et la modélisation 2D du réacteur. / The goal of this study was to synthesize monolithic SiC tubes to improve sealing of the SiC / SiC composite of a nuclear fuel cladding structure. Tubes of 8 mm inner diameter and several hundred micrometers in thickness have been produced by atmospheric pressure chemical vapor deposition (APCVD) from a mixture CH3SiHCl2/H2. The method has been developed so as to produce continuous SiC tubes of up to thirty centimeters long. The chemical composition and microstructure of the tubes were determined by microprobe, Raman spectroscopy, XRD and electron microscopy (SEM, TEM). The mechanical properties of the tubes were characterized by nanoindentation tests and through compression C -ring . The thermomechanical behavior was also studied. The method includes consideration of a thermokinetic study , followed by a gas phase analysis by IRTF and 2D modeling of the reactor.
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Synthesis and device applications of graphitic nanomaterialsUmair, Ahmad 01 December 2013 (has links)
This thesis is focused on two topics: (i) synthesis and characterization of bilayer graphene and pyrolytic carbon by atmospheric pressure chemical vapor deposition, and (ii) application of graphene in the fabrication of a buckyball memory device.
Monolayer and bilayer graphene are semi-metal with zero bandgap. One can induce a bandgap in bilayer graphene by applying a gate voltage in the stacking direction. Thus, bandgap and Fermi level in bilayer graphene can be controlled simultaneously with a double-gate device, making it a useful material for future semiconducting applications. Controlled synthesis of bilayer graphene would be the first step to fabricate bilayer graphene based devices. In this context, we report a uniform and low-defect synthesis of bilayer graphene on evaporated nickel films. Ultra-fast cooling is employed to control the number of layers and sample uniformity. The process is self-limiting, which leads to bilayer graphene synthesis over a wide range of growth-time and precursor flow-rate.
Pryolytic carbon is another important carbon nanomaterial, due to its diverse applications in electronic and biomedicalengineering. We employ chemical vapor deposition with ultra-fast cooling technique to synthesize pyrolytic carbon. Furthermore, we elucidate a method to calculate the in-plane crystal size by using Raman spectroscopy.
Finally, the use of bilayer graphene in a write-once read-many memory device has been demonstrated. The device showed irreversible switching from low-resistance to high-resistance state, with hysteresis in the transport characteristics. The control sample showed random switching and hysteresis due to electromigration of metal atoms into the active material of the device. We attribute the reliability and performance of the reported device to the ultra-smooth graphene contacts, which additionally inhibits electromigration from the underlying metallic film. Moreover, the memory device showed excellent endurance and retention characteristics.
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High Indium Concentration InGaN/GaN Grown on Sapphire Substrate by MOCVDHartono, Haryono, Chua, Soo-Jin, Fitzgerald, Eugene A., Song, T.L., Chen, Peng 01 1900 (has links)
The InGaN system provides the opportunity to fabricate light emitting devices over the whole visible and ultraviolet spectrum due to band-gap energies E[subscript g] varying between 3.42 eV for GaN and 1.89 eV for InN. However, high In content in InGaN layers will result in a significant degradation of the crystalline quality of the epitaxial layers. In addition, unlike other III-V compound semiconductors, the ratio of gallium to indium incorporated in InGaN is in general not a simple function of the metal atomic flux ratio, f[subscript Ga]/f[subscript In]. Instead, In incorporation is complicated by the tendency of gallium to incorporate preferentially and excess In to form metallic droplets on the growth surface. This phenomenon can definitely affect the In distribution in the InGaN system. Scanning electron microscopy, room temperature photoluminescence, and X-ray diffraction techniques have been used to characterize InGaN layer grown on InN and InGaN buffers. The growth was done on c-plane sapphire by MOCVD. Results showed that green emission was obtained which indicates a relatively high In incorporation. / Singapore-MIT Alliance (SMA)
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The use of FLUENT for heat flow studies of the hot-wire chemical vapor deposition system to determine the temperatures reached at the growing layer surfaceZHOU, EN January 2009 (has links)
<p>The overall aim of this project is to study the heat transfer inside the reaction chamber of the Hot-Wire Chemical Vapor Deposition (HWCVD) system with a commercial software package FLUENT6.3 / it is one of the most popular Computational Fluid Dynamics solvers for complex flows ranging from incompressible to mildly compressible to even highly compressible flows. The wealth of physical models in FLUENT allows us to accurately predict laminar and turbulent flows, various modes of heat transfer, chemical reactions, multiphase flows and other phenomena with complete mesh flexibility and solution-based mesh adaptation. In this study the 3-D HWCVD geometry was measured and created in GAMBIT which then generates a mesh model of the reaction chamber for the calculation in FLUENT. The gas flow in this study was characterized as the steady and incompressible fluid flow due to the small Mach number and assumptions made to simplify the complexity of the physical geometry. This thesis illustrates the setups and solutions of the 3-D geometry and the chemically reacting laminar and turbulent gas flow, wall surface reaction and heat transfer in the HWCVD deposition chamber.</p>
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Plasma Enhanced Chemical Vapor Deposition on Living Substrates: Development, Characterization, and Biological ApplicationsTsai, Tsung-Chan 1982- 14 March 2013 (has links)
This dissertation proposed the idea of “plasma-enhanced chemical vapor deposition on living substrates (PECVD on living substrates)” to bridge the gap between the thin film deposition technology and the biological and living substrates. This study focuses on the establishment of the knowledge and techniques necessary to perform “PECVD on living substrates” and contains three main aspects: development, characterization, and biological applications.
First, a PECVD tool which can operate in ambient air and at low temperature was developed using a helium dielectric barrier discharge jet (DBD jet). It was demonstrated that various materials, such as polymeric, metallic, and composite films, can be readily synthesized through this technique. Second, the PMMA and copper films deposited using DBD jets were characterized. High-rate (22 nm/s), low-temperature (39 ºC) PMMA deposition was achieved and the film surface morphology can be tailored by altering the discharge power. Conductive copper films with an electrical resistivity lower than 1×10-7 ohm-m were obtained through hydrogen reduction. Both PMMA and copper films can be grown on temperature-sensitive substrates, such as plastics, pork skin, and even fingernail. The electrical, optical, and imaging characterization of the DBD jets was also conducted and several new findings were reported. Multiple short-duration current pulses instead of only one broad pulse per half voltage cycle were observed when a dielectric substrate was employed. Each short-duration current pulse is induced by a leading ionization wave followed by the formation of a plasma channel. Precursor addition further changed the temporal sequence of the pulses. An increase in the power led to a mode change from a diffuse DBD jet to a concentrated one. This mode change showed significant dependence on the precursor type, tube size, and electrode configuration. These findings regarding the discharge characteristics can thus facilitate the development of DBD-jet operation strategies to improve the deposition efficacy. Finally, this technique was used to grow PMMA films onto agar to demonstrate one of its potential biological applications: sterile bandage deposition. The DBD jet with the film depositing ability enabled the surface to be not only efficiently sanitized but also protected by a coating from being reached by bacteria.
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Growth and Characterization of Indium Nitride Layers Grown by High-Pressure Chemical Vapor DepositionAlevli, Mustafa 22 April 2008 (has links)
In this research the growth of InN epilayers by high-pressure chemical vapor deposition (HPCVD) and structural, optical properties of HPCVD grown InN layers has been studied. We demonstrated that the HPCVD approach suppresses the thermal decomposition of InN, and therefore extends the processing parameters towards the higher growth temperatures (up to 1100K for reactor pressures of 15 bar, molar ammonia and TMI ratios around 800, and a carrier gas flow of 12 slm). Structural and surface morphology studies of InN thin layers have been performed by X-ray diffraction, low energy electron diffraction (LEED), auger electron spectroscopy (AES), high-resolution electron energy loss spectroscopy (HREELS) and atomic force microscopy (AFM). Raman spectroscopy, infrared reflection, transmission, photoluminescence spectroscopy studies have been carried out to investigate the structural and optical properties of InN films grown on sapphire and GaN/sapphire templates. InN layers grown on a GaN (0002) epilayer exhibit single-phase InN (0002) X-ray diffraction peaks with a full width at half maximum (FWHM) around 200 arcsec. Auger electron spectroscopy confirmed the cleanliness of the surface, and low energy electron diffraction yielded a 1×1 hexagonal pattern indicating a well-ordered surface. The plasmon excitations are shifted to lower energies in HREEL spectra due to the higher carrier concentration at the surface than in the bulk, suggesting a surface electron accumulation. The surface roughness of samples grown on GaN templates is found to be smoother (roughness of 9 nm) compared to the samples grown on sapphire. We found that the deposition sometimes led to the growth of 3 dimensional hexagonal InN pyramids. Results obtained from Raman and IR reflectance measurements are used to estimate the free carrier concentrations, which were found in the range from mid 10^18 cm-3 to low 10^20 cm-3. The optical absorption edge energy calculated from the transmission spectra is 1.2 eV for samples of lower electron concentration. The Raman analysis revealed a high-quality crystalline layer with a FWHM for the E2(high) peak around 6.9 cm^-1. The results presented in our study suggest that the optimum molar ratio might be below 800, which is due to the efficient cracking of the ammonia precursor at the high reactor pressure and high growth temperature.
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