Thesis (MEng)--Stellenbosch University, 2015. / ENGLISH ABSTRACT: The fracture of ductile materials is currently regarded as a complex and challenging phenomenon to characterise and predict. Recently, a bond-based, non-local theory was formulated called the peridynamic theory, which is able to directly solve solid mechanics problems that include fracture. The failure criterion is governed by a critical stretch relation between bonds. It was found in literature that the critical stretch relates to the popular fracture mechanics parameter called the critical energy release rate for predicting brittle linear-elastic failure. It was also proposed that the non-linear critical energy release rate or J-integral can be used to model ductile failure using peridynamics. The aim of this thesis was to investigate the validity of using the J-integral to determine the critical stretch for predicting ductile failure. Standard ASTM fracture mechanics tests on Compact Tension specimens of Polymethyl methacrylate, stainless steel 304L and aluminium 1200H4 were performed to determine the critical energy release rates and non-linear Resistance-curves. Furthermore, a novel peridynamic-based algorithm was developed that implements a critical energy release rate based failure criterion and Digital Image Correlation (DIC) measured full surface displacement fields of cracked materials. The algorithm is capable of estimating and mapping both the peridynamic damage caused by brittle cracking and damage caused by plastic deformation. This approach was used to validate the use of an energy release rate based failure criterion for predicting linear-elastic brittle failure using peridynamics. Also, it showed a good correlation among the test results for detecting plastic damage in the alloys when incorporating the respective J-integral derived critical stretch values. Additionally, Modified Arcan tests were performed to obtain Mode I, Mode II and mixed Mode fracture load results of brittle materials. Mode I peridynamic models compared closely to test results when using the Mode I critical energy release rate, derived critical stretch and served as validation for the approach. Moreover, it was argued that Mode I failure criteria cannot in principle be used to model shear failure. Therefore, it was proposed to rather use the appropriate Mode II and mixed Mode critical energy release rates to predict the respective failures in peridynamics. Also, for predicting ductile failure loads it was found that using a threshold energy release rate derived from the R-curve yielded considerably more accurate failure load results compared to the usage of the critical energy release rate, i.e. J-integral. In this thesis it was shown that there exists great potential for detecting and characterising cracking and failure by using a peridynamic-based approach through coupling DIC full displacement field measurements and the critical energy release rate of a particular structural material. / AFRIKAANSE OPSOMMING: Duktiele breeking van materiale word tans beskou as 'n kompleks- en uitdagende fenomeen om te voorspel en te karakteriseer. 'n Binding-gebaseerde, nie-lokale teorie is onlangs geformuleer, genaamd die peridinamika teorie. Die laasgenoemde stel ons in staat om soliede meganiese probleme met krake direk op te los. Die falings kriterium word bemagtig deur die kritiese strekfaktor tussen verbindings. Daar was bewys dat die kritiese strekfaktor in verband staan met die popul^ere breek meganika parameter, genaamd die kritiese vrylatings-energie-koers vir die voorspelling van bros line^ere-elastiese faling. 'n Onlangse verklaring meen dat die kritiese strekfaktor vir duktiele falingsgedrag, bereken kan word met die nie-line^ere kritiese vrylatings-energie-koers, beter bekend as die J- integraal. Die doel van hierdie tesis was om te meet hoe geldig die gebruik van die J-integraal is om die kritiese strekfaktor te bereken, om sodoende duktiele breking te ondersoek. Standaard ASTM breukmeganika toetse op Polimetilmetakrilat, vlekvrye staal 304L en aluminium 1200H4 is uitgevoer om die kritiese vrylatings-energie-koers en Weerstandskurwes te bepaal. Verder was 'n nuwe peridinamies-gebaseerde algoritme ontwikkel. Die laasgenoemde implementeer die berekening van 'n kritiese strekfaktor, gebaseer op die kritiese vrylatings-energie-koers, sowel as Digitale Beeld Korrelasie (BDK) vol oppervlaks-verplasings veld metings van gebreekte materiale. Dit is in staat om die peridinamiese skade te bereken, tesame met die beeld wat veroorsaak was van bros krake en plastiese vervorming in duktiele materiale. Hierdie benadering is aangewend om die gebruik van 'n vrylatings-energie-koers gebaseerde falings kriterium vir bros line^ere-elastiese falings in peridinamika te bekragtig. 'n Goeie korrelasie tussen toets resultate is ook gevind vir die opsporing van skade wat veroorsaak is deur plastiese deformasie in die legerings waar die onderskeilike J-integrale gebruik was as falings kriteria. Daarbenewens, was Verandere Arcan toetse uitgevoer om die Modes I, Modes II en gemenge Modes falingsresultate te verkry. Die Modes I peridinamiese model het goed vergelyk met die toetsresultate en het gedien as bekragtiging vir die falingsbenaderings. Verder was dit aangevoer dat Modes I falings kriterium in beginsel nie gebruik kan word om skuiffaling te modelleer nie. Dus was dit voorgestel om eerder die toepaslike Modes II en gemengde Modes kritieke vrylatings-energie-koerse te gebruik om onderskeie falings te voorspel in peridinamiese modelle. Dit was ook gevind dat vir die voorspelling van duktiele falingslaste die drumpel vrylatings-energie-koers, wat verkrygbaar is vanaf die Weerstands-kurwe, aansienlik meer akkurate resultate gee, in vergelyking met die gebruik van die kritiese vrylatings-energie-koers, m.a.w. die J-integraal. In hierdie tesis was dit gewys dat daar groot potensiaal bestaan vir die opsporing en karakterisering van krake en falings met 'n peridinamies-gebaseerde benadering, deur dit te skakel met BDK vol verplasings veld metings en die kritiese vrylatings-energie-koers van 'n bepaalde strukturele materiaal.

Significant energy savings can be achieved by improving efficiency of water removal in the press section of a paper machine, rather than energy-intensive evaporative dryer cans. Impulse drying is a novel technology to remove water from the sheet in the press section by using a heated press roll. Delamination is a major challenge to be overcome before impulse drying can be implemented successfully. Delamination is caused by a region of high temperature liquid water under high pressure in the press. Upon exiting the nip, the pressure drops and the high temperature water flashes to steam. If the expansion of the steam is too strong, the bonds between the fibers will fail and a blister will form. The formation of this blister is characteristic of delamination. The goal of this project was to understand the internal mechanics of a wet web as it exits the nip of an impulse dryer. In this way, the components of the sheet can be tailored to open the operating window of impulse drying. A mathematical model, developed to describe the deflection and delamination of an elastic membrane, was utilized in this work. Three failure criteria were employed to represent delamination of this pliable membrane from the more rigid sub layers in the sheet. The experimental portion of this effort was devoted to showing the validity of these models and which was the best fit. A series of experiments were employed to validate the model. A peel test was used to determine the amount of work needed to pull a membrane from a rigid substrate. Pressurized blister experiments were conducted to find the relationship between critical pressure and initial defect size. The predictions from the mathematical model were then compared to these experimental values. Finally, work was done to understand the physics of the delamination of a porous membrane.

Large Area Maskless Photopolymerization (LAMP) is a technology being developed to fabricate integrally-cored ceramic molds for the investment casting of turbine airfoils. In LAMP, ultraviolet (UV) light in the form of bitmap images is projected from a spatial light modulator (SLM) onto a photocurable ceramic material system (PCMS). Exposed and unexposed regions are determined through black and white portions of the bitmaps, respectively. UV light induces photopolymerization and the formation of an insoluble solidified network. Three-dimensional structures are built layer-by-layer through sequential application and curing of PCMS layers of 100 micron thickness. To date, ceramic molds fabricated using LAMP have been successfully implemented in investment casting of single-crystal turbine airfoils without internal cooling schemes. Two particularly important challenges for the fabrication of airfoil molds with internal cooling passages are: (a) fabrication of unsupported structures in the mold geometry and; (b) mitigation of internal stresses that arise during layer-by-layer build-up due to volumetric shrinkage during photopolymerization. Unsupported geometries arise in nearly every cored airfoil mold and often in a location where support structures cannot be easily removed after fabrication. Internal stresses generated by volumetric shrinkage can lead to cracking during binder burnout (BBO), sintering and casting. This thesis aims to simultaneously address these challenges through the investigation of grayscale exposure to control the degree of monomer conversion during photopolymerization of single and multiple layers. The effective intensity of the UV light incident on the monomer system can be reduced by selectively turning off pixels within the nominally "white" or "on" regions of the projected bitmaps, effectively producing an exposure with a lower light intensity. In an effort to reduce internal stresses in the mold, the grayscale exposure can be tuned to create regions of uncured or partially cured monomer within the mold geometry to reduce the connectivity between cured regions and thus reduce the net effect of volumetric shrinkage. Grayscale exposure can also be used to generate support structures with a low degree of polymerization to create a gel state beneath and surrounding the unsupported segments of the mold, which can be washed away after completion of mold fabrication. In order to successfully utilize grayscale techniques in LAMP, the cure depth must be predicted. This is accomplished through cure depth measurements at different exposure times to develop a "working curve." In addition, the degree of monomer conversion and its relation to cure depths resulting from grayscale exposure must be understood. Measurements of the degree of conversion are obtained through Fourier Transform Infrared spectroscopy (FTIR). Empirical models are developed and compared to theoretical predictions. Also, the scattering length pixelation model is introduced as a technique to predict the light intensity distribution within the PCMS for exposure patterns at multiple length scales. Results from these grayscale investigations are then applied to LAMP and the effectiveness of grayscale to fabricate unsupported geometries and internal stresses from volumetric shrinkage is discussed.

L’objectif de ce travail de thèse est d’envisager les apports de l’Emission Acoustique (EA) en tant qu’outil de diagnostic et de surveillance des structures et ouvrages en bois. Nous avons appliqué cet outil et développé des méthodes de suivi de la fissuration. Si l’objectif affiché est l’utilisation de l’EA pour de la surveillance in-situ, un passage par des manipulations en laboratoire a été nécessaire pour valider les méthodes mises en œuvre. Des essais de chargement à déplacement imposé ont été réalisés sur des éprouvettes de Douglas (DCB à inertie constante) soumises à un chargement en mode I, pour deux teneurs en eaux distinctes. En parallèle du système d’acquisition acoustique, un système d’acquisition d’images a été utilisé pour suivre l’évolution de la fissuration sur les faces principales des éprouvettes.Dans un premier temps, nous avons constaté que la cinétique de fissuration était corrélée à l’énergie acoustique des signaux enregistrés. Une écoute globale, sans filtration des données, fournit une indication sur l’évolution de l’endommagement d’une structure.En effectuant un premier traitement des données, en considérant les évènements acoustiques et en utilisant des courbes de correction de localisation et d’amplitude des signaux, nous avons pu déterminer la position d’un (ou plusieurs) pic(s) d’activité acoustique. La courbe d’évolution de la position de ce(s) pic(s) d’activité donne un résultat similaire à celle de la pointe de fissure obtenue avec le système d’imagerie. Nous avons ainsi pu estimer un taux de restitution d’énergie moyen Gc. Dans le but de passer à des applications in situ, nous avons mis en œuvre cette méthode lors d’un essai de fluage sur une éprouvette à inertie variable. L’EA a su prendre le relais lorsque les relevés visuels étaient absents. L’EA a aussi pu fournir des informations complémentaires sur l’initiation et la propagation de la fissuration et ce, sur une durée surveillance longue.La méthode de détection des pics d’activités par EA montre que les évènements acoustiques de forte amplitude sont localisés de part et d’autre de la pointe de fissure obtenue par imagerie. Dans un deuxième temps, en effectuant un parallèle avec les méthodes développées dans les matériaux composites, le bois pouvant y être assimilé par certains aspects, nous avons pu, par une utilisation conjointe des outils statistiques, de l’imagerie électronique (MEB) et de l’analyse des formes d’ondes, identifier les mécanismes de ruine présents lors des essais.Après un travail de filtration des données obtenues sur des essais à mode de ruine choisi (traction, flexion et cisaillement), quatre familles d’évènements ont pu être mis en évidence. Par l’étude de leurs formes d’ondes respectives, ces familles ont pu être associées à de la rupture de fibre, de la fissuration de matrice, de la décohésion et du délaminage telles qu’on les retrouve dans les matériaux composites. L’étude au MEB a confirmé qu’une multitude de mécanismes étaient présents sur les plans de fissuration des éprouvettes et la vraisemblance des résultats obtenus.D’un point de vue quantitatif, deux mécanismes de ruine principaux ressortent : la rupture de fibres et la fissuration matricielle. Il s’agit là d’indicateurs dont l’évolution peut constituer un indicateur, précurseur à la ruine d’un ouvrage. Le travail effectué dans cette thèse constitue un pas dans l’emploi de l’EA dans la surveillance des structures et des ouvrages en bois et laisse entrevoir d’autres emplois notamment en mécanique de la rupture et dans l’étude des zones d’élaboration. / The aim of this thesis is to consider what Acoustic Emission (AE) can provide as a tool for diagnosis and assessment of wood structures and works. We applied this tool and developed methods for tracking crack propagation. If our intention is using AE for the in-situ monitoring, we have to do experiments in laboratory to validate the methods developped. Loading tests under imposed displacement were conducted on Douglas samples (DCB constant inertia) subjected to a loading in mode I, for two levels of moisture content. In tandem of the acoustic emission emission system, an image acquisition system was used to record crack propagation on the main faces of the samples.First, we showed that the cracking kinetics correlates with the acoustic energy of the recorded signals. A global analysis, with unfiltered data, provides a good indication of the evolution of the damage within a structure. Then by performing a first data processing, by taking into account the acoustic events and by using correction curves of localization and amplitude, we were able to determine the position of one (or more) peak(s) of acoustic activity. The evolution curve of the position of this (these) peak(s) of activity gives a result similar of the crack tip evolution obtained with the digital image acquisition system. By this way we were able to estimate an average restoration level of critical energy Gc. In the purpose of making in situ applications, we have implemented this method during a creep test on a specimen with variable inertia. A previously loaded sample was placed to a relative humidity variation - from a humid atmosphere to a dry atmosphere. Only spot measurements of the crack tip position has been made. AE was able to take over when visual statements were absent. AE was also able to provide additional information on the initiation and propagation of cracks over a long term monitoring. The method for detecting peaks of activities by AE shows that acoustic events with high amplitude are located on both side of the crack tip obtained by imaging.Secondly, by comparing with the methods developed in composite materials, wood could be considered as such, we were able, by joint use of statistical tools, electronic imaging (SEM) and analysis of waveforms, to identify failure mechanisms which were present during testing. After processing data obtained on failure specific mode test (tensile, bending and shear), four clusters of events have been highlighted. By studying their respective waveforms and signal caracteristics, these families have been associated with the rupture of fiber, matrix cracking, debonding and delamination such as those found in composites. The study of SEM images made from owr samples has confirmed the presence of a multitude of mechanisms on the cracking path of the wood samples. This confirms the reasonableness of results obtained. From a quantitative perspective, two major failure mechanisms stand out: the breaking of fibers and matrix cracking. The evolution of these indicators may be a precursor to the ruin of a structure.The work undertaken in this thesis is a step in the use of AE in monitoring structures and wooden structures. It suggests other purposes for the use of AE in wood. We could imaging using AE in order to study the process zones by using mTDCB samples.

Double cantilever beam (DCB) specimens with distinct intermetallic microstructures and different geometries were fractured under different mode ratios of loading, ψ, to obtain critical strain energy release rate, Jc. The strain energy release rate at crack initiation, Jci, increased with phase angle, ψ, but remained unaffected by the joint geometry. However, the steady-state energy release rate, Jcs, increased with the solder layer thickness. Also, both the Jci and Jcs decreased with the thickness of the intermetallic compound layer. Next, mode I and mixed-mode fracture tests were performed on discrete (l=2 mm and l=5 mm) solder joints arranged in a linear array between two copper bars to evaluate the J = Jci (ψ) failure criteria using finite element analysis. Failure loads of both the discrete joints and the joints in commercial electronic assemblies were predicted reasonably well using the Jci from the continuous DCBs. In addition, the mode-I fracture of the discrete joints was simulated with a cohesive zone model which predicted reasonably well not only the fracture loads but also the overall load-displacement behavior of the specimen. Additionally, the Jci calculated from FEA were verified estimated from measured crack opening displacements in both the continuous and discrete joints. Finally, the pad-crater fracture mode of solder joints was characterized in terms of the Jci measured at various mode ratios, ψ. Specimens were prepared from lead-free chip scale package-PCB assemblies and fractured at low and high loading rates in various bending configurations to generate a range of mode ratios. The specimens tested at low loading rates all failed by pad cratering, while the ones tested at higher loading rates fractured in the brittle intermetallic layer of the solder. The Jci of pad cratering increased with the phase angle, ψ, but was independent of surface finish and reflow profile. The generality of the J =Jci(ψ) failure criterion to predict pad cratering fracture was then demonstrated by predicting the fracture loads of single lap-shear specimens made from the same assemblies.

Double cantilever beam (DCB) specimens with distinct intermetallic microstructures and different geometries were fractured under different mode ratios of loading, ψ, to obtain critical strain energy release rate, Jc. The strain energy release rate at crack initiation, Jci, increased with phase angle, ψ, but remained unaffected by the joint geometry. However, the steady-state energy release rate, Jcs, increased with the solder layer thickness. Also, both the Jci and Jcs decreased with the thickness of the intermetallic compound layer. Next, mode I and mixed-mode fracture tests were performed on discrete (l=2 mm and l=5 mm) solder joints arranged in a linear array between two copper bars to evaluate the J = Jci (ψ) failure criteria using finite element analysis. Failure loads of both the discrete joints and the joints in commercial electronic assemblies were predicted reasonably well using the Jci from the continuous DCBs. In addition, the mode-I fracture of the discrete joints was simulated with a cohesive zone model which predicted reasonably well not only the fracture loads but also the overall load-displacement behavior of the specimen. Additionally, the Jci calculated from FEA were verified estimated from measured crack opening displacements in both the continuous and discrete joints. Finally, the pad-crater fracture mode of solder joints was characterized in terms of the Jci measured at various mode ratios, ψ. Specimens were prepared from lead-free chip scale package-PCB assemblies and fractured at low and high loading rates in various bending configurations to generate a range of mode ratios. The specimens tested at low loading rates all failed by pad cratering, while the ones tested at higher loading rates fractured in the brittle intermetallic layer of the solder. The Jci of pad cratering increased with the phase angle, ψ, but was independent of surface finish and reflow profile. The generality of the J =Jci(ψ) failure criterion to predict pad cratering fracture was then demonstrated by predicting the fracture loads of single lap-shear specimens made from the same assemblies.

Les convertisseurs de forte puissance sont des éléments critiques des futurs réseaux HVDC. À ce titre, leur fiabilité et leur endurance sont primordiales. La défaillance d’un composant se produit soit en circuit ouvert, ou en court-circuit. Le composant défaillant en circuit ouvert est inadmissible pour les convertisseurs utilisant une topologie de mise en série. En particulier, dans certaines applications HVDC, les modules doivent être conçus de telle sorte que lorsqu'une défaillance se produit, le module défaillant doit se comporter comme un court-circuit et supporter ainsi le courant nominal qui le traverse. Un tel comportement est appelé “défaillance en court-circuit” ou “failure-to-short-circuit”. Actuellement, tous les modules de puissance ayant un mode de défaillance en court-circuit disponibles dans le commerce utilisent des semi-conducteurs en silicium. Les potentialités des semi-conducteurs en carbure de silicium (SiC) poussent, aujourd’hui, les industriels et les chercheurs à mener des investigations pour développer des modules Fail-to-short à base des puces SiC. C’est dans ce contexte que se situe ce travail de thèse, visant à concevoir un module à base de puces SiC offrant un mode de défaillance de court-circuit. Pour cela nous présentons d’abord une étude de l’énergie de défaillance des puces SiC, afin de définir les plages d’activation du mécanisme Fail-to-short. Ensuite, nous démontrons la nécessité de remplacer les interconnexions classiques (fils de bonding) par des contacts massifs sur la puce. Enfin, une mise en œuvre est présentée au travers d’un module “demi pont” à deux transistors MOSFET. / The reliability and endurance of high power converters are paramount for future HVDC networks. Generally, module’s failure behavior can be classified as open-circuit failure and short-circuit failure. A module which fails to an open circuit is considered as fatal for applications requiring series connection. Especially, in some HVDC application, modules must be designed such that when a failure occurs, the failed module still able to carry the load current by the formation of a stable short circuit. Such operation is referred to as short circuit failure mode operation. Currently, all commercially available power modules which offer a short circuit failure mode use silicon semiconductors. The benefits of SiC semiconductors prompts today the manufacturers and researchers to carry out investigations to develop power modules with Fail-to-short-circuit capability based on SiC dies. This represents a real challenge to replace silicon power module for high voltage applications in the future. The work presented in this thesis aims to design a SiC power module with failure to short-circuit failure mode capability. The first challenge of the research work is to define the energy leading to the failure of the SiC dies in order to define the activation range of the Fail-to-short mechanism. Then, we demonstrate the need of replacing the conventional interconnections (wire bonds) by massive contacts. Finally, an implementation is presented through a "half bridge" module with two MOSFETs.