Submitted by Johnny Rodrigues (johnnyrodrigues@ufcg.edu.br) on 2018-04-04T20:26:12Z No. of bitstreams: 1 ALANA PEREIRA RAMOS - DISSERTAÇÃO PPG-CEMat 2014..pdf: 2592489 bytes, checksum: 5e82ab454a76e1050981da9019ce8fec (MD5) / Made available in DSpace on 2018-04-04T20:26:12Z (GMT). No. of bitstreams: 1 ALANA PEREIRA RAMOS - DISSERTAÇÃO PPG-CEMat 2014..pdf: 2592489 bytes, checksum: 5e82ab454a76e1050981da9019ce8fec (MD5) Previous issue date: 2017-08-07 / As ligas ternárias de Ti-Cu-Ni com memória de forma são conhecidas por apresentarem transformação de fase característica e propriedades semelhantes às ligas binárias Ti–Ni. Estudos realizados com ligas ricas em cobre mostraram que a adição de cobre nas ligas de Ti-Ni reduz a histerese de resposta do efeito de memória de forma e aumenta a TFA (tendência de formação de fase amorfa) ainda pouco estudada com altas porcentagens de cobre. Diante disso, este trabalho teve como objetivo avaliar a influência da velocidade de resfriamento nas temperaturas de transformação e na tendência de amorfização em fitas de Ti-CuNi resfriadas rapidamente. Para tanto, foram produzidas duas fitas Ti01 (Ti 43,5 Cu 37,8 Ni 18,7) e Ti02 (Ti 58,4 Cu 25,6 Ni 16,0) pelo processo melt spinning, variando-se a velocidade linear da roda em 21 m/s e 63 m/s. As amostras foram caracterizadas utilizando-se técnicas DSC, DR-X, RET e MO. Após essa caracterização pode-se afirmar que a técnica de melt spinning permite a produção de fitas muito finas, da ordem de micrômetros, em apenas uma etapa de processamento, assim como também foi possível a produção de fitas amorfas, do sistema Ti-Cu-Ni, sem nenhuma fase cristalina como observado na fita Ti01 e Ti 02 obtidas com velocidade linear de 63m/s. O tratamento térmico foi suficiente para remover todos os defeitos produzidos pelo processo de solidificação rápida e produzir um rápido crescimento de grão, favorecendo o aumento das temperaturas de transformação martensíticas e austeníticas. / Ternary alloys with shape memory Ti-Cu-Ni are known to submit a characteristic phase transformation and properties similar to the and Ti-Ni binary alloy . Studies with rich-copper alloys showed that the addition of copper in alloys Ti-Ni reduces the hysteresis response of the shape memory effect and increases the TFA (tendency to form amorphous phase) still little studied with high percentages of copper. Thus, this study aimed to evaluate the influence of cooling rate on the transformation temperatures and on the tendency of Cu-Ni-Ti ribbons rapidly solidified. Therefore, two ribbons TI01 (Ti 43.5 Cu 37.8 Ni 18.7) and Ti02 (Ti 58.4 Cu 25.6 Ni 16.0) were produced by melt spinning process, varying the wheel linear velocity 21 m/s and 63 m/s. The samples were characterized using DSC, X-DR, RET and MO and techniques. Melt spinning technique allows the production of very thin ribbons of the order of microns, in one processing step, as it was also possible to produce amorphous ribbons, the system Ti-Cu-Ni, without crystalline phase as observed in TI01 and 02 Ti02 with linear velocity of 63m/s. The heat treatment was sufficient to remove all defects produced by rapid solidification process and produce a rapid grain growth, favoring the increase of temperatures of martensitic and austenitic transformation.

In the oil and gas industry, high corrosion resistance and hardness are needed to extend the lifetime of the coatings due to exposure to high stress and salt environments. Electrodeposition has become a favorable technique in synthesizing coatings because of low cost, convenience, and the ability to work at low temperatures. Electrodeposition of metal matrix composites has become popular for enhanced corrosion resistance and hardness in the oil and gas industry because of the major problems that persist with corrosion. Two major alloys of copper-nickel, 90-10 and 70-30, were evaluated for microbial corrosion protection in marine environments on a stainless steel substrate. Copper and copper alloys are commonly used in marine environments to resist biofouling of materials by inhibiting microbial growth. Literature surveying the electrodeposition of Cu-Ni incorporated with nano- to micro- particles to produce metal matrix composites has been reviewed. Also, a novel flow cell design for the enhanced deposition of metal matrix composites was examined to obtain the optimal oriented structure of the layered silicates in the metal matrix. With the addition of montmorillonite into the Ni and Cu-Ni matrix, an increase in strength, adhesion, wear and fracture toughness of the coating occurs, which leads to an increase corrosion resistance and longevity of the coating. These coatings were evaluated for composition and corrosion using many different types of instrumental and electrochemical techniques. The overall corrosion resistance and mechanical properties were improved with the composite films in comparison to the pure metals, which proves to be advantageous for many economic sectors including the oil and gas industry.

No description available.

Ce travail rend compte du développement de substrats à texture biaxiale pour les supraconducteurs à hautes températures critiques de seconde génération dit "coated conductor". Le substrat a été obtenu par un procédé de laminage recuit. Les matériaux utilisés sont des alliages industriels Cu55Ni44Mn (Constantan) et le Cu70Ni30. Comparativement au NiW généralement utilisé, ces cupronickels sont non magnétiques à 77 K et permettent donc des applications en courant alternatif ; ils sont en outre moins onéreux.<br />Des essais sur des laminoirs différents, avec ou sans lubrification et en modifiant le taux d'écrouissage ont permis de mettre en évidence des effets de peau et d'optimiser le procédé de déformation.<br />Les températures de recuit ont été choisies à la suite de caractérisations de texture avant et après le recuit ainsi que de mesures in-situ par diffraction de rayons X durs durant la montée en température.<br />Des laminages supérieurs à 98% et des recuits entre 900°C et 950°C en atmosphère protectrice ont permis d'obtenir des rubans ayant une forte texture cubique : désorientations hors du plan (DT) de 5° et dans le plan de 8°. Une partie de la surface est cependant maclée (entre 8% et 10%). Celle-ci entraîne localement de fortes désorientations.<br />L'état de surface a été contrôlé et amélioré par l'utilisation de rouleaux polis miroirs, l'optimisation des conditions de recuit (atmosphère et durée du palier) ainsi que l'ajout d'une étape d'électropolissage.<br />Des essais mécaniques et magnétiques ainsi qu'une étude d'oxydation ont été pratiqués pour vérifier le comportement du ruban dans les conditions d'utilisation comme dans les conditions rencontrées pendant les différents étapes de la réalisation du câble.<br />Le dépôt d'une couche d'oxyde protectrice LZO, sur le substrat a été réalisé avec succès. Les conditions d'un prétraitement sous atmosphère sulfurée, nécessaire à une bonne épitaxie de la couche, ont été déterminées : 1 h à 600°C avec un flux à 0,2 ppm d'H2S.<br />Enfin des essais sur le développement d'un alliage à barrière de diffusion in situ Cu Ni Y permettant de s'affranchir de la première couche tampon ont été menés.

Le Coated Conductor est un empilement de couches tampon sur un substrat, il est composé d'un substrat métallique, de couches tampon, d'une couche d'YBCO et d'une couche protectrice. Développer de bons substrats métalliques, simplifier l'architecture des couches tampon et trouver des méthodes de fabrication d'YBCO économiques sont les sujets essentiels de ce domaine. On a développé un nouveau substrat bimétallique Cu-Ni par dépôt électrochimique d'une couche de Ni sur un ruban de cuivre texturé et on discute comment déposer un film de La2Zr2O7 (LZO), de même texture, sur un substrat métallique par un processus chimique en solution (CSD). La fabrication de rubans de Cu texturé par un procédé de laminage-recristallisation est présentée en premier, puis on s'intéresse au dépôt électrochimique du Ni sur ces rubans. La stabilité thermique de la texture et les propriétés magnétiques de ces substrats Cu-Ni est discutée. Le dépôt d'une couche tampon de LZO texturée sur ces substrats par le procédé CSD confirme leur intérêt potentiel pour les Coated Conductors. Le dépôt de couches de LZO sur divers substrats métalliques, la préparation de précurseurs et des substrats, la croissance épitaxiale de couches tampon de LZO sont discutés en détail. On montre que l'acetylacétonate dissout dans l'acide propionique est une bonne solution. Une couche de S de structure c(2x2) à la surface du substrat permet le contrôle de l'orientation initiale des couches de LZO. Le carbone résiduel issu de la synthèse de LZO est un facteur inhibant la croissance des grains de LZO mais son gradient sous la surface est utile. La maitrise de l'ensemble de ces facteurs permet la formation de couches de haute qualité.

The electro–mechanical connection between under bump metallization (UBM) and solder in flip–chip bonding is achieved by the formation of brittle intermetallic compounds (IMCs) during the soldering process. These IMCs continue to grow in the solid–state during storage at room temperature and service at an elevated temperature leading to degradation of the contacts. In this thesis, the diffusion–controlled growth mechanism of the phases and the formation of the Kirkendall voids at the interface of UBM (Cu, Ni, Au, Pd, Pt) and Sn (bulk/electroplated) are studied extensively. Based on the microstructural analysis in SEM and TEM, the presence of bifurcation of the Kirkendall marker plane, a very special phenomenon discovered recently, is found in the Cu–Sn system. The estimated diffusion coefficients at these marker planes indicate one of the reasons for the growth of the Kirkendall voids, which is one of the major reliability concerns in a microelectronic component. Systematic experiments using different purity of Cu are conducted to understand the effect of impurities on the growth of the Kirkendall voids. It is conclusively shown that increase in impurity enhances the growth of voids. The growth rates of the interdiffusion zone are found to be comparable in the Cu–Sn and the Ni–Sn systems. EPMA and TEM analyses indicate the growth of a metastable phase in the Ni–Sn system in the low temperature range. Following, the role of Ni addition in Cu on the growth of IMCs in the Cu–Sn system is studied based on the quantitative diffusion analysis. The analysis of thermodynamic driving forces, microstructure and crystal structure of Cu6Sn5 shed light on the atomic mechanism of diffusion. It does not change the crystal structure of phases; however, the microstructural evolution, the diffusion rates of components and the growth of the Kirkendall voids are strongly influenced in the presence of Ni. Considering microstructure of the product phases in various Cu/Sn and Cu(Ni)/Sn diffusion couples, it has been observed that (i) phases have smaller grains and nucleate repeatedly, when they grow from Cu or Cu(Ni) alloy, and (ii) the same phases have elongated grains, when they grow from another phase. A difference in growth rate of the phases is found in bulk and electroplated diffusion couples in the Au–Sn system. The is explained in AuSn4 based on the estimated tracer diffusion coefficients, homologous temperature of the experiments, grain size distribution and crystal structure of the phase. The growth rates of the phases in the Au–Sn system are compared with the Pd–Sn and the Pt–Sn systems. Similar to the Au–Sn system, the growth rate of the interdiffusion zone is found to be parabolic in the Pd–Sn system; however, it is linear in the Pt–Sn system. Following, the effect of addition of Au, Pd and Pt in Cu is studied on growth rate of the phases. An analysis on the formation of the Kirkendall voids indicates that the addition of Pd or Pt is deleterious to the structure compared to the addition of Au. This study indicates that formation of voids is equally influenced by the presence of inorganic as well as organic impurities.