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Validity of the Jain and Balk analytic model for two-dimensional effects in short channel MOSFETSShelley, Valerie Anderson, 1957- January 1988 (has links)
The Jain and Balk analytic model for two-dimensional effects in short channel MOSFETS is investigated. The effects considered are Drain Induced Barrier Lowering, DIBL, and the maximum electric field, Emax, which influences Drain Induced High Field, DIHF. A scaled short channel design is used as the basis for the investigation. Cases are numerically simulated using the MINIMOS program. DIBL and Emax are calculated using the Jain and Balk model. Model values are compared to numerical simulation values. Results show the model consistently overestimates DIBL. Also, the range for which the model closely estimates Emax is found. Variation in Emax with change of junction depth Xj is investigated. The electric field, Ex, as it varies with depth in the channel is investigated, and compared to the Jain and Balk approximation. The deviations suggest that the model must break down for short channels.
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Radiation effects on power MOSFETs under simulated space radiation conditionsWahle, Peter Joseph, 1961- January 1989 (has links)
Application of power MOSFETs in spaceborne power converters was simulated by exposing devices to low-dose-rate ionizing radiation. Both radiation-hardened and nonhardened devices were tested with constant and switched gate biases during irradiation. In addition, some of the devices were under load. The threshold-voltage shifts were strongly bias dependent. The threshold-voltage shift of the nonhardened parts was approximately dose-rate independent, while the hardened parts exhibited significant dose-rate dependence. A pre-anneal dose-rate dependence was found for the interface-state buildup of the switched and positively biased devices, but the results for the switched devices were qualitatively different than those for the positively biased devices. The buildup of interface trapped charge was found to be the primary contributor to mobility degradation, which results in reduced drive capability and slower operation of the devices. These results indicate that new methods need to be utilized to accurately predict the performance of power MOSFETs in space environments.
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Two-dimensional simulation of the effects of total dose ionizing radiation on power-MOSFET breakdownDavis, Kenneth Ralph, 1964- January 1989 (has links)
The effects of ionizing radiation on the breakdown-voltage degradation of power-MOSFET termination structures were examined through two-dimensional simulation. A wide variety of sensitivity to surface-charge density was found for various devices employing floating field rings and/or equipotential field plates. Termination structures that were both insensitive to surface charge and possessed a high breakdown voltage were identified. The results were compared with measurements made on selected structures. The principal ionizing radiation damaging mechanisms in MOS devices are discussed. Modifications made to an existing simulation program in order to simulate these complex field ring and field plate structures are described. Background information into how these termination structures improve the breakdown voltage and their sensitivities to positive interface charge buildup is investigated.
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Thin film diamond : electronic devices for high temperature, high power and high radiation applicationsPang, Lisa Yee San January 2000 (has links)
No description available.
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Molecular weight effects of PBT-6 polymeric semiconductor on charge carrier mobilityRavi Sankar, Ashwin 13 January 2014 (has links)
Organic π-conjugated Donor-Acceptor copolymers are emerging as potential candidate materials for organic field effect transistor (OFET) and organic photovoltaic (OPV) applications. The electron-deficient benzothiadiazole group coupled with an electron-rich oligothiophene to form donor-acceptor copolymers has attracted significant attention. These low optical band gap materials absorb photons in the range of 400-800 nm and exhibit good thermal stability. In particular, poly(benzothiadiazole-sexithiophene) (PBT6) exhibits excellent performance in optoelectronic devices and high thermal stability. Here, we present the chemical synthesis and characterization of the polymer, PBT6. Three samples of PBT-6 with differing molecular weights in the range of Mn 18000-45000 Da were synthesized. Each polymer was characterized with respect to its photophysical, thermal properties and field-effected mobility was determined. Devices were prepared by drop-casting polymer solutions in 1,2-dichlorobenzene (DCB) onto an OFET (bottom gate/bottom contact) substrate and the devices were used to examine the charge transport properties of each polymer system. The optimal solvent to be used for processing technique was determined and surface techniques using OTS-8 and OTS-18 were compared through contact angle measurements. The measured charge carrier mobilities were in the range of 0.45-0.6 cm² / V.s. Polymer films prepared via drop-casting and which were thermal annealed exhibit mobilities as high as 0.825 cm² / V.s. This work examines the effect of molecular weight on the charge carrier transport properties and demonstrates the correlation of performance with molecular ordering. Drop-casted films of PBT-6 exhibit highly ordered crystalline lamellar structure with high degree of π- π stacking with edge-on orientation on the substrate. The longer conjugation lengths promote intrachain charge transfer. This high degree of molecular ordering in high MW samples of PBT6 improves the interchain and intrachain charge transfer leading to enhanced mobilities. The increased molecular weight (MW) facilitates in forming more uniform thin films which is vital in processing and application of polymer thin film technologies. These results and observations clearly demonstrate the potential of PBT-6 as a semiconducting material for Optoelectronic devices.
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Development of AlGaN/GaN High Electron Mobility Transistors (HEMTs) on diamond substratesNewham, Wesley Scott. 06 1900 (has links)
Silicon based semiconductor devices are rapidly approaching the theoretical limit of operation and are becoming unsuitable for future military requirements. The scope of semiconductor devices has been expanded by wide bandgap devices such as gallium nitride (GaN) to include the possibility for high power and high frequency operation. A new generation of high speed â high frequency devices is required to meet current and future military needs. The Gallium Nitride High Electron Mobility Transistor (HEMT) is showing great promise as the enabling technology in the development of military radar systems, electronic surveillance systems, communications systems and high voltage power systems. Typically, sapphire or silicon carbide is utilized as the substrate material in most HEMT designs. This thesis explores the possibility of utilizing a diamond substrate to increase the power handling capability of the AlGaN/GaN HEMT. Diamond offers increased thermal property parameters that can be simulated in the commercially available Silvaco software package. A complete electrical and thermal analysis of the model was conducted and compared to actual device characteristics. The results of the software simulation and measurements on the test devices indicate diamond substrates will enable the HEMT to be operated at a higher power than traditional sapphire substrate HEMTS.
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Thermal deposition approaches for graphene growth over various substratesPang, Jinbo 07 April 2017 (has links) (PDF)
In the course of the PhD thesis large area homogeneous strictly monolayer graphene films were successfully synthesized with chemical vapor deposition over both Cu and Si (with surface oxide) substrates. These synthetic graphene films were characterized with thorough microscopic and spectrometric tools and also in terms of electrical device performance. Graphene growth with a simple chemo thermal route was also explored for understanding the growth mechanisms.
The formation of homogeneous graphene film over Cu requires a clean substrate. For this reason, a study has been conducted to determine the extent to which various pre-treatments may be used to clean the substrate. Four type of pre-treatments on Cu substrates are investigated, including wiping with organic solvents, etching with ferric chloride solution, annealing in air for oxidation, and air annealing with post hydrogen reduction. Of all the pretreatments, air oxidation with post hydrogen annealing is found to be most efficient at cleaning surface contaminants and thus allowing for the formation of large area homogeneous strictly monolayer graphene film over Cu substrate.
Chemical vapor deposition is the most generally used method for graphene mass production and integration. There is also interest in growing graphene directly from organic molecular adsorbents on a substrate. Few studies exist. These procedures require multiple step reactions, and the graphene quality is limited due to small grain sizes. Therefore, a significantly simple route has been demonstrated. This involves organic solvent molecules adsorbed on a Cu surface, which is then annealed in a hydrogen atmosphere in order to ensure direct formation of graphene on a clean Cu substrate. The influence of temperature, pressure and gas flow rate on the one-step chemo thermal synthesis route has been investigated systematically. The temperature-dependent study provides an insight into the growth kinetics, and supplies thermodynamic information such as the activation energy, Ea, for graphene synthesis from acetone, isopropanol and ethanol. Also, these studies highlight the role of hydrogen radicals for graphene formation. In addition, an improved understanding of the role of hydrogen is also provided in terms of graphene formation from adsorbed organic solvents (e.g., in comparison to conventional thermal chemical vapor deposition).
Graphene synthesis with chemical vapor deposition directly over Si wafer with surface oxide (Si/SiOx ) has proven challenging in terms of large area and uniform layer number. The direct growth of graphene over Si/SiO x substrate becomes attractive because it is free of an undesirable transfer procedure, necessity for synthesis over metal substrate, which causes breakage, contamination and time consumption. To obtain homogeneous graphene growth, a local equilibrium chemical environment has been established with a facile confinement CVD approach, inwhich two Si wafers with their oxide faces in contact to form uniform monolayer graphene. A thorough examination of the material reveals it comprises facetted grains despite initially nucleating as round islands. Upon clustering these grains facet to minimize their energy, which leads to faceting in polygonal forms because the system tends to ideally form hexagons (the lowest energy form). This is much like the hexagonal cells in a beehive honeycomb which require the minimum wax. This process also results in a near minimal total grain boundary length per unit area. This fact, along with the high quality of the resultant graphene is reflected in its electrical performance which is highly comparable with graphene formed over other substrates, including Cu. In addition the graphene growth is self-terminating, which enables the wide parameter window for easy control.
This chemical vapor deposition approach is easily scalable and will make graphene formation directly on Si wafers competitive against that from metal substrates which suffer from transfer. Moreover, this growth path shall be applicable for direct synthesis of other two dimensional materials and their Van der Waals hetero-structures. / Im Zuge dieser Doktorarbeit wurden großflächige und homogene Graphen-Monolagen mittels chemischer Gasphasenabscheidung auf Kupfer- (Cu) und Silizium-(Si) Substraten erfolgreich synthetisiert. Solche monolagigen Graphenschichten wurden mithilfe mikroskopischer und spektrometrischer Methoden gründlich charakterisiert. Außerdem wurde der Wachstumsmechanismus von Graphen anhand eines chemo-thermischen Verfahrens untersucht.
Die Bildung von homogenen Graphenschichten auf Cu erfordert eine sehr saubere Substratoberfläche, weshalb verschiedene Substratvorbehandlungen und dessen Einfluss auf die Substratoberfläche angestellt wurden. Vier Vorbehandlungsarten von Cu-Substraten wurden untersucht: Abwischen mit organischen Lösungsmitteln, Atzen mit Eisen-(III)-Chloridlösung, Wärmebehandlung an Luft zur Erzeugung von Cu-Oxiden und Wärmebehandlung an Luft mit anschließender Wasserstoffreduktion. Von diesen Vorbehandlungen ist die zuletzt genannte Methode für die anschließende Abscheidung einer großflächigen Graphen-Mono-lage am effektivsten.
Die chemische Gasphasenabscheidung ist die am meisten verwendete Methode zur Massenproduktion von Graphen. Es besteht aber auch Interesse an alternativen Methoden, die Graphen direkt aus organischen, auf einem Substrat adsorbierten Molekülen, synthetisieren konnen. Jedoch gibt es derzeit nur wenige Studien zu derartigen alternativen Methoden. Solche Prozessrouten erfordern mehrstufige Reaktionen, welche wiederrum die Qualität der erzeugten Graphenschicht limitieren, da nur kleine Korngrößen erreicht werden konnen. Daher wurde in dieser Arbeit ein deutlich einfacherer Weg entwickelt. Es handelt sich dabei um ein Verfahren, bei dem auf einer Cu-Substratoberfläche adsorbierte, organische Lösungsmittelmoleküle in einer Wasserstoffatmosphäre geglüht werden, um eine direkte Bildung von Graphen auf einem sauberen Cu-Substrat zu gewahrleisten.Der Einfluss von Temperatur, Druck und Gasfluss auf diesen einstufigen chemothermischen Syntheseweg wurde systematisch untersucht. Die temperaturabhängigen Untersuchungen liefern einen Einblick in die Wachstumskinetik und thermodynamische Größen, wie zum Beispiel die Aktivierungsenergie Ea, für die Synthese von Graphen aus Aceton, Isopropanol oder Ethanol. Diese Studien untersuchen außerdem die Rolle von Wasserstoffradikalen auf die Graphensynthese. Weiterhin wurde ein verbessertes Verständnis der Rolle von Wasserstoff auf die Graphen-synthese aus adsorbierten, organischen Lösungsmitteln erlangt (beispielsweise im Vergleich zur konventionellen thermischen Gasphasenabscheidung).
Die direkte Graphensynthese mittels chemischer Gasphasenabscheidung auf Si-Substraten mit einer Oxidschicht (Si/SiOx ) ist extrem anspruchsvoll in Bezug auf die großflächige und einheitliche Abscheidung (Lagenanzahl) von Graphen-Monolagen. Das direkte Wachstum von Graphen auf Si/SiOx -Substrat ist interessant, da es frei von unerwünschten Übertragungsverfahren ist und kein Metall-substrat erfordert, welche die erzeugten Graphenschichten brechen lassen können. Um ein homogenes Graphenwachstum zu erzielen wurde durch den Kontakt zweier Si-Wafer, mit ihren Oxidflachen zueinander zeigend, eine lokale Umgebung im chemischen Gleichgewicht erzeugt. Diese Konfiguration der Si-Wafer ist nötig, um eine einheitliche Graphen-Monolage bilden zu können. Eine gründliche Untersuchung des abgeschiedenen Materials zeigt, dass trotz der anfänglichen Keimbildung von runden Inseln facettierte Körner erzeugt werden. Aufgrund der Bestrebung der Graphenkörner ihre (Oberflächen-) Energie zu minimieren, wird eine Facettierung der Körner in polygonaler Form erzeugt, was darin begründet liegt, dass das System idealerweise eine Anordnung von hexagonal geformten Körnern erzeugen würde (niedrigster Energiezustand). Der Prozess ist vergleichbar mit der sechseckigen Zellstruktur einer Bienenstockwabe, welche ein Minimum an Wachs erfordert. Dieser Prozess führt auch zu einer nahezu minimalen Gesamtkorn-grenzlänge pro Flächeneinheit. Diese Tatsache zusammen mit der hohen Qualität der resultierenden Graphenschicht spiegelt sich auch in dessen elektrischer Leistungsfähigkeit wider, die in hohem Maße mit der auf anderen Substraten gebildeten Graphenschichten (inklusive Cu-Substrate) vergleichbar ist. Darüber hinaus ist das Graphenwachstum selbstabschliessend, wodurch ein großes Parameterfenster für eine einfache und kontrollierte Synthese eröffnet wird.
Dieser Ansatz zur chemischen Gasphasenabscheidung von Graphen auf Si- Substraten ist leicht skalierbar und gegenüber der Abscheidung auf Metallsubstraten konkurrenzfähig, da keine Substratübertragung notig ist. Darüber hinaus ist dieser Prozess auch für die direkte Synthese anderer zweidimensionalen Materialien und deren Van-der-Waals-Heterostrukturen anwendbar.
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DC, MICROWAVE, AND NOISE PROPERTIES OF GAN BASED HETEROJUNCTION FIELD EFFECT TRANSISTORS AND THEIR RELIABILITY ISSUESZhu, Congyong 13 September 2013 (has links)
AlGaN/GaN and InAlN/GaN-based heterojunction field effect transistors (HFETs) have demonstrated great high power and high frequency performance. Although AlGaN/GaN HFETs are commercially available, there still remain issues regarding long-term reliability, particularly degradation and ultimately device failure due to the gate-drain region where the electric field peaks. One of the proposed degradation mechanisms is the inverse-piezoelectric effect that results from the vertical electric field and increases the tensile strain. Other proposed mechanisms include hot-electron-induced trap generation, impurity diffusion, surface oxidation, and hot-electron/phonon effects. To investigate the degradation mechanism and its impact on DC, microwave, and noise performance, comprehensive stress experiments were conducted in both un-passivated and passivated AlGaN/GaN HFETs. It was found that degradation of AlGaN/GaN HFETs under reverse-gate-bias stress is dominated by inverse-piezoelectric effect and/or hot-electron injection due to gate leakage. Degradation under on-state-high-field stress is dominated by hot-electron/phonon effects, especially at high drain bias. Both effects are induced by the high electric field present during stress, where the inverse-piezoelectric effect only relates to the vertical electric field and the hot-electron effect relates to the total electric field. InAlN/GaN-based HFETs are expected to have even better performance as power amplifiers due to the large 2DEG density at the InAlN/GaN interface and better lattice-matching. Electrical stress experiments were therefore conducted on InAlN/GaN HFETs with indium compositions ranging from 15.7% to 20.0%. Devices with indium composition of 18.5% were found to give the best compromise between reliability and device performance. For indium compositions of 15.7% and 17.5%, the HFET devices degraded very fast (25 h) under on-state-high-field stress, while the HFET devices with 20.0% indium composition showed very small drain. It was also demonstrated that hot-electron/phonon effects are the major degradation mechanism for InAlN/GaN HFETs due to a large 2DEG density under on-state operations, whereas the inverse-piezoelectric effect is very small due to the small strain for the near lattice-matched InAlN barrier. Compared to lattice-matched InAlN/GaN HFETs, AlGaN/GaN HFETs have much larger strain in the barrier and about half of the drain current level; however, the hot electron/hot phonon effects are still important, especially at high drain bias.
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Design and development of a high frequency Mosfet driverSwart, Arthur James 11 1900 (has links)
Thesis (M. Tech. Engineering: Electrical--Vaal University of Technology / A high-power Mosfet was incorporated as a switching device into the efficient Class E
configuration, where the switching device switches current through itself either
completely on or completely off at high frequencies.
The first objective of this project was to demonstrate the effectiveness of a phase-lock
loop circuit in generating stable high frequencies when connected in an indirect
frequency synthesizer configuration. The indirect frequency synthesizer has established
itself as a versatile frequency generator capable of generating high frequencies based on a lower stable reference frequency. The frequency generation stage incorporates a phaselock loop circuit, a frequency divider and a stable reference frequency section. The
phase-lock loop section incorporates the TTL based 74HC 4046 that is based upon the
common CMOS 4046 integrated circuit. The frequency divider section is built around the
CMOS-based 4526 whilst the reference frequency section incorporates the CMOS-based
4060. The frequency synthesizer produced a range of frequencies from 50 kHz to 8 MHz
in 50 kHz steps. The output voltage was constant at 5,5 V.
The second objective was to show that the complementary emitter follower is indeed a
worthy Mosfet gate drive circuit at high frequencies. The Mosfet driver stage produced a
voltage signal of at least 11 V, being able to source and sink relatively high peaks of
current, especially at high frequencies. Voltage amplification occurred through the use of
multiple CMOS-based 40106 inverters. The complementary emitter follower, known for
its low output impedance and its ability to source and sink large amounts of current, was
an important component in the final Mosfet gate section.
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Determination of elastic constants of transition metal oxide based thin films using surface brillouin scatteringAyele, Fekadu Hailu 19 September 2016 (has links)
A dissertation submitted to the Faculty of Science, Wits University,
in fulfilment of the requirements for the degree of Master of Science. 30 March 2016. / Bismuth ferrite BiFeO3 is a transition metal oxide that exhibits both antiferromagnetic
and ferroelectric orderings and is termed a magnetoelectric
multiferroic. These functional properties make it crucial for applications
in various nanoelectronic devices and sensors. However, the integration of
BiFeO3 in devices requires the scaling down of bulk BiFeO3 to nano dimensional
length scales in thin lm format. For this purpose, the elements
of the elastic constant tensor of BiF eO3 thin lms are requisite, especially
in multilayered or single layer-on-substrate device con gurations. It is thus
essential that mechanical properties of BiFeO3 thin lms be established due
to their size and growth mode dependence.
Therefore, the study aims to determine the propagation of the surface acoustic
waves and the elastic constants of BiFeO3 BFO thin lms in order to
tailor the mechanical properties for device applications. In this approach the
e ect of morphology and microstructure on the elastic constants has been
investigated. / MT2016
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