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Discover of new energy sources and solutions are one of the important global issues nowadays, which has a big impact on economy as well as environment. One of the methods to help to mitigate this issue is to recover wasted heat, which is produced in large quantities by the industry, through vehicle exhausts and in many other situations where we consume energy. One way to do this would be using thermoelectric (TE) materials, which enable direct interconversion between heat and electrical energy. This thesis investigates how the novel material combinations and nanotechnology could be used for fabricating more efficient TE materials and devices. The work presents synthesis, processing, and electrical characterization of group IV materials for TE applications. The starting point is epitaxial growth of alloys of group IV elements, silicon (Si), germanium (Ge) and tin (Sn), with a focus on SiGe and GeSn(Si) alloys. The material development is performed using chemical vapor deposition (CVD) technique. Strained and strain-relaxed Ge1-x Snx (0.01≤x≤0.15) has been successfully grown on Ge buffer and Si substrate, respectively. It is demonstrated that a precise control of temperature, growth rate, Sn flow and buffer layer quality is necessary to overcome Sn segregation and achieve a high quality GeSn layer. The incorporation of Si and n- and p-type dopant atoms is also investigated and it was found that the strain can be compensated in the presence of Si and dopant atoms.  Si1-xGexlayers are grown on Si-on-insulator wafers and condensed by oxidation at 1050 ᵒC to manufacture SiGe-on-insulator (SGOI) wafers. Nanowires (NWs) are processed, either by sidewall transfer lithography (STL), or by using conventional lithography, and subsequently manufactured into nanoscale dimensions by focused ion beam (FIB) technique. The NWs are formed in an array, where one side is heated by a resistive heater made of Ti/Pt. The power factor of NWs is measured and the results are compared for NWs manufactured by different methods. It is found that the electrical properties of NWs fabricated with FIB technique can be influenced due to Ga doping during ion milling. Finally, the carrier transport in SiGe NWs formed on SGOI samples is tailored by applying a back-gate voltage on the Si substrate. In this way, the power factor is improved by a factor of 4. This improvement is related to the presence of defects and/or small fluctuation of nanowire shape and Ge content along the NWs, generated during processing and condensation of SiGe layers. The SiGe results open a new window for operation of SiGe NWs-based TE devices in the new temperature range of 250 to 450 K. / <p>QC 20160907</p>

Les matériaux (Si)GeSn sont très prometteurs pour les composants optiques sur puce fonctionnant dans le Moyen Infra-Rouge (MIR). Lors de cette thèse de doctorat, j’ai étudié le Dépôt Chimique en Phase Vapeur d’alliages GeSn. L’épitaxie basse température de Ge pur, de Ge dopé phosphore et d’alliages GeSi a tout d’abord été explorée. L’utilisation du digermane (Ge2H6) au lieu du germane (GeH4) nous a permis d’augmenter considérablement la vitesse de croissance du germanium à des températures en dessous de425 °C. Des concentrations très importantes en atome de P électriquement actifs ont été atteintes à 350 °C, 100 Torr en chimie Ge2H6 + PH3 (au maximum 7.5x1019 cm-3). Nous avons par la suite combiné le Ge2H6 avec le disilane (Si2H6) ou le dichlorosilane (SiH2Cl2) afin d’étudier la cinétique de croissance du GeSi à 475 °C, 100 Torr. Des concentrations de Ge définitivement plus élevées (77-82%) et une meilleure qualité de surface ont été obtenues avec le SiH2Cl2. Finalement, la croissance basse température d’alliages GeSn a été étudiée dans notre bâti d’épitaxie industriel 200 mm. Le digermane (Ge2H6) et le tétrachlorure d'étain (SnCl4) ont été utilisés pour explorer la cinétique de croissance et les mécanismes de relaxation des contraintes du GeSn. Une large gamme de concentrations en Sn, i.e. 6-16%, a été sondée et ces points de fonctionnement utilisés pour épitaxier des couches épaisses de GeSn partiellement relaxées. Nous avons ainsi mis en évidence l’intérêt d’utiliser une structure dite en escalier, en termes de qualité cristalline et de morphologie de surface. Un tel empilement, avec 16% de Sn dans sa partie supérieure, a montré une structure de bande directe et a conduit à une émission laser (dans des micro-disques) à une longueur d’onde de 3.1 µm. Ce laser a fonctionné jusqu’à 180 K et a un seuil de 377 kW/cm² à 25K. / (Si)GeSn is very promising for use in Mid Infra-Red (MIR) group-IV optical components on chip. During this PhD, I have studied the Reduced Pressure Chemical Vapor Deposition of GeSn alloys. The very low temperature epitaxy of pure Ge, heavily phosphorous doped Ge and Ge-rich SiGe alloys have first of all been investigated. Using digermane (Ge2H6) instead of germane (GeH4) enabled us to dramatically increase the Ge growth rate at temperatures 425 °C and lower. Very high electrically active P concentrations were obtained at 350 °C, 100 Torr with a Ge2H6 + PH3 chemistry (at most 7.5x1019 cm-3). We have then combined digermane with disilane (Si2H6) or dichlorosilane (SiH2Cl2) in order to study the GeSi growth kinetics at 475 °C, 100 Torr. Definitely higher Ge concentrations (77-82%) and smoother surfaces have been obtained with SiH2Cl2. We have then explored the low temperature epitaxy of high Sn content GeSn alloys in our 200 mm industrial RP-CVD tool. Digermane (Ge2H6) and tin tetrachloride (SnCl4) were used to investigate the GeSn growth kinetics and strain relaxation mechanisms. Large range of Sn concentrations, i.e. in the 6-16% range, was probed and data points used to grow thick, partially relaxed GeSn layers. The benefits of using Step-Graded structures, in terms of crystalline quality and surface morphology, was conclusively demonstrated for thick GeSn layers with high Sn contents. Such a stack, with 16% of Sn in the top part, was direct bandgap and led to a laser operation (in micro-disks) up to 180 K at an emission wavelength of 3.1 µm and with a lasing threshold of 377 kW/cm² at 25K.

abstract: Sn-based group IV materials such as Ge1-xSnx and Ge1-x-ySixSny alloys have great potential for developing Complementary Metal Oxide Semiconductor (CMOS) compatible devices on Si because of their tunable band structure and lattice constants by controlling Si and/or Sn contents. Growth of Ge1-xSnx binaries through Molecular Beam Epitaxy (MBE) started in the early 1980s, producing Ge1-xSnx epilayers with Sn concentrations varying from 0 to 100%. A Chemical Vapor Deposition (CVD) method was developed in the early 2000s for growing Ge1-xSnx alloys of device quality, by utilizing various chemical precursors. This method dominated the growth of Ge1-xSnx alloys rapidly because of the great crystal quality of Ge1-xSnx achieved. As the first practical ternary alloy completely based on group IV elements, Ge1-x-ySixSny decouples bandgap and lattice constant, becoming a prospective CMOS compatible alloy. At the same time, Ge1-x-ySixSny ternary system could serve as a thermally robust alternative to Ge1-ySny binaries given that it becomes a direct semiconductor at a Sn concentration of 6%-10%. Ge1-x-ySixSny growths by CVD is summarized in this thesis. With the Si/Sn ratio kept at ~3.7, the ternary alloy system is lattice matched to Ge, resulting a tunable direct bandgap of 0.8-1.2 eV. With Sn content higher than Si content, the ternary alloy system could have an indirect-to-direct transition, as observed for Ge1-xSnx binaries. This thesis summarizes the development of Ge1-xSnx and Ge1-x-ySixSny alloys through MBE and CVD in recent decades and introduces an innovative direct injection method for synthesizing Ge1-x-ySixSny ternary alloys with Sn contents varying from 5% to 12% and Si contents kept at 1%-2%. Grown directly on Si (100) substrates in a Gas-phase Molecular Epitaxy (GSME) reactor, both intrinsic and n-type doped Ge1-x-ySixSny with P with thicknesses of 250-760 nm have been achieved by deploying gas precursors Ge4H10, Si4H10, SnD4 and P(SiH3)3 at the unprecedented low growth temperatures of 190-220 °C. Compressive strain is reduced and crystallinity of the Ge1-x-ySixSny epilayer is improved after rapid thermal annealing (RTA) treatments. High Resolution X-ray Diffraction (HR-XRD), Rutherford Backscattering Spectrometry (RBS), cross-sectional Transmission Electron Microscope (XTEM) and Atomic Force Microscope (AFM) have been combined to characterize the structural properties of the Ge1-x-ySixSny samples, indicating good crystallinity and flat surfaces. / Dissertation/Thesis / Masters Thesis Chemistry 2019

Doping allows us to modify semiconductor materials for desired properties such as conductivity, bandgap, and / or lattice parameter. A small portion replacement of the highly mismatched isoelectronic dopants with the host atoms of a semiconductor can result in drastic variation of its structural, optical, and / or electronic properties. Here, the term "mismatch" describes the properties of atom size, ionicity, and / or electronegativity. This thesis presents the fabrication of two kinds of highly mismatched semiconductor alloys, i.e., Ge(1-x)Sn(x) and GaAs(1-x)N(x). The structural and optical properties of the prepared Ge(1-x)Sn(x) and GaAs(1-x)N(x) have been investigated. The results suggest an efficient above-solubility doping induced by non-equilibrium methods of ion implantation and ultrashort annealing. Pulsed laser melting promotes the regrowth of monocrystalline Ge(1-x)Sn(x), whereas flash lamp annealing brings about the formation of high quality GaAs(1-x)N(x) with room temperature photoluminescence. The bandgap modification of Ge(1-x)Sn(x) and GaAs(1-x)N(x) has been verified by optical measurements of spectroscopic ellipsometry and photoluminescence, respectively. In addition, effective defect engineering in GaAs has been achieved by flash lamp annealing, by which a quasi-temperature-stable photoluminescence at 1.3 µm has been obtained. / Dotierung ermöglicht es, die Eigenschaften von Halbleitermaterialien, wie Leitfähigkeit, aber auch Bandabstand und / oder Gitterkonstanten gezielt zu verändern. Wenn ein Halbleiter mit einer kleinen Menge unterschiedliche Fremdatome dotiert wird, kann dies in einer drastischen Modifikation der strukturellen, optischen und / oder elektronischen Eigenschaften resultieren. Der Begriff "unterschiedlich" bedeutet hier die Eigenschaften von Atomgröße, Ioniztät und / oder Elektronegativität. Diese Doktorarbeit beschreibt die Herstellung von zwei Arten von stark fehlangepassten Halbleiterlegierungen: Ge(1-x)Sn(x) und GaAs(1-x)N(x). Die strukturellen und optischen Eigenschaften von Ge(1-x)Sn(x) und GaAs(1-x)N(x) wurden untersucht. Die Ergebnisse deuten auf eine effiziente Dotierung oberhalb der Löslichkeit, induziert durch die Nicht-Gleichgewichtsverfahren Ionenimplantation und Ultrakurzzeit-Ausheilung. Gepulstes Laserschmelzen ermöglicht das Nachwachsen von monokristallinem Ge(1-x)Sn(x), während die Blitzlampenausheilung in der Bildung von GaAs(1-x)N(x) hoher Qualität mit Photolumineszenz bei Raumtemperatur resultiert. Die Änderung der Bandlücke von Ge(1-x)Sn(x) und GaAs(1-x)N(x) wurde durch die optischen Methoden der spektroskopischen Ellipsometrie und Photolumineszenz verifiziert. Darüber hinaus konnte in ausgeheiltem GaAs eine quasi-temperaturstabile Photolumineszenz bei 1,3 µm beobachtet werden.

Doping allows us to modify semiconductor materials for desired properties such as conductivity, bandgap, and / or lattice parameter. A small portion replacement of the highly mismatched isoelectronic dopants with the host atoms of a semiconductor can result in drastic variation of its structural, optical, and / or electronic properties. Here, the term "mismatch" describes the properties of atom size, ionicity, and / or electronegativity. This thesis presents the fabrication of two kinds of highly mismatched semiconductor alloys, i.e., Ge(1-x)Sn(x) and GaAs(1-x)N(x). The structural and optical properties of the prepared Ge(1-x)Sn(x) and GaAs(1-x)N(x) have been investigated. The results suggest an efficient above-solubility doping induced by non-equilibrium methods of ion implantation and ultrashort annealing. Pulsed laser melting promotes the regrowth of monocrystalline Ge(1-x)Sn(x), whereas flash lamp annealing brings about the formation of high quality GaAs(1-x)N(x) with room temperature photoluminescence. The bandgap modification of Ge(1-x)Sn(x) and GaAs(1-x)N(x) has been verified by optical measurements of spectroscopic ellipsometry and photoluminescence, respectively. In addition, effective defect engineering in GaAs has been achieved by flash lamp annealing, by which a quasi-temperature-stable photoluminescence at 1.3 µm has been obtained. / Dotierung ermöglicht es, die Eigenschaften von Halbleitermaterialien, wie Leitfähigkeit, aber auch Bandabstand und / oder Gitterkonstanten gezielt zu verändern. Wenn ein Halbleiter mit einer kleinen Menge unterschiedliche Fremdatome dotiert wird, kann dies in einer drastischen Modifikation der strukturellen, optischen und / oder elektronischen Eigenschaften resultieren. Der Begriff "unterschiedlich" bedeutet hier die Eigenschaften von Atomgröße, Ioniztät und / oder Elektronegativität. Diese Doktorarbeit beschreibt die Herstellung von zwei Arten von stark fehlangepassten Halbleiterlegierungen: Ge(1-x)Sn(x) und GaAs(1-x)N(x). Die strukturellen und optischen Eigenschaften von Ge(1-x)Sn(x) und GaAs(1-x)N(x) wurden untersucht. Die Ergebnisse deuten auf eine effiziente Dotierung oberhalb der Löslichkeit, induziert durch die Nicht-Gleichgewichtsverfahren Ionenimplantation und Ultrakurzzeit-Ausheilung. Gepulstes Laserschmelzen ermöglicht das Nachwachsen von monokristallinem Ge(1-x)Sn(x), während die Blitzlampenausheilung in der Bildung von GaAs(1-x)N(x) hoher Qualität mit Photolumineszenz bei Raumtemperatur resultiert. Die Änderung der Bandlücke von Ge(1-x)Sn(x) und GaAs(1-x)N(x) wurde durch die optischen Methoden der spektroskopischen Ellipsometrie und Photolumineszenz verifiziert. Darüber hinaus konnte in ausgeheiltem GaAs eine quasi-temperaturstabile Photolumineszenz bei 1,3 µm beobachtet werden.

InGaN heterostructures are at the core of blue light emitting diodes (LEDs) which are the basic building blocks for energy efficient and environment friendly modern white light generating sources. Through quantum confinement and electronic band structure tuning on the opposite end of the spectrum, Ge1−xSnx alloys have recently attracted significant interest due to its potential role as a silicon compatible infra-red (IR) optical material for photodetectors and LEDs owing to transition to direct bandgap with increasing Sn. This thesis is dedicated to establishing an understanding of the optical processes and carrier dynamics in InGaN heterostructures for achieving more efficient visible light emitters and terahertz generating nanocavities and in colloidal Ge1−xSnx quantum dots (QDs) for developing efficient silicon compatible optoelectronics. To alleviate the electron overflow, which through strong experimental evidence is revealed to be the dominating mechanism responsible for efficiency degradation at high injection in InGaN based blue LEDs, different strategies involving electron injectors and optimized active regions have been developed. Effectiveness of optimum electron injector (EI) layers in reducing electron overflow and increasing quantum efficiency of InGaN based LEDs was demonstrated by photoluminescence (PL) and electroluminescence spectroscopy along with numerical simulations. Increasing the two-layer EI thickness in double heterostructure LEDs substantially reduced the electron overflow and increased external quantum efficiency (EQE) by three fold. By incorporating δ p-doped InGaN barriers in multiple quantum well (MQW) LEDs, 20% enhancement in EQE was achieved due to improved hole injection without degrading the layer quality. Carrier diffusion length, an important physical parameter that directly affects the performance of optoelectronic devices, was measured in epitaxial GaN using PL spectroscopy. The obtained diffusion lengths at room temperature in p- and n-type GaN were 93±7 nm and 432±30 nm, respectively. Moreover, near field scanning optical microscopy was employed to investigate the spatial variations of extended defects and their effects on the optical quality of semipolar and InGaN heterostructures, which are promoted for higher efficiency light emitters owing to reduced internal polarization fields. The near-field PL from the c+ wings in heterostructures was found to be relatively strong and uniform across the sample but the emission from the c- wings was substantially weaker due to the presence of high density of threading dislocations and basal plane stacking faults. In case of heterostructures, striated regions had weaker PL intensities compared to other regions and the meeting fronts of different facets were characterized by higher Indium content due to the varying internal field. Apart from being the part and parcel of blue LEDs, InGaN heterostructures can be utilized in generation of coherent lattice vibrations at terahertz frequencies. In analogy to LASERs based on photon cavities where light intensity is amplified, acoustic nanocavity devices can be realized for sustaining terahertz phonon oscillations which could potentially be used in acoustic imaging at the nanoscale and ultrafast acousto-optic modulation. Using In0.03Ga0.97N/InxGa1-xN MQWs with varying x, coherent phonon oscillations at frequencies of 0.69-0.80 THz were generated, where changing the MQW period (11.5 nm -10 nm) provided frequency tuning. The magnitude of phonon oscillations was found to increase with indium content in quantum wells, as demonstrated by time resolved differential transmission spectroscopy. Design of an acoustic nanocavity structure was proposed based on the abovementioned experimental findings and also supported by full cavity simulations. Optical gap engineering and carrier dynamics in colloidal Ge1−xSnx QDs were investigated in order to explore their potential in optoelectronics. By changing the Sn content from 5% to 23% in 2 nm-QDs, band-gap tunability from 1.88 eV to 1.61 eV, respectively, was demonstrated at 15 K, consistent with theoretical calculations. At 15 K, time resolved PL spectroscopy revealed slow decay (3 − 27 μs) of luminescence, due to recombination of spin-forbidden dark excitons and effect of surface states. Increase in temperature to 295 K led to three orders of magnitude faster decay (9 − 28 ns) owing to the effects of thermal activation of bright excitons and carrier detrapping from surface states. These findings on the effect of Sn incorporation on optical properties and carrier relaxation and recombination processes are important for future design of efficient Ge1−xSnx QDs based optoelectronic devices. This thesis work represents a comprehensive optical study of InGaN heterostructures and colloidal Ge1−xSnx QDs which would pave the way for more efficient InGaN based LEDs, realization of terahertz generating nanocavities, and efficient Ge1−xSnx based silicon compatible optoelectronic devices.

abstract: The work described in this thesis explores the synthesis of new semiconductors in the Si-Ge-Sn system for application in Si-photonics. Direct gap Ge1-ySny (y=0.12-0.16) alloys with enhanced light emission and absorption are pursued. Monocrystalline layers are grown on Si platforms via epitaxy-driven reactions between Sn- and Ge-hydrides using compositionally graded buffer layers that mitigate lattice mismatch between the epilayer and Si platforms. Prototype p-i-n structures are fabricated and are found to exhibit direct gap electroluminescence and tunable absorption edges between 2200 and 2700 nm indicating applications in LEDs and detectors. Additionally, a low pressure technique is described producing pseudomorphic Ge1-ySny alloys in the compositional range y=0.06-0.17. Synthesis of these materials is achieved at ultra-low temperatures resulting in nearly defect-free films that far exceed the critical thicknesses predicted by thermodynamic considerations, and provide a chemically driven route toward materials with properties typically associated with molecular beam epitaxy. Silicon incorporation into Ge1-ySny yields a new class of Ge1-x-ySixSny (y>x) ternary alloys using reactions between Ge3H8, Si4H10, and SnD4. These materials contain small amounts of Si (x=0.05-0.08) and Sn contents of y=0.1-0.15. Photoluminescence studies indicate an intensity enhancement relative to materials with lower Sn contents (y=0.05-0.09). These materials may serve as thermally robust alternatives to Ge1-ySny for mid-infrared (IR) optoelectronic applications. An extension of the above work is the discovery of a new class of Ge-like Group III-V-IV hybrids with compositions Ga(As1–xPx)Ge3 (x=0.01-0.90) and (GaP)yGe5–2y related to Ge1-x-ySixSny in structure and properties. These materials are prepared by chemical vapor deposition of reactive Ga-hydrides with P(GeH3)3 and As(GeH3)3 custom precursors as the sources of P, As, and Ge incorporating isolated GaAs and GaP donor-acceptor pairs into diamond-like Ge-based structures. Photoluminescence studies reveal bandgaps in the near-IR and large bowing of the optical behavior relative to linear interpolation of the III-V and Ge end members. Similar materials in the Al-Sb-B-P system are also prepared and characterized. The common theme of the above topics is the design and fabrication of new optoelectronic materials that can be fully compatible with Si-based technologies for expanding the optoelectronic capabilities of Ge into the mid-IR and beyond through compositional tuning of the diamond lattice. / Dissertation/Thesis / Doctoral Dissertation Chemistry 2018

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