Municipal electorates across America are vocal, unrepresentative networks. With lower turnout rates than state and national elections, the local electoral process disproportionately elects white, older, home-owning officials. Voting and elected bodies align demographically, thus leading to a policy that disproportionately reflects the interests of white, older, home-owning voters (Levine Einstein, Ornstein, & Palmer, 2019). This cycle is problematic because it halts the passage of policy that reflects the interest of historically underrepresented voters: young people and people of color. I argue that, for local races, campaign methods disproportionately mobilize the social networks that white, older, home-owning voters belong to. Members of these groups disproportionately occupy low-density housing-building types that can be accessed and mobilized by all campaigns. I suggest a relationship exists between housing density and turnout, with voters residing in low-density housing participating at higher rates in local elections. Therefore, local races have smaller budgets and fewer reserves to invest in mobilizing voters residing in high-density housing. To assess this relationship, I compare housing density - whether a voter lives in low density or high-density housing - and individual voting records from 2017 to 2021 across four municipalities in Massachusetts: Cambridge, Boston, Somerville, and Worcester. I expect to find that compared to voters living in low-density housing, those residing in high-density housing - disproportionately young voters and voters of color - are turning out at lower rates in local elections than in the 2018 Midterm and 2020 Presidential Elections. To change this cycle, scholars must pay more attention to the role housing density plays in inhibiting local mobilization efforts, and campaigns must collaborate to mobilize voting members of all social networks, especially those residing in high-density housing.

This thesis investigates the disparities in losses between 2D-based design simulations and a 3D realization of solenoidal inductors featuring distributed gaps. The inductor geometry entails a solenoidal copper winding enveloped by sintered ferrite rings and end caps, with the air gap required for energy storage distributed over multiple smaller discrete gaps. The simulated 3D structure possesses higher losses than its 2D cross-section due to inherent structural features. The research culminates in two contributions. First, a practical two-variable design approach is presented, leveraging matrix algebra to succinctly represent the decision quantities as functions of the two most important variables to the application. The procedure results yield several informative plots that assist in selecting a design that meets the efficiency and thermal limits. Second, a detailed explanation is provided on the 3D loss effects, along with the recommended design considerations and a method to estimate the dominant 3D loss effect using simple 2D simulations. The design recommendations address a 26-fold increase in the core loss of the outer ferrite rings. They also reduce the copper loss due to the termination effect by 55% using spacer ferrite layers. A simple 2D simulation method is proposed to accurately predict the increased 3D copper loss due to the axial shift of the winding to within 3% and runs 60 times faster than the equivalent 3D simulation. Additionally, a derived equation for the optimal turn spacing aligns with the simulation results with <6% error, offering practical insights for design optimization. These results enable the design of a low-loss solenoidal inductor and accurate loss estimations without running lengthy and complicated 3D simulations. A 13 µH, 150 Arms solenoidal inductor prototype for operation in a 10 kV-to-400 V, 50 kW converter cell serves as empirical validation, corroborating the efficacy of the proposed analysis and design methodology. / Master of Science / It is common to rely on a 2D cross-section of the structure to facilitate the design procedure for inductors, essential components used in electronic circuits to control and convert energy. Two-dimensional simulations of inductors are preferred due to their modeling simplicity, running speed, and low processing power requirement compared to 3D simulations. This thesis investigates the disparities in losses between 2D-based design simulations and a 3D realization of solenoidal inductors featuring distributed gaps. The inductor geometry entails a helical copper winding enveloped by rings and end caps made of a magnetic material. There are multiple small air gaps between the magnetic rings that are required for energy storage, and having multiple small gaps instead of a single large one is referred to as "distributed gaps". The simulated 3D structure possesses higher losses than its 2D cross-section due to inherent structural features. The research culminates in two contributions. First, a practical two-variable design approach is presented, leveraging matrix algebra to succinctly represent the decision quantities as functions of the two most important variables to the application. The procedure results yield several informative plots that assist in selecting a design that meets the efficiency and thermal limits. Second, a detailed explanation is provided on the 3D loss effects, along with the recommended design considerations and a method to estimate the dominant 3D loss effect using simple 2D simulations. The design recommendations address a 26-fold increase in the loss of the outer rings and reduce the copper loss by 55%. A simple 2D simulation method is proposed to accurately predict the increased 3D copper loss to within 3% and runs 60 times faster than the equivalent 3D simulation. Additionally, a derived equation for the optimal turn spacing aligns with the simulation results with <6% error, offering practical insights for design optimization. These results enable the design of a low-loss solenoidal inductor and accurate loss estimations without running lengthy and complicated 3D simulations. A 13 µH, 150 Arms solenoidal inductor prototype for operation in a 10 kV-to-400 V, 50 kW converter cell serves as empirical validation, corroborating the efficacy of the proposed analysis and design methodology.

Through recent advancements in high-density dimensional (HDD) measurement technologies, such as 3D laser scanners, data-sets consisting of an almost complete representation of a manufactured part's geometry can now be obtained. While HDD data measurement devices have traditionally been used in reverse engineering application, they are beginning to be applied as in-line measurement devices. Unfortunately, appropriate quality control (QC) techniques have yet to be developed to take full advantage of this new data-rich environment and for the most part rely on extracting discrete key product characteristics (KPCs) for analysis. In order to maximize the potential of HDD measurement technologies requires a new quality paradigm. Specifically, when presented with HDD data, quality should not only be assessed by discrete KPCs but should consider the entire part being produced, anything less results in valuable data being wasted. This dissertation addresses the need for adapting current techniques and developing new approaches for the use of HDD data in manufacturing systems to increase overall quality control (QC) capabilities. Specifically, this research effort focuses on the use of HDD data for 1) Developing a framework for self-correcting compliant assembly systems, 2) Using statistical process control to detect process shifts through part surfaces, and 3) Performing automated part inspection for non-feature based faults. The overarching goal of this research is to identify how HDD data can be used within these three research focus areas to increase QC capabilities while following the principles of the aforementioned new quality paradigm. / Ph. D.

Total and high-density lipoprotein cholesterol (TC and HDL-C) and TC/HDL-C ratio were compared in 30 adult male recreational swimmers and 21 sedentary controls. Percentage of body fat, number of cigarettes smoked daily, and daily alcohol consumption were assessed for both groups. Maximum workout heartrate, weekly swim duration and weekly swim distance of the swimmers were also measured. Maximum workout heartrate (mean ± S. D. ) was 140 ± 24 beats per minute . Mean weekly swim duration was 142 ± 84 minutes, and mean weekly swim distance was 5317 ± 3217 yards. Swimmers and controls were nonsignificantly different in age, number of cigarettes smoked daily, and percent body fat. In this sample, the swimmers consumed significantly higher levels of alcohol than the non-swimmers. TC and HDL-C concentrations of swimmers were not significantly different than controls, (204 vs 199 mg/dl, and 48 vs 47 mg/dl, respectively). TC/HDL-C ratio of swimmers was 4.69, while that of controls was 4.65. This study showed that adult male recreational swimmers who train at low intensity do not differ significantly in total and HDL-C or TC/HDL-C ratio from male sedentary controls. / M.S.

This study focuses on development a planar power module with low thermal impedance and thermo-mechanical stress for high density integration of power electronics systems. With the development semiconductor technology, the heat flux generated in power device keeps increasing. As a result, more and more stringent requirements were imposed on the thermal and reliability design of power electronics packaging. In this dissertation, a boundary-dependent RC transient thermal model was developed to predict the peak transient temperature of semiconductor device in the power module. Compared to conventional RC thermal models, the RC values in the proposed model are functions of boundary conditions, geometries, and the material properties of the power module. Thus, the proposed model can provide more accurate prediction for the junction temperature of power devices under variable conditions. In addition, the transient thermal model can be extracted based on only steady-state thermal simulation, which significantly reduced the computing time. To detect the peak transient temperature in a fully packaged power module, a method for thermal impedance measurement was proposed. In the proposed method, the gate-emitter voltage of an IGBT which is much more sensitive to the temperature change than the widely used forward voltage drop of a pn junction was monitored and used as temperature sensitive parameter. A completed test circuit was designed to measure the thermal impedance of the power module using the gate-emitter voltage. With the designed test set-up, in spite of the temperature dependency of the IGBT electrical characteristics, the power dissipation in the IGBT can be regulated to be constant by adjusting the gate voltage via feedback control during the heating phase. The developed measurement system was used to evaluate thermal performance and reliability of three different die-attach materials. From the prediction of the proposed thermal model, it was found that the conventional single-sided power module with wirebond connection cannot achieve both good steady-state and transient thermal performance under high heat transfer coefficient conditions. As a result, a plate-bonded planar power module was designed to resolve the issue. The comparison of thermal performance for conventional power module and the plate-bonded power module shows that the plate-bonded power module has both better steady-state and transient thermal performance than the wirebonded power module. However, due to CTE mismatch between the copper plate and the silicon device, large thermo-mechanical stress is induced in the bonding layer of the power module. To reduce the stress in the plate-bonded power module, an improved structure called trenched copper plate structure was proposed. In the proposed structure, the large copper plate on top of the semiconductor can be partitioned into several smaller pieces that are connected together using a thin layer copper foil. The FEM simulation shows that, with the improved structure, the maximum von Mises stress and plastic strain in the solder layer were reduced by 18.7% and 67.8%, respectively. However, the thermal impedance of the power module increases with reduction of the stress. Therefore, the trade-off between these two factors was discussed. To verify better reliability brought by the trenched copper plate structure, twenty-four samples with three different copper plate structures were fabricated and thermally cycled from -40°C to 105°C. To detect the failure at the bonding layer, the curvature of these samples were measured using laser scanning before and after cycling. By monitoring the change of curvature, the degradation of bonding layer can be detected. Experimental results showed that the samples with different copper plate structure had similar curvature before thermal cycle. The curvatures of the samples with single copper plate decreased more than 80% after only 100 cycles. For the samples with 2 × 2 copper plate and the samples with 3 × 3 copper plate, the curvatures became 75.8% and 77.5% of the original values, respectively, indicating better reliability than the samples with single copper plate. The x-ray pictures of cross-sectioned samples confirmed that after 300 cycles, the bonding layer for the sample with single copper plate has many cracks and delaminations starting from the edge. / Ph. D.

Oxidative processes are linked to a number of major disease states as well as the breakdown of many materials. Of particular importance are reactive oxygen species (ROS), as they are known to be endogenously produced in biological systems as well as exogenously produced through a variety of different means. In hopes of better understanding what controls the behavior of ROS, researchers have studied radical chemistry on a fundamental level. Fundamental knowledge of what contributes to oxidative processes can be extrapolated to more complex biological or macromolecular systems. Fundamental concepts and applied data (i.e. interaction of ROS with polymers, biomolecules, etc.) are critical to understanding the reactivity of ROS. A detailed review of the literature, focusing primarily on the hydroxyl radical (HO•) and hydrogen atom (H•) abstraction reactions, is presented in Chapter 1. Also reviewed herein is the literature concerning high density polyethylene (HDPE) degradation. Exposure to treated water systems is known to greatly reduce the lifetime of HDPE pipe. While there is no consensus on what leads to HDPE breakdown, evidence suggests oxidative processes are at play. The research which follows in Chapter 2 focuses on the reactivity of the hydroxyl radical and how it is controlled by its environment. The HO• has been thought to react instantaneously, approaching the diffusion controlled rate and showing little to no selectivity. Both experimental and calculational evidence suggest that some of the previous assumptions regarding hydroxyl radical reactivity are wrong and that it is decidedly less reactive in an aprotic polar solvent than in aqueous solution. These findings are explained on the basis of a polarized transition state that can be stabilized via the hydrogen bonding afforded by water. Experimental and calculational evidence also suggest that the degree of polarization in the transition state will determine the magnitude of this solvent effect. Chapter 3 discusses the results of HDPE degradation studies. While HDPE is an extremely stable polymer, exposure to chlorinated aqueous conditions severely reduces the lifetime of HDPE pipes. While much research exists detailing the mechanical breakdown and failure of these pipes under said conditions, a gap still exists in defining the species responsible or mechanism for this degradation. Experimental evidence put forth in this dissertation suggests that this is due to an auto-oxidative process initiated by free radicals in the chlorinated aqueous solution and propagated through singlet oxygen from the environment. A mechanism for HDPE degradation is proposed and discussed. Additionally two small molecules, 2,3-dichloro-2-methylbutane and 3-chloro-1,1-di-methylpropanol, have been suggested as HDPE byproducts. While the mechanism of formation for these products is still elusive, evidence concerning their identification and production in HDPE and PE oligomers is discussed. Finally, Chapter 4 deals with concluding remarks of the aforementioned work. Future work needed to enhance and further the results published herein is also addressed. / Ph. D.

Research has reported that increased levels of plasma TC are directly related, while low levels of plasma HDL-C are inversely related, to coronary heart disease. Regular physical exercise has been suggested as a method for reducing plasma TC and increasing plasma HDL-C. Thirty-one healthy, sedentary women (ages 18-30) were studied to determine the effects of a jogging, weight training, or a combined jogging and weight training program on plasma total cholesterol, high-density lipoproteins, body composition. Experimental subjects were randomly assigned to the treatment conditions. The subjects trained three days a week for nine weeks. The R group ran for 30 minutes a session at 75% predicted maximum HR. The W group trained with weights utilizing exercises to strengthen all major muscle groups for one hour at 60% one repetition maximum the first 3 weeks and 75% one repetition maximum weeks 4 - 9. The RW group ran for 25 minutes a session at 75% predicted maximum HR, then lifted weights using the leg-strengthening exercises for 30 minutes, similar to the W group. Preceding and following the treatment period, plasma TC, HDL-C, body weight, and percent body fat was assessed for all four groups. Plasma TC was not significantly altered, although a downward trend was observed for all three treatment groups. Plasma HDL-C did not change over the treatment period for any group. The plasma TC/HDL-C ratio changed significantly among groups over the treatment period, with the R group decreasing their ratio from 3.5 to 2.9 (p < .05). No changes were noted In percent body fat, fat-free mass, or body weight for any of the groups. The Pearson product-moment correlations performed between the changes in blood lipids and the changes in body composition found no significant relationships. The results of this study indicate that an exercise program consisting of endurance training for 30 minutes, 3 times per week, or weight training for one hour, 3 times per week, or a combination aerobic/weight training program 3 times per week is not adequate to significantly improve plasma TC or HDL-C in young females over a nine week period. However, significant improvements may be made in the plasma TC/HDL-C ratio which may decrease the risk for CHD. / Master of Science

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Nowadays high power density has become an emerging need for the medium-voltage (MV) high-power converters in applications of power distribution systems in urban areas and transportation carriers like ship, airplane, and so forth. The limited footprint or space resource cost such immensely high price that introducing expensive advanced equipment to save space becomes a cost-effective option. To this end, replacing conventional Si IGBT with the superior SiC MOSFET to elevate the power density of MV modular converters has been defined as the concentration of this research work. As the modular multilevel converter (MMC) is the most typical modular converter for high power applications, the research topic is narrowed down to study the SiC MOSFET-based MMC. Fundamentals of the MMC is firstly investigated by introducing a proposed state-space switching model, followed by unveiling all possible operation scenarios of the MMC. The lower-frequency energy fluctuation on passive components of the MMC is interpreted and prior-art approaches to overcome it are presented. By scrutinizing the converter's switching states, a new switching-cycle control (SCC) approach is proposed to balance the capacitor energy within one switching cycle is explored. An open-loop model-predictive method is leveraged to study the behavior of the SCC, and then a hybrid-current-mode (HCM) approach to realize the closed-loop SCC on hardware is proposed and verified in simulation. In order to achieve the hybrid-current-mode SCC (HCM-SCC), a high-performance Rogowski switch-current sensor (RSCS) is proposed and developed. As sensing the switching current is a critical necessity for HCM-SCC, the RSCS is designed to meet all the requirement for the control purposes. A PCB-embedded shielding design is proposed to improve the sensor accuracy under high dv/dt noises caused by the rapid switching transients of SiC MOSFET. The overall system and control validations have been conducted on a high-power MMC prototype. The basic unit of the MMC prototype is a SiC Power Electronics Building Block (PEBB) rated at 1 kV DC bus voltage. Owing to the proposed SCC, the PEBB development has achieved high power density with considerable reduction of passive component size. Finally, experimental results exhibit the excellent performance of the RSCS and the HCM-SCC. / Ph. D. / Electricity is the fastest-growing type of end-use energy consumption in the world, and its generation and usage trends are changing. Hence, the power electronics that control the flow and conversion of electrical energy are an important research area. As a typical example, the modular multilevel converter (MMC) is a popular voltage-source converter for high-voltage dc electric transmission systems (VSC-HVDC). The MMC features in excellent voltage scalability that fits various HVDC transmission projects. Though, the huge passive energy storage components of the MMC remains a hurdle to improve its power density. On the other hand, wide-bandgap (WBG) power semiconductors are enabling power electronics to meet higher power density and efficiency, and have thus begun appearing in commercial products, such as traction and solar inverters. Silicon-carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET), as one type of WBG devices, is able to switch higher voltages faster and with lower losses than existing semiconductor technologies will drastically reduce the size, weight, and complexity of medium-voltage and high-voltage systems. However, these devices also bring new challenges for designers. The objective of this research work is to develop a new control approach that takes advantage of the merits of the SiC MOSFET to reduce the passive components of the MMC. In order to achieve that, a switching-state model of the MMC, a closed-loop hybrid-current-mode switching-cycle control (HCM-SCC) method, a Rogowski switch-current sensor (RSCS), and a SiC-based power electronics building block (PEBB) have been developed. Analytical and experimental results show that the new control approach is able to reduce the capacitance by 93%, inductance by 74%, and semiconductor losses by 11% at the same time, and thus to improve the power density of the MMC power stage by a factor of 23X.

The future power conversion system not only must meet the characteristics demanded by the load, but also have to achieve high power density with high efficiency, high ambient temperature, and high reliability. Density and efficiency are two key drivers and metrics for the advancement of power conversion technologies. Generally speaking, a high performance active device is the first force to push power density to meet the requirement of modern systems. Silicon has been a dominant material in power management since the late 1950s. However, due to continuous device optimizations and improvements in the production process, the material properties of silicon have increasingly become the limiting factor. Workarounds like the super junction stretch the limits but usually at substantial cost. The use of gallium nitride devices is gathering momentum, with a number of recent market introductions for a wide range of applications such as point-of-load (POL) converters, off-line switching power supplies, battery chargers and motor drives. GaN devices have a much lower gate charge and lower output capacitance than silicon MOSFETs and, therefore, are capable of operating at a switching frequency 10 times greater. This can significantly impact the power density of power converters, their form factor, and even current design and manufacturing practices. To realize the benefits of GaN devices resulting from significantly higher operating frequencies, a number of issues have to be addressed, such as converter topology, soft-switching technique, high frequency gate driver, high frequency magnetics, packaging, control, and thermal management. This work studies the insight switching characteristics of high-voltage GaN devices including some specific issues related to the cascode GaN. The package impact on the switching performance and device reliability will be illustrated in details. A stack-die package is proposed for cascode GaN devices to minimize the impact of package parasitic inductance on switching transition. Comparison of hard-switching and soft-switching operation is carried based on device model and experiments, which shows the necessity of soft-switching for GaN devices at high frequency. This work also addresses high dv/dt and di/dt related gate drive issues associated with the higher switching speed of GaN devices. Particularly, the conventional driving solution could fail on the high side switch in a half-bridge configuration due to relative large common-mode noise current. Two simple and effective driving methods are proposed to improve noise immunity and maintain high driving speed. Finally, this work illustrates the utilization of GaN in an emerging application, high density AC-DC adapter. Many design considerations are presented in detail. The GaN-based adapter is capable of operating at 1-2 MHz frequency with an improved efficiency up to 94%. Several design examples at different power levels, with a power density in the range of 20~35W/in3, which is a three-fold improvement over the state-of-the-art product, are successfully demonstrated. In conclusion, this work is focus on the characterization, and evaluation of GaN devices. Packaging, high frequency driving and soft-switching technique are addressed to fully explore the potential of GaN devices. High density adapters are demonstrated to show the advance of GaN device and its impact on system design. / Ph. D. / This work is focus on the characterization, evaluation and application of new wideband-gap semiconductor devices – GaN devices. Due to superior physics property compared to existing semiconductor material, GaN device is able to switch at much higher frequency and this brings significant impact on the field of power electronics. The potential impact of GaN goes beyond the simple measures of efficiency and power density. It is feasible to design a system with a more integrated approach at higher frequency, and therefore, it is easier for automated manufacturing. This will bring significant cost reductions in power electronics equipment and unearth numerous new applications which have been previously precluded due to high cost. To realize the benefits of GaN devices resulting from significantly higher operating frequencies, a number of issues have to be addressed, such as device packaging, power converter topology, thermal management, high frequency magnetics and system control. This dissertation discusses the most critical issues related to GaN devices with proper solutions. A practical design example of AC-DC adapter is demonstrated with much improved efficiency, density and manufacturability.