Abstract The high-speed performance of the lump-type electroabsorption modulator (EAM) is mainly limited by RC-effect. By taking advantage of the distributive effects, the traveling-wave structure can overcome the RC-lump effect. However, in order to enhance the limitation imposed by the conventional slow-waveguide type of traveling-wave structure, the speed of the device is still mainly restricted by the distributed capacitance of the waveguide. In this work, a novel type of traveling-wave-electroabsorption-modulator based on the undercut-etching the active region is successfully fabricated and measured. The methods of the processing adopted here is to lower the capacitance by chemical-wet-etching and two-time subsequent undercut etching on active region to further decrease the parasitic capacitance between P-type and N-type cladding layer. Also, the optical scattering loss may be reduced due the smooth sidewall of the waveguide from the wet etching. The whole processing shown in this thesis includes the lift-off technique by lithography, the metalization for n-, p- contacts (by thermal evaporator) and CPW microwave transmission (by e-beam evaporator), and PMGI-planarization. ¡V15dB optical transmission, ¡V6dB electrical transmission loss and >20GHz 3dB bandwidth of electrical-to-optical response at 50£[termination is measured on this kind of devices. It exhibits a high potential on the application of high-speed optical-fiber link in the future.

The groundwork has been completed for a large new research initiative involving the development of diode lasers for moderate power ultrashort pulse generation. This thesis reports on the status of three core areas of this initiative: InGaAsP/GaAs diode laser design and characterization, split contact device testing, and thin film interference filter deposition and characterization. Two new short wavelength diode laser designs have been realized and tested. A 980 nm laser was designed, using an InGaAsP barrier/waveguide region. This showed improved far field performance and better contact isolation as compared to an existing 980 nm laser using GaAs barriers. A laser emitting at 850 nm was also designed using GaAs quantum wells surrounded by a new quaternary waveguide region. A test arrangement was developed to facilitate the measurement of IV and LI curves for split contact lasers. Numerous lasers were tested, indicating that short absorber sections and narrow gap widths are preferable for use as saturable absorbing regions in a passively mode locked diode laser. Finally, thin film silicon oxynitride interference filters have been designed, deposited, and characterized for several antireflecting and high reflectance coatings on semiconductor laser facets. A comparison ofsingle layer AR coatings accounting for the modal reflectivity was performed. A four layer high reflectance coating with a peak broadband reflectance of over 90% was deposited on a laser facet. / Thesis / Master of Engineering (ME)

This thesis investigates different material systems and processing technology for high temperature compatible laser diodes used in volume applications within the 1.3-μm telecom wavelength window. Laser diodes built from such materials are much desired in order to eleminate the need for active temperature control needed in current systems, which significantly increases both complexity, size and cost. The structures were grown by Metal-Organic Chemical Vapor Deposition (MOCVD) and the evaluation of materials was performed using different characterization methods such as High-Resolution X-Ray Diffraction (HR-XRD), Photoluminescence (PL), Time-Resolved Photoluminescence (TR-PL). Fabrication and evaluation of Fabry-Perot lasers with different geometries was used to check the material quality and temperature performance. A novel in-situ etching technique was developed for the use i future more advanced, buried hetrostructure lasers. The first studied materials system was AlGaInAsP/InGaAsP/InP. To handle a 5-element material with the precision required, modelling of the materials and heterostructure properties was performed. The addition of Al to the InGaAsP barrier allows better electron confinement with little change in valence band properties. The optimum aluminium content was found to be about 12%. Although the effect of Al could be identified, it was not sufficient with T0 of only 90 K only up to 60 °C. A second materials system InGaP/InAsP/ InP initially looked quite promising from a materials and quantum well design point of view but encountered severe problems with the device integration and further work was discontinued. The main effort was therefore was devoted to a third materials system: AlGaInAs/AlGaInAs/InP. This material system is not unknown but has hitherto not found a widespread application for fibre optic applications. In this work, the MOCVD growth of 1.3 μ;m quantum well laser structures was optimized and ridge waveguide laser devices with excellent temperature performance was fabricated (T0 = 97 K at 85 °C). A ridge waveguide laser was identified as suitable structure since it requires only a single epitaxial growth, thus avoiding the main problem of oxidation of Al based buried structures. The dynamic performance was excellent up to 110 °C and the device fabrication is highly reliable (lifetime >7000 h). This high yield uncooled ridge Fabry-Perot laser process has now been transferred to production and is applied in short length 10 Gb/s multimode links. In order to further improve the usefulness of the Al-containing materials in even higher performance devices needed in future applications developments towards fully buried heterostructure device geometry were also pursued. To overcome difficulty of oxidation of Al containing layers at the mesa walls an in-situ etching technique was implemented. Different chemistry approaches were investigated and the first results of lasers devices were reported. / QC 20100930

Semiconductor optical amplifiers (SOA) and electroabsorption modulators (EAM) have been become vital elements to obtain high-output-power and high-speed optical signal in the optical fiber communications. In this paper, we propose a novel type cascaded integrated SOAs and EAMs, which are monolithically integrated in the same chip without any regrowth. In the active region, high electron bandgap offset material, InGaAsP/InAlGaAs, is used in order to get high optical gain and also high modulation. Using cascaded SOAs and EAMs, high impedance of microwave stripe lines are the bridges connecting the small EAM elements, bring up higher impedance and thus enhancing the microwave transmission. The optical waveguide is made by selectively undercut etching InGaAsP/InAlGaAs material in order to reduce the optical scattering loss and also the microwave loss due to the low parasitic capacitance. The processing is described by the following steps: (1) ion implantation to get electrical isolation; (2) wet etching to form the optical waveguide ridge; (3) e-gun evaporation to get n- and p- metalization ; (4) spinning PMGI as planarization; (5)Final thick metalizations as for microwave transmission line. The final integrated cascaded SOAs and EAMs has been successfully fabricated and measured. In comparison with single EAM, higher than 10GHz of ¡V3dB electrical transmission has been found, indicating the cascaded integration structure has better impedance matching and also higher electrical transmission. The measured optical gain is higher than 5dB with 11dB/V modulation efficiency at excitation wavelength of 1568nm.

abstract: The larger tolerance to lattice mismatch in growth of semiconductor nanowires (NWs) offers much more flexibility for achieving a wide range of compositions and bandgaps via alloying within a single substrate. The bandgap of III-V InGaAsP alloy NWs can be tuned to cover a wide range of (0.4, 2.25) eV, appealing for various optoelectronic applications such as photodetectors, solar cells, Light Emitting Diodes (LEDs), lasers, etc., given the existing rich knowledge in device fabrication based on these materials. This dissertation explores the growth of InGaAsP alloys using a low-cost method that could be potentially important especially for III-V NW-based solar cells. The NWs were grown by Vapor-Liquid-Solid (VLS) and Vapor-Solid (VS) mechanisms using a Low-Pressure Chemical Vapor Deposition (LPCVD) technique. The concept of supersaturation was employed to control the morphology of NWs through the interplay between VLS and VS growth mechanisms. Comprehensive optical and material characterizations were carried out to evaluate the quality of the grown materials. The growth of exceptionally high quality III-V phosphide NWs of InP and GaP was studied with an emphasis on the effects of vastly different sublimation rates of the associated III and V elements. The incorporation of defects exerted by deviation from stoichiometry was examined for GaP NWs, with an aim towards maximization of bandedge-to-defect emission ratio. In addition, a VLS-VS assisted growth of highly stoichiometric InP thin films and nano-networks with a wide temperature window from 560◦C to 720◦C was demonstrated. Such growth is shown to be insensitive to the type of substrates such as silicon, InP, and fused quartz. The dual gradient method was exploited to grow composition-graded ternary alloy NWs of InGaP, InGaAs, and GaAsP with different bandgaps ranging from 0.6 eV to 2.2 eV, to be used for making laterally-arrayed multiple bandgap (LAMB) solar cells. Furthermore, a template-based growth of the NWs was attempted based on the Si/SiO2 substrate. Such platform can be used to grow a wide range of alloy nanopillar materials, without being limited by typical lattice mismatch, providing a low cost universal platform for future PV solar cells. / Dissertation/Thesis / Doctoral Dissertation Chemistry 2018

No description available.

The effects of tension and compression applied to unbonded InGaAsP semiconductor diode lasers have been studied. A theoretical calculation of the stress distribution within the laser and an analysis of the effect of strain on optical gain in semiconductors is presented. The observed dependence of threshold, wavelength, and polarization of the laser output on the applied stress is explained in terms of the strain dependence of the valence-band wavefunctions. The polarization behaviour is found to be related to thermal stress and the structure of the device. A technique has been developed to measure the thermal stress induced by current heating at the 105 dynes/cm2 level. The effect of stress on the below threshold behaviour of the lasers was investigated. The results are consistent with the strain dependence of the TE and TM mode gains. / Thesis / Master of Engineering (ME)

Résumé : Les circuits photoniques intégrés qui combinent des dispositifs photoniques pour la génération, la détection, la modulation, l'amplification, la commutation et le transport de la lumière dans une puce, ont été rapportés comme étant une innovation technologique importante qui simplifie la conception du système optique et qui réduit l'espace et la consommation de l'énergie en améliorant ainsi la fiabilité. La capacité de modifier la bande interdite des zones sélectives des différents dispositifs photoniques à travers la puce est la clé majeure pour le développement de circuits photoniques intégrés. Comparé à d'autres méthodes d’épitaxie, l’interdiffusion de puits quantiques a attiré beaucoup d'intérêt en raison de sa simplicité et son efficacité en accordant la bande interdite durant le processus de post-épitaxie. Cependant, l’interdiffusion de puits quantiques a subi des problèmes reliés au manque de précision pour modifier convenablement la bande interdite ciblée et à l’incontrôlabilité de l’absorption des impuretés au cours du processus qui peut dégrader la qualité du matériel interdiffusé. Dans cette thèse, nous avons utilisé les lasers excimer pour créer des défauts à proximité de la surface (~ 10 nm) des microstructures à base de puits quantiques III-V (par exemple InP et GaAs) et pour induire l’interdiffusion après le recuit thermique. L'irradiation par les lasers excimer (ArF et KrF) des microstructures à puits quantiques a été réalisée dans différents environnements, y compris l'air, l'eau déionisée, les couches diélectriques (SiO2 et Si3N4) et les couches d’InOx. Pour proposer un bon contrôle de la technique d’interdiffusion de puits quantiques par laser excimer, nous avons étudié la génération et la diffusion de défauts de surface en utilisant différentes méthodes de caractérisation de surface/interface, comme l'AFM, SEM, XPS et SIMS qui ont été utilisées pour analyser la modification de la morphologie de surface/interface et la modification chimique de la microstructure de ces puits quantiques. La qualité des microstructures à puits quantiques étudiées a été représentée par des mesures de photoluminescence et de luminescence des diodes lasers ainsi fabriqués. Les résultats montrent que le laser excimer induit des quantités d'oxydes de surface dans les surfaces des microstructure à puits quantiques InP/InGaAs/InGaAsP dans l'air et des impuretés d'oxygène des couches d'oxydes diffusées dans la région active de la microstructure lors du recuit, ce qui améliore l’interdiffusion, mais réduit l'intensité de la photoluminescence. Par contre, l’irradiation dans un environnement d'eau déionisée n’a pas démontré de diffusion des impuretés évidentes d'un excès d'oxygène vers les régions actives, mais la stœchiométrie de surface a été restaurée après l’interdiffusion. L’InOx a été trouvé avec un grand coefficient de dilatation thermique dans la microstructure interdiffusée qui était supposée d’augmenter la contrainte de compression dans la région active et ainsi d’augmenter l'intensité de photoluminescence de 10 fois dans l’échantillon irradié dans l'eau déionisée. Concernant les microstructures avec une couche diélectrique, la modification de la bande interdite a été toujours réalisée sur des échantillons dont les couches diélectriques ont été irradiées et la surface de InP a été modifiée par le laser excimer. Pour l'échantillon avec une couche de 243 nm de SiO2, les variations de la photoluminescence ont été mesurées sans l’ablation de cette couche de SiO2 lors de l'irradiation par le laser KrF. Cependant, la morphologie de l'interface d’InP a été modifiée, les oxydes d'interface ont été générés et les impuretés d'oxygène se sont diffusées à l'intérieur des surfaces irradiées. Les améliorations de l’interdiffusion dans les deux surfaces non irradiées et irradiés de l'échantillon couvert de couche d’InOx ont démontré l'importance des oxydes dans l’interdiffusion des puits quantiques. Les diodes laser fabriquées à partir d’un matériau interdiffusé par un laser KrF ont montré un seuil de courant comparable à celui des matériaux non interdiffusés avec un décalage de photoluminescence de 100 nm. En combinant un masque d'aluminium, nous avons créé un déplacement uniforme de photoluminescence de 70 nm sur une matrice rectangulaire de 40 μm x 200 μm ce qui présente un potentiel d’application de l’interdiffusion des puits quantiques par les lasers excimer dans les circuits photoniques intégrés. En outre, les lasers excimer ont été utilisés pour créer des structures de nano-cônes auto-organisées sur des surfaces de microstructure de InP/InGaAs/InGaAsP en augmentant l'intensité de PL par ~ 1.4 fois. Les lasers excimer ont été aussi utilisés pour modifier la mouillabilité sélective des zones d’une surface de silicium par une modification chimique de surface induite par laser dans différents milieux liquides. Ainsi, la fluorescence des nanosphères a été réussie pour des fonctions de configuration spécifique avec une surface de silicium. // Abstract : Photonic integrated circuits (PICs) which combine photonic devices for generation, detection, modulation, amplification, switching and transport of light on a chip have been reported as a significant technology innovation that simplifies optical system design, reduces space and power consumption, improves reliability. The ability of selective area modifying the bandgap for different photonic devices across the chip is the important key for PICs development. Compared with other growth methods, quantum well intermixing (QWI) has attracted amounts of interest due to its simplicity and effectiveness in tuning the bandgap in post-growth process. However, QWI has suffered problems of lack of precision in achieving targeted bandgap modification and uncontrollable up-taking of impurities during process which possibly degrade the quality of intermixed material. In this thesis, we have employed excimer laser to create surface defects in the near surface region (~ 10 nm) of III-V e.g. InP and GaAs, based QW microstructure and then annealing to induce intermixing. The irradiation by ArF and KrF excimer lasers on the QW microstructure was carried out surrounded by different environments, including air, DI water, dielectric layers (SiO2 and Si3N4) and InOx coatings. To propose a more controllable UV laser QWI technique, we have studied surface defects generation and diffusion with various surface/interface characterization methods, like AFM, SEM, XPS and SIMS, which were used to analyse the QW surface/interface morphology and chemical modification during QWI. The quality of processed QW microstructure was represented by photoluminescence measurements and luminescence measurements of fabricated laser diodes. The results shows that excimer laser induced amounts of surface oxides on the InP/InGaAs/InGaAsP microstructure surface in air and the oxygen impurities from oxides layer diffused to the active region of the QW microstructure during annealing, which enhance intermixing but also reduce the PL intensity. When irradiated in DI water environment, no obvious excessive oxygen impurities were found to diffuse to the active regions and the surface stoichiometry has been restored after intermixing. InOx with large coefficient of thermal expansion was found inside the intermixed QW microstructure, which was supposed to increase the compressive strain in active region and enhance the PL intensity to maximum 10 times on sample irradiated in DI water. On microstructure coated with dielectric layers, bandgap modifications were always found on samples whose dielectric layers were ablated and InP surface was modified by excimer laser. On sample coated with 243 nm SiO2 layer, the PL shifts were found on sample without ablation of the SiO2 layer when irradiated by KrF laser. However, the InP interface morphology was modified, interface oxides were generated and oxygen impurities have diffused inside on the irradiated sites. The enhancements of interdiffusion on both non irradiated and irradiated sites of sample coated with InOx layer have verified the importance of oxides in QWI. The laser diodes fabricated from KrF laser intermixed material have shown comparable threshold current density with as grown material with PL shifted by 133 nm. Combined aluminum mask, we have created uniform 70 nm PL shifts on 40 μm x 200 μm rectangle arrays which presents UV laser QWI potential application in PICs. In addition, excimer lasers have been used to create self organized nano-cone structures on the surface of InP/InGaAs/InGaAsP microstructure and enhance the PL intensity by ~1.4x. Excimer lasers have selective area modified wettability of silicon surface based on laser induced surface chemical modification in different liquid environments. Then the fluorescence nanospheres succeeded to specific pattern functions with silicon surface.

Résumé : Les circuits photoniques intégrés qui combinent des dispositifs photoniques pour la génération, la détection, la modulation, l'amplification, la commutation et le transport de la lumière dans une puce, ont été rapportés comme étant une innovation technologique importante qui simplifie la conception du système optique et qui réduit l'espace et la consommation de l'énergie en améliorant ainsi la fiabilité. La capacité de modifier la bande interdite des zones sélectives des différents dispositifs photoniques à travers la puce est la clé majeure pour le développement de circuits photoniques intégrés. Comparé à d'autres méthodes d’épitaxie, l’interdiffusion de puits quantiques a attiré beaucoup d'intérêt en raison de sa simplicité et son efficacité en accordant la bande interdite durant le processus de post-épitaxie. Cependant, l’interdiffusion de puits quantiques a subi des problèmes reliés au manque de précision pour modifier convenablement la bande interdite ciblée et à l’incontrôlabilité de l’absorption des impuretés au cours du processus qui peut dégrader la qualité du matériel interdiffusé. Dans cette thèse, nous avons utilisé les lasers excimer pour créer des défauts à proximité de la surface (~ 10 nm) des microstructures à base de puits quantiques III-V (par exemple InP et GaAs) et pour induire l’interdiffusion après le recuit thermique. L'irradiation par les lasers excimer (ArF et KrF) des microstructures à puits quantiques a été réalisée dans différents environnements, y compris l'air, l'eau déionisée, les couches diélectriques (SiO2 et Si3N4) et les couches d’InOx. Pour proposer un bon contrôle de la technique d’interdiffusion de puits quantiques par laser excimer, nous avons étudié la génération et la diffusion de défauts de surface en utilisant différentes méthodes de caractérisation de surface/interface, comme l'AFM, SEM, XPS et SIMS qui ont été utilisées pour analyser la modification de la morphologie de surface/interface et la modification chimique de la microstructure de ces puits quantiques. La qualité des microstructures à puits quantiques étudiées a été représentée par des mesures de photoluminescence et de luminescence des diodes lasers ainsi fabriqués. Les résultats montrent que le laser excimer induit des quantités d'oxydes de surface dans les surfaces des microstructure à puits quantiques InP/InGaAs/InGaAsP dans l'air et des impuretés d'oxygène des couches d'oxydes diffusées dans la région active de la microstructure lors du recuit, ce qui améliore l’interdiffusion, mais réduit l'intensité de la photoluminescence. Par contre, l’irradiation dans un environnement d'eau déionisée n’a pas démontré de diffusion des impuretés évidentes d'un excès d'oxygène vers les régions actives, mais la stœchiométrie de surface a été restaurée après l’interdiffusion. L’InOx a été trouvé avec un grand coefficient de dilatation thermique dans la microstructure interdiffusée qui était supposée d’augmenter la contrainte de compression dans la région active et ainsi d’augmenter l'intensité de photoluminescence de 10 fois dans l’échantillon irradié dans l'eau déionisée. Concernant les microstructures avec une couche diélectrique, la modification de la bande interdite a été toujours réalisée sur des échantillons dont les couches diélectriques ont été irradiées et la surface de InP a été modifiée par le laser excimer. Pour l'échantillon avec une couche de 243 nm de SiO2, les variations de la photoluminescence ont été mesurées sans l’ablation de cette couche de SiO2 lors de l'irradiation par le laser KrF. Cependant, la morphologie de l'interface d’InP a été modifiée, les oxydes d'interface ont été générés et les impuretés d'oxygène se sont diffusées à l'intérieur des surfaces irradiées. Les améliorations de l’interdiffusion dans les deux surfaces non irradiées et irradiés de l'échantillon couvert de couche d’InOx ont démontré l'importance des oxydes dans l’interdiffusion des puits quantiques. Les diodes laser fabriquées à partir d’un matériau interdiffusé par un laser KrF ont montré un seuil de courant comparable à celui des matériaux non interdiffusés avec un décalage de photoluminescence de 100 nm. En combinant un masque d'aluminium, nous avons créé un déplacement uniforme de photoluminescence de 70 nm sur une matrice rectangulaire de 40 μm x 200 μm ce qui présente un potentiel d’application de l’interdiffusion des puits quantiques par les lasers excimer dans les circuits photoniques intégrés. En outre, les lasers excimer ont été utilisés pour créer des structures de nano-cônes auto-organisées sur des surfaces de microstructure de InP/InGaAs/InGaAsP en augmentant l'intensité de PL par ~ 1.4 fois. Les lasers excimer ont été aussi utilisés pour modifier la mouillabilité sélective des zones d’une surface de silicium par une modification chimique de surface induite par laser dans différents milieux liquides. Ainsi, la fluorescence des nanosphères a été réussie pour des fonctions de configuration spécifique avec une surface de silicium. // Abstract : Photonic integrated circuits (PICs) which combine photonic devices for generation, detection, modulation, amplification, switching and transport of light on a chip have been reported as a significant technology innovation that simplifies optical system design, reduces space and power consumption, improves reliability. The ability of selective area modifying the bandgap for different photonic devices across the chip is the important key for PICs development. Compared with other growth methods, quantum well intermixing (QWI) has attracted amounts of interest due to its simplicity and effectiveness in tuning the bandgap in post-growth process. However, QWI has suffered problems of lack of precision in achieving targeted bandgap modification and uncontrollable up-taking of impurities during process which possibly degrade the quality of intermixed material. In this thesis, we have employed excimer laser to create surface defects in the near surface region (~ 10 nm) of III-V e.g. InP and GaAs, based QW microstructure and then annealing to induce intermixing. The irradiation by ArF and KrF excimer lasers on the QW microstructure was carried out surrounded by different environments, including air, DI water, dielectric layers (SiO2 and Si3N4) and InOx coatings. To propose a more controllable UV laser QWI technique, we have studied surface defects generation and diffusion with various surface/interface characterization methods, like AFM, SEM, XPS and SIMS, which were used to analyse the QW surface/interface morphology and chemical modification during QWI. The quality of processed QW microstructure was represented by photoluminescence measurements and luminescence measurements of fabricated laser diodes. The results shows that excimer laser induced amounts of surface oxides on the InP/InGaAs/InGaAsP microstructure surface in air and the oxygen impurities from oxides layer diffused to the active region of the QW microstructure during annealing, which enhance intermixing but also reduce the PL intensity. When irradiated in DI water environment, no obvious excessive oxygen impurities were found to diffuse to the active regions and the surface stoichiometry has been restored after intermixing. InOx with large coefficient of thermal expansion was found inside the intermixed QW microstructure, which was supposed to increase the compressive strain in active region and enhance the PL intensity to maximum 10 times on sample irradiated in DI water. On microstructure coated with dielectric layers, bandgap modifications were always found on samples whose dielectric layers were ablated and InP surface was modified by excimer laser. On sample coated with 243 nm SiO2 layer, the PL shifts were found on sample without ablation of the SiO2 layer when irradiated by KrF laser. However, the InP interface morphology was modified, interface oxides were generated and oxygen impurities have diffused inside on the irradiated sites. The enhancements of interdiffusion on both non irradiated and irradiated sites of sample coated with InOx layer have verified the importance of oxides in QWI. The laser diodes fabricated from KrF laser intermixed material have shown comparable threshold current density with as grown material with PL shifted by 133 nm. Combined aluminum mask, we have created uniform 70 nm PL shifts on 40 μm x 200 μm rectangle arrays which presents UV laser QWI potential application in PICs. In addition, excimer lasers have been used to create self organized nano-cone structures on the surface of InP/InGaAs/InGaAsP microstructure and enhance the PL intensity by ~1.4x. Excimer lasers have selective area modified wettability of silicon surface based on laser induced surface chemical modification in different liquid environments. Then the fluorescence nanospheres succeeded to specific pattern functions with silicon surface.

This thesis describes the incorporation within a semiconductor laser of a multiple quantum well InGaAsP/InP Electron Bragg Reflector (EBR). The EBR is intended to improve laser performance by inhibiting the escape of hot electrons from the laser active region by quantum mechanical Bragg reflection. To the author's knowledge, this investigation represents the first attempt to realize an EBR in the InGaAsP/InP material system. Computer models based on a transfer matrix method for the solution of Schrodinger's equation were written to obtain the EBR design. The transfer matrix method is described. Extensions to the transfer matrix method for optics are presented and are demonstrated to provide more than an order of magnitude improvement in computational efficiency for the calculation of the complex TE-mode propagation constant for planar graded-index waveguides with absorption or gain. The EBR designed for this work incorporates several new features. Deleterious band bending in the vicinity of the EBR is minimized by exploiting material strain to reduce the density of hole states in the EBR quantum wells. To maximize reflection bandwidth and relax fabrication tolerances, the EBR design used well widths that decreased with increasing depth into the p-type InP cladding. By the placement of the EBR adjacent to the separate confinement region, a return path was provided for electrons that scattered inelastically within the EBR. Moreover, the EBR structure was designed to support no bound electron states, so that the recombination of electrons with holes in the EBR would be minimal. To the author's knowledge, the EBR-equipped laser fabricated for this work represents the first attempt to exploit electron state exclusion. To explore the effectiveness of EBRs in the InGaAsP/InP material system, two nearly identical ridge waveguide lasers (one with an EBR, and one without) were designed, fabricated, and tested. The EBR-equipped lasers exhibited an anomalous threshold current temperature dependence which featured a "negative-To" regime (in which the threshold current decreases with increasing temperature), attaining a minimum in threshold current between T=150 K and T=200 K. These lasers had a threshold current temperature stability superior to that of standard lasers within a ~70 K window around the minimum threshold temperature. Experimental evidence suggests that the improved stability is not due to quantum mechanical Bragg reflection provided by the EBR, but is attributable to the temperature-dependent rate of hole escape from the EBR quantum wells into the separate confinement region. The proposed mechanism is described in detail and is supported by theoretical and experimental evidence. The results have implications for device design, because the mechanism by which the superior temperature stability is achieved does not rely on the electron coherence effects; the mathematical model suggests that the mechanism can be exploited to provide superior temperature stability in semiconductor lasers at 300 K or above. / Thesis / Master of Engineering (ME)