Spelling suggestions: "subject:"entegrated circuit technology"" "subject:"antegrated circuit technology""
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High-speed data transmission using substrate integrated waveguide-type interconnectsSuntives, Asanee. January 1900 (has links)
Thesis (Ph.D.). / Written for the Dept. of Electrical & Computer Engineering. Title from title page of PDF (viewed 2009/06/11). Includes bibliographical references.
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Volume grating couplers for optical interconnects analysis, design, fabrication, and testing /Villalaz, Ricardo A. January 2004 (has links) (PDF)
Thesis (Ph. D.)--School of Electrical and Computer Engineering, Georgia Institute of Technology, 2005. Directed by Thomas Gaylord. / Glytsis, Elias, Committee Co-Chair ; Buck, John, Committee Member ; Kohl, Paul, Committee Member ; Adibi, Ali, Committee Member ; Gaylord, Thomas, Committee Chair. Vita. Includes bibliographical references.
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A gasp of fresh air a high speed distributed FIFO scheme for managing interconnect parasitics /Rydberg, Ray Robert, January 2005 (has links) (PDF)
Thesis (M.S.)--Washington State University. / Includes bibliographical references.
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Fatigue modeling of nano-structured chip-to-package interconnectionsKoh, Sau W. January 2009 (has links)
Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Rao R. Tummala; Committee Co-Chair: Ashok Saxena; Committee Member: Karl Jacob; Committee Member: Suresh Sitaraman; Committee Member: Thomas H. Sanders, Jr.
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Delay extraction based macromodeling techniques for tabulated/measured data /Charest, Andrew, January 1900 (has links)
Thesis (M.App.Sc.) - Carleton University, 2007. / Includes bibliographical references (p. 141-149). Also available in electronic format on the Internet.
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Electrodeposition of manganese/cobalt alloys for solid oxide fuel cell interconnect applicationsWu, Junwei, January 2009 (has links)
Thesis (Ph. D.)--West Virginia University, 2009. / Title from document title page. Document formatted into pages; contains xiii, 163 p. : ill. (some col.). Includes abstract. Includes bibliographical references.
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Low-loss on-chip interconnects for silicon integrated radio-frequency and microwave systems /Leung, Lydia Lap Wai. January 2005 (has links)
Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2005. / Includes bibliographical references (leaves 134-141). Also available in electronic version.
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Study of stress relaxation and electromigration in Cu/low-k interconnectsYoon, Sean Jhin, January 1900 (has links) (PDF)
Thesis (Ph. D.)--University of Texas at Austin, 2005. / Vita. Includes bibliographical references.
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Scaling and process effect on electromigration reliability for Cu/low k interconnectsPyun, Jung Woo, January 1900 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 2007. / Vita. Includes bibliographical references.
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CAM : a new Circuit Augmentation Method for modeling interconnects and passive components /Kolstad, Joel W. January 1900 (has links)
Thesis (M.S.)--Oregon State University, 2008. / Printout. Includes bibliographical references (leaves 80-84). Also available on the World Wide Web.
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