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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
21

THE METHODOLOGY AND IMPLEMENTATION OF RELAXATION METHOD TO INVESTIGATE ELECTRO-THERMAL INTERACTIONS IN SOLID-STATE INTEGRATED CIRCUITS

So, Biu, 1959- January 1987 (has links)
No description available.
22

Power management of power electronics interfaced low-voltage microgrid in islanding operation

Li, Yan Unknown Date
No description available.
23

Intelligent reflexive interfaces and their applications

Levi, Meir H. January 1985 (has links)
No description available.
24

Power management of power electronics interfaced low-voltage microgrid in islanding operation

Li, Yan. January 2010 (has links)
Thesis (M.Sc.)--University of Alberta, 2010. / A thesis submitted to the Faculty of Graduate Studies and Research in partial fulfillment of the requirements for the degree of Master of Science in Power Engineering and Power Electronics, Department of Electrical and Computer Engineering. Title from pdf file main screen (viewed on June 13, 2010). Includes bibliographical references.
25

Intelligent reflexive interfaces and their applications

Levi, Meir H. January 1985 (has links)
No description available.
26

High-Performance Wireless Microsystem for MEMS Capacitive Strain Sensors

Suster, Michael August 19 September 2011 (has links)
No description available.
27

A Multiple Coupled Microstrip Transmission Line Model for High-Speed VLSI Interconnect Simulation

Uzelac, Lawrence Stevan 11 December 1991 (has links)
A model is presented which incorporates the advantages of a mixed mode simulation to characterize transmission line behavior in multiple coupled Transmission line systems. The model is intended for use by digital circuit designers who wish to be able to obtain accurate transmission line behavior for complex digital systems for which continuous time simulation tools such as SPICE would time prohibitive. The model uses a transverse electromagnetic wave approximation to obtain solutions to the basic transmission line equations. A modal analysis technique is used to solve for the attenuation and propagation constants for the transmission lines. Modal analysis done in the frequency domain after a Fast Fourier Transform of the time-domain input signals. Boundary conditions are obtained from the Thevinized transmission line input equivalent circuit and the transmission line output load impedance. The model uses a unique solution queue system that allows n-line coupled transmission lines to be solved without resorting to large order matrix methods or the need to diagonals larger matrices using linear transformations. This solution queue system is based on the method of solution superposition. As a result, the CPU time required for the model is primarily a function of the number of transitions and not the number of lines modeled. Incorporation of the model into event driven circuit simulators such as Network C is discussed. It will be shown that the solution queue methods used in this model make it ideally suited for incorporation into a event-driven simulation network. The model presented in this thesis can be scaled to incorporate direct electromagnetic coupling between first, second, or third lines adjacent to the line transitioning. It is shown that modeling strictly adjacent line coupling is adequate for typical digital technologies. It is shown that the model accurately reproduces the transmission line behavior of systems modeled by previous authors. Example transitions on a 8-line system are reviewed. Finally, future model improvements are discussed.
28

Low noise, low power interface circuits and systems for high frequency resonant micro-gyroscopes

Dalal, Milap 03 July 2012 (has links)
Today's state-of-the-art rate vibratory gyroscopes use a large proof mass that vibrates at a low resonance frequency (3-30 kHz), a condition that creates a performance tradeoff in which the gyroscope can either offer large bandwidth or high resolution, but not both. This tradeoff led to the development of the capacitive bulk acoustic wave (BAW) silicon disk gyroscope, a new class of micromachined rate vibratory gyroscopes operating in the frequency range of 1-10MHz with high device bandwidth and shock/vibration tolerance. By scaling the frequency, BAW gyroscopes can provide low mechanical noise without sacrificing the high bandwidth performance needed for most commercial applications. The drive loop of the BAW gyroscope can also be exploited as a timing device that can be integrated in existing commercial systems to provide competitive clock performance to the state-of-the-art using less area and power. This dissertation discusses the design and implementation of a CMOS ASIC architecture that interfaces with a high-Q, wide-bandwidth BAW gyroscope and the challenges associated with optimizing the noise performance to achieve navigation-grade levels of sensitivity as the frequency is scaled into the MHz regime. Mathematical models are derived to describe the operation of the sensor and are used to generate equivalent electrical circuit models of the gyroscope. A design strategy is then outlined for the ASIC to optimize the drive loop and sense channel for power and noise, and steps toward reducing this noise as the system is pushed to navigation-grade performance are presented that maintain optimum system power consumption. After analyzing the BAW gyroscope and identifying a strategy for developing the drive and sense interface circuitry, a complete fully-differential ASIC is designed in 0.18μm CMOS to interface with a bulk acoustic wave (BAW) disk gyroscope. As an oscillator, the gyroscope provides an uncompensated clock signal at ~9.64 MHz with a temperature sensitivity of -27 ppm/°C and phase noise of -104 dBc at 1 kHz from carrier. When the complete ASIC is interfaced with the gyroscope, the sensor shows a measured rate sensitivity of 1.15 mV/o/s with an open-loop bandwidth of 280 Hz and a bias instability of 0.095 o/s, suitable for the rate-grade performance commonly required for commercial and consumer electronics applications. The system is recorded to have a total power of 1.6 mW and a total area of 0.64 mm2. Following the design of the interface ASIC, this dissertation investigates in further detail the requirements for designing and optimizing charge pumps for capacitive MEMS devices. Basic charge pump design is outlined, followed by an overview of techniques that can be used to generate larger polarization voltages from the ASIC. Lastly, an alternate measurement technique for measuring the rotation rate of the gyroscope is discussed. This technique is based on the phase-shift modulation of the gyroscope output signal when the device is driven with two orthogonal signal inputs and can be easily modified to provide either linear scale factor measurement or a linear calibration curve that can be used to track and adjust the variation of the sensor scale factor over time.
29

Threshold Voltage Shift Compensating Circuits in Non-Crystalline Semiconductors for Large Area Sensor Actuator Interface

Raghuraman, Mathangi January 2014 (has links) (PDF)
Thin Film Transistors (TFTs) are widely used in large area electronics because they offer the advantage of low cost fabrication and wide substrate choice. TFTs have been conventionally used for switching applications in large area display arrays. But when it comes to designing a sensor actuator system on a flexible substrate comprising entirely of organic and inorganic TFTs, there are two main challenges – i) Fabrication of complementary TFT devices is difficult ii) TFTs have a drift in their threshold voltage (VT) on application of gate bias. Also currently there are no circuit simulators in the market which account for the effect of VT drift with time in TFT circuits. The first part of this thesis focuses on integrating the VT shift model in the commercially available AIM-Spice circuit simulator. This provides a new and powerful tool that would predict the effect of VT shift on nodal voltages and currents in circuits and also on parameters like small signal gain, bandwidth, hysteresis etc. Since the existing amorphous silicon TFT models (level 11 and level 15) of AIM-Spice are copyright protected, the open source BSIM4V4 model for the purpose of demonstration is used. The simulator is discussed in detail and an algorithm for integration is provided which is then supported by the data from the simulation plots and experimental results for popular TFT configurations. The second part of the thesis illustrates the idea of using negative feedback achieved via contact resistance modulation to minimize the effect of VT shift in the drain current of the TFT. Analytical expressions are derived for the exact value of resistance needed to compensate for the VT shift entirely. Circuit to realize this resistance using TFTs is also provided. All these are experimentally verified using fabricated organic P-type Copper Phthalocyanine (CuPc) and inorganic N-type Tin doped Zinc Oxide (ZTO) TFTs. The third part of the thesis focuses on building a robust amplifier using these TFTs which has time invariant DC voltage level and small signal gain at the output. A differential amplifier using ZTO TFTs has been built and is shown to fit all these criteria. Ideas on vertical routing in an actual sensor actuator interface using this amplifier have also been discussed such that the whole system may be “tearable” in any contour. Such a sensor actuator interface can have varied applications including wrap around thermometers and X-ray machines.
30

Exploration of Displacement Detection Mechanisms in MEMS Sensors

Thejas, * January 2015 (has links) (PDF)
MEMS Sensors are widely used for sensing inertial displacements. The displacements arising out of acceleration /Coriolis effect are typically in the range of 1 nm-1 m. This work investigates the realization of high resolution MEMS inertial sensors using novel displacement sensing mechanisms. Capacitance sensing ASIC is developed as part of conventional electronics interface with MEMS sensor under the conventional CMOS-MEMS integration strategy. The capacitance sense ASIC based on Continuous Time Voltage scheme with coherent and non-coherent demodulation is prototyped on AMS 0.35 m technology. The ASIC was tested to sense C = 3.125 fF over a base of 2 pF using on-chip built-in test capacitors. Dynamic performance of this ASIC was validated by interfacing with a DaCM MEMS accelerometer. 200milli-g of acceleration (equivalent to a C = 2.8 fF) over an input frequency of 20Hz is measurable using the developed ASIC. The observed sensitivity is 90mV/g. The ASIC has several programmable features such as variation in trim capacitance (3.125 fF-12.5 pF), bandwidth selection (500 Hz-20 kHz) and variable gain options (2-100). Capacitance detection, a dominant sensing principle in MEMs sensors, experiences inherent limitation due to the role of parasitics when the displacements of interest are below 5 nm range. The capacitive equivalence ( C) for the range of displacements of the order of 5 nm and below would vary in the range atto-to-zepto farad. Hence there is a need to explore alternative sensing schemes which preferably yield higher sensitivity (than those offered by the conventional integration schemes) and are based on the principle of built-in transduction to help overcome the influence of parasitics on sensitivity. In this regard, 3 non-conventional architectures are explored which fall under the direct integration classification namely: (a) Sub-threshold based sensing (b) Fringe field based sensing and (c) Tunneling current based sensing. a) In Sub-threshold based sensing, FET with a suspended gate is used for displacement sensing. The FET is biased in the sub-threshold region of operation. The exponential modulation of drain current for a change in displacement of 1 nm is evaluated using TCAD, and the in uence of initial air-gap variation on the sensitivity factor ( ID=ID) is brought out. For 1% change in air gap displacement (i.e., TGap/TGap, the gap variation resulting due to the inertial force / mass loading) nearly 1050% change in drain current( ID=ID) is observed (considering initial air gaps of the order 100 nm). This validates the high sensitivity offered by the device in this regime of operation. A comparison of sensitivity estimate using the capacitive equivalence model and TCAD simulated model for different initial air-gaps in a FD-SOI FET is brought out. The influence of FDSOI FET device parameters on sensitivity, namely the variation of TSi, TBox, NA and TGap are explored. CMOS compatibility and fabrication feasibility of this architecture was looked into by resorting to the post processing approach used for validating the sub-threshold bias concept. The IMD layers of the Bulk FETs fabricated through AMS 0.35 technology were etched using BHF and IPA mixture to result in a free standing metal (Al) layers acting as the suspended gate. The performance estimate is carried out considering specific Equivalent Gap Thickness (EGT) of 573 nm and 235 nm, to help overcome the role of coupled electrostatics in influencing the sensitivity metric. The sensitivity observed by biasing this post processed bulk FET in sub-threshold is 114% ( ID=ID change) for a 59% ( d/d change). The equivalent C in this case is 370 aF. b) In Fringe eld based sensing approach, a JunctionLess FET (JLFET) is used as a depletion mode device and an out-of-plane gate displacement would help modulate the device pinch-o voltage due to fringe field coupling. The resulting change in the gate fringe field due to this displacement modulates the drain current of the JunctionLess FET. The displacement induced fringe field change (relative to the FET channel) brings about a distinct shift in the ID-VG characteristics of the JLFET. For displacement d = 2 nm, the JLFET with a channel doping of ND = 8X1018cm 3 and a bias point of VG = -47.7 V, 98% enhancement in sensitivity is observed in 3D TCAD simulations. The equivalent C in this case is 29 zF. The role of ground-planes in the device operation is explored. c) In the tunneling current based sensing approach, the beams fabricated using the SOI-MUMPS process are FIB milled so as to create very ne air gaps of the order of nearly 85 nm. Under high electric fields of the order > 8 MV/cm, the lateral displacement based tunneling sensor offers enhanced change in sensitivity for an induced external force at a fixed DC bias. When integrated as an array with varying electrode overlap, this technique can track displacements over a wide range. With the initial beam overlap as 1.2 m, for a lateral displacement of 1.2 m, a 100% change in sensitivity ( ID=ID) is observed. The effect of fringe field can be completely neglected here unlike its capacitive beam equivalent.

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