La gestion de l'énergie électrique est au cœur des enjeux environnementaux. L'éclosion de semi-conducteurs à grand gap comme le carbure de silicium (SiC) permet la réalisation de composants aux performances supérieures à celles des composants en silicium pour l'électronique de puissance. Toutefois, le comportement de ces dispositifs lors de décharges électrostatiques (ESD) ou lors de radiations est mal connu et nécessite des études spécifiques. Dans ces travaux, plusieurs composants MESFET SiC ont ainsi été testés face aux ESD et l'étude des mécanismes de défaillance a montré soit la défaillance de l'oxyde de passivation, soit la sublimation du SiC suite au déclenchement d'une structure parasite. L'intégration d'une diode Zener sur le drain du MESFET a ainsi été testée et validée comme protection ESD. La simulation démontre que la protection est inefficace par rapport à la tenue aux radiations d'ions lourds. Assurer la robustesse de ces technologies n'apparaît pas plus simple que pour les composants en silicium. Des solutions sont toutefois envisageables pour aider les concepteurs à améliorer la robustesse aux ESD, bien que des études supplémentaires restent à mener. / Power management is nowadays crucial with the global warming and the electronic needs of the society. Wideband gap semi-conductors like Silicon Carbide (SiC) are emerging in power electronic landscape because of their better properties in comparison with Silicon. Nevertheless reliability and knowledge about internal physic during electrostatic discharge (ESD) or radiation event is still missing and need specific studies. In this work, several SiC MESFET have been tested and results show two mains failure mechanism. First the passivation oxide clamping, and secondly the SiC sublimation induced by a parasitic structure in the device. An ESD protection was tested and validated. Unfortunately, this solution isn't efficient for heavy ion protection. Indeed, no impact on the radiation robustness is noticed on the MESFET during a radiation event. SiC ESD reliability doesn't look better than for Silicon devices. ESD robustness improvements are proposed in this work even if integration of this MESFET is still required to validate the improvement.

Orientador: Jose Alexandre Diniz / Tese (doutorado) - Universidade Estadual de Campinas, Faculdade de Engenharia Eletrica e de Computação / Made available in DSpace on 2018-08-10T02:20:44Z (GMT). No. of bitstreams: 1 Zoccal_LeonardoBreseghello_D.pdf: 6734188 bytes, checksum: 05f6c64d923bafb5e071d89514d0fa43 (MD5) Previous issue date: 2007 / Resumo: Este trabalho apresenta um método simples de passivação de superfícies semicondutoras III-V de substratos de arseneto de gálio (GaAs) e de heteroestruturas de fosfeto de gálio-índio sobre arseneto de gálio (InGaP/GaAs), que são utilizados em transist res de efeito de campo, MESFET (Metal-Semiconductor Field Effect Transistor) e MISFET Metal-Insulator-Semiconductor Field Effect Transistor), e transistores bipolares de heterojunção (HBT), respectivamente. O processo de passivação visa à máxima redução da densidade de estados de superfícies semicondutoras para níveis menores que 1012 cm-2. A alta densidade de estados na superfície do GaAs provoca corrente de fuga nas regiões ativas dos transistores MESFET e HBT, reduzindo o desempenho destes dispositivos. Além disso, impossibilita a formação de dispositivos MISFET sobre os substratos de GaAs, devido à alta densidade de estados na região da interface isolante-semicondutor. Para o estudo da passivação de superfícies, filmes de nitreto de silício (SiNX) são depositados diretam nte por plasma ECR-CVD (Electron Cyclotron Resonance - Chemical Vapor Deposition) sobre substratos de GaAs e heteroestruturas do tipo InGaP/GaAs. Os plasmas ECR foram analisados por espectroscopia de emissão óptica (OES), e identificou-se baixa formação de espécies H e NH na fase gasosa para pressão de processo de 2,5 mTorr. Os filmes de SiNX foram caracterizados estruturalmente por espectroscopia de absorção do infravermelho (FTIR) e por elipsometria, que indicaram, respectivamente, a formação de ligações Si-N e valores de índice de refração es de nitreto de silício. Capacitores MIS e transisto T foram fabricados para avaliar os efeitos da passivação sobre os dispositivos. Os excelentes resultados obtidos, tais como transist o e em torno de 2,0 nos filmres MISFET e HB ores HBT passivados apresentando maiores ganhos de corrente do que os não-passivados, e os transistores MISFET apresentando maiores valores de transcondutância do que os MESFET (que foram usados como dispositivos de controle), indicam que o nosso processo de passivação é muito eficiente, sendo completamente compatível com a tecnologia de fabricação de circuitos integrados monolíticos de microondas (MMIC) / Abstract: This work presents a simple passivation method for III-V semiconductor surfaces of gallium arsenide (GaAs) substrates and indium-gallium phosphide on gallium arsenide (InGaP/GaAs) heterostructures, which are us in field effect transistors MESFET (Metal-Semiconductor Field Effect Transistor) and MISFET (Metal-Insulator-Semiconductor Field Effect Transistor) and heterojunction bip lar transistors (HBT), respectively. The passivation process aims the maximum reduction of semiconductor surface state density at levels lower than 1012 states/cm2. The high surface state density on GaAs surface produces current leakage in active regions of MESFET and HBT transistors, reducing the device performance. Furthermore, the MISFET device formation on GaAs substrate is not allowed, passivation study, silicon nitride films (SiNX) are deposited by ECR-CVD (Electron Cyclotron Resonance - Chemical Deposition Vapor) plasma directly over GaAs substrate and InGaP/GaAs heterostructures. The ECR plasmas were analyzed by optical emission spectroscopy, (OES), and low formation of H and NH molecules in the gas phase was detected at process pressure of 2.5 mTorr. The SiNX film structural characterization was obtained by infra-red absorption spectrometry (FTIR) and ellipsometry, which, respectively, indicate the Si-N bo tive index values of about 2.0 at the silicon nitride films. MIS cap BT transistors were fabricated to verify the passivation process effect on devices. The excellent results obtained, such as higher and formation and refracacitors, MISFET and H current gain of passivated device compared to unpassivated HBTs and higher transconductances of MISFET devices compared to MESFET (which were used as control devices), indicate that our simple passivation process is very efficient, being fully compatible with monolithic microwave integrated circuits (MMIC) / Doutorado / Eletrônica, Microeletrônica e Optoeletrônica / Doutor em Engenharia Elétrica

Film thickness, free carrier concentration and free carrier mobility are critical figures of merit for silicon carbide epitaxial growth. Room temperature Fourier Transform Infrared (FTIR) reflection spectroscopy can estimate these parameters non-destructively and is capable of high-resolution wafer mapping. Commercially available equipment has greatly simplified the application of this technique by coupling a high performance automated spectrometer with model-based data analysis and interpretation based on the personal computer. While powerful numerical techniques run fast and efficient on modern computers, it is essential that low-order, well-conditioned models are needed. The observed reflectance spectrum is the result of reflection and refraction of light at different interfaces due to constructive and destructive interference. The estimation of film thickness and free carrier concentration for single epitaxial layers has been improved by studying the Longitudinal Optical Phonon Plasmon (LPP) coupled modes. However, the addition of multiple layers introduces many degrees of freedom, which complicates parameter extraction. The multiple epitaxial layer stacks studied were intended for Metal Semiconductor Field Effect Transistor (MESFET?s) on both conducting and semi-insulating substrates. The thickness estimation of the n-channel in the MESFET stack on semi-insulating substrate is improved by preconditioning the curve fit for plasma frequency obtained from doping estimation from capacitance voltage profiling or by observing an LPP- peak.

The objectives of this investigation are to develop a precise, non-destructive single crystal stress measurement technique, develop a model to explain the phenomenon known as 3power slump2, and investigate the role of device processing on wafer breakage. All three objectives were successfully met. The single crystal stress technique uses a least squares analysis of X-ray diffraction data to calculate the full stress tensor. In this way, precise non-destructive stress measurements can be made with known error bars. Rocking curve analysis, stress gradient corrections, and a data reliability technique were implemented to ensure that the stress data are correct. A theory was developed to explain 3power slump2, which is a rapid decrease in the amplifying properties of microwave amplifier circuits during operation. The model explains that for the particular geometry and bias configuration of the devices studied in this research, power slump is linearly related to shear stress at values of less than 90 MPa. The microscopic explanation of power slump is that radiation enhanced dislocation glide increases the kink concentration, thereby increasing the generation center concentration in the active region of the device. These generation centers increase the total gate current, leading to a decrease in the amplifying properties of the device. Passivation layer processing has been shown to both reduce the fracture strength and increase the residual stress in GaAs wafers, making them more susceptible to wafer breakage. Bare wafers are found to have higher fracture strength than passivated wafers. Bare wafers are also found to contain less residual stress than SiON passivated wafers, which, in turn, are found to have less stress than SiN passivated wafers. Topographic imaging suggests that SiN passivated wafers have larger flaws than SiON passivated wafers, and that the distribution of flaw size among SiN passivated wafers is wider than the distribution of flaws in SiON passivated wafers. These flaws are believed to lead to breakage of the device during processing, resulting in low fabrication yield. Both the power slump model and the wafer breakage data show that these phenomena are dependent on residual stress developed in the substrate during device fabrication. Reduction of process-induced residual stress should therefore simultaneously decrease wafer breakage rates and reduce power slump during device fabrication and operation. / Ph. D.

Accurate small and large-signal models of metal-semiconductor field effect transistor (MESFET) devices are essential in all modern microwave and millimeter wave applications. Those models are used for robust designs and fabrication development. The sophistication of modern communication systems urged the need of monolithic microwave integrated circuits (MMICs), which consists of many MESFETs on the same chip. As the chip density increases, the need of accurate MESFET models becomes more pronounced. In this study, a new technique has been developed to extract a 15-element small signal model of MESFET devices. This technique implies the use of three sets of S-parameter measurements at different bias conditions. The technique consists of two major steps; in the first step, some of the bias-independent extrinsic parameters are estimated in preparation for the second step. In the second step, all other parameters should be extracted at the bias point of interest. This technique shows reliable results. Unlike other optimization techniques, our proposed technique shows insensitivity to the unavoidable measurement errors over any frequency range. It shows a unique solution for all parameter values. This technique has been tested on S-parameters of a hypothetical device model and compared with other optimization-based extraction techniques. Moreover, it has been also applied to GaAsTEK 0.8x300 μm2 MESFETs to extract the model parameters at different bias voltages. The study reveals accurate and consistent results among the similar devices on the same wafer. Some thermal characteristics of the small-signal parameters are discussed. The parameters are extracted from measurements at three temperatures for two similar devices on the same wafer. The thermal results of the two devices demonstrate consistent results, which assure the preciseness, and robustness of our proposed technique. In addition, the relation between the small-signal model parameters and the large signal model parameters is also presented. The parameters of an empirical model for the drain-source current are extracted from the dc measurements along with the small-signal transconductance and output conductance. The large-signal model results for a GaAsTEK 0.8x300 μm2 MESFET are introduced. / Ph. D.

The recent trend in modern information technology has been towards the increased use of portable and handheld devices such as cellular telephones, personal digital assistants (PDAs), and wireless networks. This trend presents the need for compact and power efficient radio systems. Typically, the most power inefficient device in a radio system is the power amplifier (PA). PA inefficiency requires increased battery reserves to supply the necessary DC bias current, resulting in larger devices. Alternatively, the length of time between battery charges is reduced for a given battery size, reducing mobility. In addition, communications channels are becoming increasingly crowded, which presents the need for improved bandwidth efficiency. In order to make more efficient use of the frequency spectrum allocated for a particular system, there is a push towards complex higher order digital modulation schemes in modern radio systems, resulting in stricter linearity requirements on the system. Since power efficient amplifiers are typically nonlinear, this poses a major problem in realizing a bandwidth and power efficient radio system. However, by employing various linearization techniques, the linearity of a high efficiency PA may be improved. The work presented in this thesis focuses on diode predistortion linearization, particularly for PA RFICs in digital radios. Background discussion on common linearization techniques available to the PA designer is presented. In addition, a discussion of traditional and modern methods of nonlinearity characterization is presented, illustrating the nonlinear PA effects on a modulated signal. This includes the use of two-tone analysis and the more modern envelope analysis. The operation of diode predistortion linearizers is discussed in detail, along with diode optimization procedures for PA linearization with minimum impact on return loss and gain. This diode optimization is effective in improving the ability to integrate the predistorter into a single, linearized PA RFIC chip. MESFET and HBT based diode linearizers are studied for use with corresponding MESFET and HBT based PAs in the 2.68 GHz and 1.95 GHz frequency bands, respectively. Results show an improvement in adjacent channel power ratio (ACPR) due to the linearizer in both MESFET and HBT cases. A fully integrated 1.95 GHz linearizer and PA RFIC in HBT technology is also presented. Design considerations, simulations, and layouts for this design are presented. Finally, several recommendations are made for continued research in this area. / Master of Science

No description available.

97% des articles publiés sur les études climatiques racontent que le réchauffement climatique est entièrement causé par les activités humaines. Les gaz émis lors de la production d'énergie électrique ainsi que d'autres gaz rejetés par les voitures ont un réel impact sur l'atmosphère. Une solution consiste à mettre au point des composants présentant des pertes de conduction plus faibles et des caractéristiques de claquage plus élevées qui pourraient être utilisés dans des centrales nucléaires, des cellules de commutation à haute puissance, des voitures hybrides (électriques), etc.De nos jours, les composants à base de silicium contrôlent environ 95% des dispositifs électroniques. Le carbure de silicium SiC et le nitrure de gallium GaN sont actuellement à l’étape de R&D, et commencent à être intégrés dans certains circuits électroniques. D'autres matériaux tels que Ga2O3, AlN ou le diamant sont encore à l’étape de recherche. Les derniers sont connus sous le nom de matériaux à bande ultra large et semblent être la solution requise pour les faibles pertes de puissance. Le diamant est reconnu comme le matériau ultime pour la prochaine génération de composants de puissance en raison de ses propriétés physiques exceptionnelles telles qu'un champ de claquage élevé (>10 MV/cm) permettant d'utiliser le dispositif pour une commande de puissance élevée, une mobilité de porteurs élevée (2 000 cm^2/V.s pour les trous), une vitesse de saturation élevée, une conductivité thermique élevée (22 W/cm.K) pour une parfaite dissipation de chaleur et une faible constante diélectrique. Théoriquement, le diamant est le semi-conducteur offrant le meilleur compromis entre résistance à l'état passant et tension de claquage. En particulier, en raison de l'ionisation incomplète des dopants, il est encore plus efficace à haute température. Diverses diodes Schottky en diamant (SBD) avec de bonnes performances à l’état passant et bloqué (7,7 MV/cm) ont été rapportées. En plus des SBDs, des transistors à effet de champ (FET) ont également été étudiés à travers des oxyde-métal semi-conducteur FETs (MOSFETs) utilisant une surface hydrogénée avec des densités de courant élevées à l'état passant ou des surface oxygéné avec de bonnes caractéristiques de blocage. Pour les composants de haute-tension, il est nécessaire de changer l’architecture de l’électrode afin d’éviter un claquage prématuré due à l’encombrement du champ électrique aux bords. Dans ce but, les techniques de terminaison de bord sont utilisées pour atteindre les caractéristiques idéales. La tâche évidente avant toute fabrication de composant est la partie simulation qui prédit l’optimisation de l’architecture et les caractéristiques attendues. Une bonne prédiction nécessite la connaissance des paramètres du matériau. Les paramètres importants pour le claquage sont les coefficients d'ionisation par impact. Plusieurs coefficients ont été publiés pour le diamant. Toutefois, ils ont été extraits en « fittant » des structures non optimisées, d'où un manque de précision.Dans cette étude, deux structures de terminaisons de bord pour des diodes Schottky, appelées plaque de champ et anneaux à champ flottant, ont été étudiées. Leur efficacité de distribution du champ de surface par analyse de courant induit par faisceau d'électrons (EBIC) a été observée. De plus, des FETs ont été fabriqués et caractérisés, un MESFET et un RB-MESFET. Les FETs présentent un claquage élevé, jusqu’à 3 kV et une faible résistance. Le développement des transistors est indissociable de la diode Schottky, car ils sont tous deux nécessaires à la fabrication de cellules de commutation. Et enfin, les coefficients d'ionisation par impact pour les électrons ont été mesurés à l'aide d’EBIC pour un champ >0,5 MV/cm dans une région sans défaut. Les valeurs mesurées sont (sous l’equation de Chynoweth) an = 971 /cm et bn=2,39x10^6 V/cm. Ces valeurs sont proches des coefficients mesurés expérimentalement et rapportés dans la littérature. / 97% of the published climate studies articles agree with the fact that recent global warming is entirely caused by human activities. The gases emitted to produce electrical energy plus other gases rejected by cars impact considerably on the atmosphere by greenhouse effect (without referring other factors). A solution to this problem is the development of components with lower power conduction losses and higher breakdown characteristics that could be used in nuclear power plants, high power commutation cells, hybrid (electric) cars and so on.The choice of the material to reach low power conduction losses and higher breakdown is of great importance. Nowadays, silicon-based devices control about 95% of all electronic components. Silicon carbide SiC and gallium nitride GaN are at present under research and development and start to be integrated into some electronic circuits. Other materials like Ga2O3, AlN or diamond are under research for power electronic application. The last ones are known as ultra wide bandgap materials and they seem to be the required solution to low power losses. Diamond is recognized as the ultimate material for the next next-generation of power devices owing to its exceptional physical properties such as high breakdown field (>10 MV/cm) to use the device for high power control, high carrier mobility (2000 cm^2/V.s for holes) for fast switching and high frequency devices, high saturation velocity, high thermal conductivity (22 W/cm.K) for a perfect heat dissipation and low dielectric constant. Theoretically, diamond is the best semiconducting material showing the best trade-off between on-resistance and breakdown voltage. Especially, due to the incomplete ionization of the dopant, it is even more efficient at high temperature. Various diamond Schottky barrier diodes (SBDs) with good forward and reverse performances (7.7 MV/cm) were reported. In addition to SBDs, switches diamond field effect transistors (FETs) were also investigated through metal-oxide-semiconductor FETs (MOSFETs) using either an H-terminated diamond surface with high current densities in on-state or an O-terminated one with high blocking characteristics. For the high blocking voltage devices, one needs to properly terminate the edge of the electrode at the surface in order to avoid premature breakdown of the devices due to electric field crowding at the borders. In that aim, edge termination (ET) techniques are used to push the limit of the devices and reach ideal features. The obvious task before any device fabrication if the simulation part that predicts the device optimization and expected characteristics. A good device prediction requires knowledge of the material parameters. Important parameters for device breakdown in the off-state are the impact ionization coefficients. At present, several ionization coefficients were reported for diamond, however, they were extracted by fitting non-optimized structures and hence there is a lack of accuracy.In this study, two edge terminations structures for Schottky barrier diodes called field plate (FP) oxide and floating field rings were investigated. Their effectiveness in surface field distribution via electron beam induced current (EBIC) analysis was observed. In addition, normally-on FETs were fabricated and characterized, a MESFET and a reverse blocking (RB)-MESFET. The FETs exhibited a high BV, up to 3 kV and a low on-resistance. The development of transistors is inseparable from the Schottky diode since both are required to fabricate commutation cells. And finally, impact ionization coefficients for electrons were measured using EBIC for a field >0.5 MV/cm in a defect-free region. The measured values are (in a Chynoweth form) an = 971 /cm and bn = 2.39x10^6 V/cm. These values are close to the experimentally measured coefficients reported in the literature.

Im ersten Teil der vorliegenden Arbeit werden die physikalischen Eigenschaften, insbesondere die elektrische Leitfähigkeit, von Zink-Zinn-Oxid Dünnschichten sowie darauf basierenden Schottky-Dioden in Abhängigkeit von der Kationenkomposition bestimmt. Zur Herstellung dieser Dünnschichten wurde ein Verfahren genutzt, welches die Herstellung von kontinuierlichen Kompositiongradienten im Rahmen eines gepulsten Laserabscheidungsprozesses bei Raumtemperatur ermöglicht. Erster Schwerpunkt der Diskussion ist die Abhängigkeit elektrischer Eigenschaften der Dünnschichten sowie die Diodeneigenschaften vom Kationenverhältnis. Des Weiteren wird die Langzeitstabilität der Schottky-Dioden und der Einfluss der Sauerstoffzufuhr während der Kontaktherstellung auf die Eigenschaften der Schottky-Dioden herausgestellt. DieErgebnissetiefenaufgelösterRöntgenphotoelektronenspektroskopiewerden diskutiert und ein Mechanismus, welcher zu einer Verbesserung der Schottky-Dioden über die Zeit führt, wird vorgestellt. Die Erkenntnisse über die optimale Kationenkomposition und den Einfluss des Sauerstoffs auf die Eigenschaften von Schottky-Dioden wurden genutzt, um Metall-Halbleiter-Feldeffekttransistoren herzustellen, welche im zweiten Teil der vorliegenden Arbeit beschrieben werden. In einem ersten Schritt wurden hierfür die Abscheidebedingungen in der Sputterkammer optimiert und eine neue Abscheiderezeptur für die Herstellung von Feldeffekttransistoren eingeführt. Auch hier finden alle Abscheidungen bei Raumtemperatur statt. Die Abscheidung mittels Sputtern wurde gewählt, da diese Abscheidemethode größere industrielle Relevanz als die gepulste Laserabscheidung hat. Metall-Halbleiter-Feldeffekttransistoren mit zwei verschiedenen Gate-Typen werden vorgestellt und jeweils der Einfluss der Kanalschichtdicke auf die Transistoreigenschaften untersucht. Der Einfluss des durch die Herstellung erzeugten Sauerstoffreservoirs in dem Schottky-Gate Kontakt auf die Eigenschaften der Feldeffekttransistoren wird ebenso gezeigt wie der Einfluss eines thermischen Ausheizprozesses auf die Schaltgeschwindigkeit der Feldeffekttransistoren. Außerdem werden einfache Inverter, welche auf zwei gleichartigen Feldeffekttransistoren basieren, vorgestellt. Ebenfalls werden SchottkyDioden Feldeffekttransistoren Logik basierte Inverter vorgestellt und charakterisiert. AbschließendwerdenRingoszillatoren,aufgebautausmehrereninReihegeschaltetenSchottkyDiodenFeldeffekttransistorenLogikbasiertenInverternvorgestellt. DerEinflussderKanalschichtdicke und der Gate-Geometrie auf die Oszillationsfrequenz wird diskutiert.:Contents 1 Introduction 2 Theoretical Descriptions 2.1 The Amorphous Semiconductor Zinc Tin Oxide 2.2 Schottky Barrier Diodes 2.3 Field-Effect Transistors 2.4 Inverter 2.5 Inverter Chain and Ring Oscillator 3 Methods 3.1 Growth and Structuring Techniques 3.1.1 Pulsed Laser Deposition 3.1.2 Sputtering Deposition 3.1.3 Photolithography 3.2 Characterization Techniques 3.2.1 Hall Effect Measurements 3.2.2 XRD and XRR Measurements 3.2.3 Static and Dynamic Current-Voltage Measurements 3.2.4 Further Characterization Techniques 4 Physical Properties of Amorphous Zinc Tin Oxide 4.1 Characterization of Pulsed Laser Deposited Zinc Tin Oxide Thin Films Having a Continuous Composition Spread 4.2 Properties of Schottky Barrier Diodes in Dependence on the Cation Composition 4.3 Long Term Stability of Schottky Barrier Diodes 4.4 ImportantRoleofOxygenfortheFormationofHighlyRectifyingContacts 4.5 Processes Governing the Long Term Stability 5 Demonstration and Characterization of Zinc Tin Oxide Based Devices 5.1 Implementation of a New Sputtering Recipe 5.1.1 CharacterizationandElectricalOptimizationoftheZincTinOxide Thin Films .1.2 Optimization of the Gate Contact 5.2 Devices with PtOx/Pt Gate Contact 5.2.1 Variation of the Channel Thickness 5.2.2 Influence of the Oxygen Reservoir on the Performance and Long Term Stability of Devices 5.2.3 Tuning of the Electron Mobility 5.2.4 Frequency Dependent Switching of Transistors 5.3 Devices with i-ZTO/PtOx/Pt Gate Contact 5.3.1 Transistors with Varying Channel Thickness 5.3.2 Simple Inverter 5.3.3 SDFL Inverter 5.3.4 Inverter Chain 5.3.5 Ring Oscillators 5.4 Comparison to Literature 6 Summary and Outlook Abbreviations List of Symbols Bibliography List of Own and Contributed Articles Appendix / In the first part of the present work the physical properties, especially the electrical properties, of zinc tin oxide thin films as well as Schottky diodes based thereon are determined as a function of the cation composition. For film growth, a room temperature pulsed laser deposition process was used, which allows the realization of a continuous composition gradient within one sample. First focus of the discussion is the dependence of electrical properties of thin films as well as diode properties on the cation ratio. Furthermore, the long-term stability of the Schottky diodes and the influence of the oxygen supply during contact fabrication on the properties of the Schottky diodes are highlighted. The results of depth-resolved Xray photoelectron spectroscopy measurements are discussed and a mechanism leading to an improvement of the Schottky diodes over time is elucidated. The findings on the optimal cation composition and the influence of oxygen on the properties of Schottky diodes were used to produce metal-semiconductor field-effect transistors, which are described in the second part of this thesis. In a first step, the deposition conditions in the sputter chamber were optimized and a new deposition recipe for the fabrication of field effect transistors was developed. Here, too, all depositions take place at room temperature. Sputter deposition was chosen because this deposition method has greater industrial relevance than pulsed laser deposition. Metal-semiconductor field-effect-transistors with two different gate types are presented and the influence of the channel layer thickness on the transistor properties is investigated. The influence of the oxygen reservoir in the Schottky gate contact on the properties of the field-effect-transistors is shown as well as the influence of a thermal annealing process on the switching speed of the field-effect-transistors. In addition, simple inverters based on two identical field-effect-transistors are demonstrated. Also Schottky diode field-effect-transistor logic based inverters are presented and characterized. Finally, ring oscillators consisting of several series-connected Schottky diode field-effecttransistor logic based inverters are presented. The influence of channel layer thickness and gate geometry on the oscillation frequency is discussed.:Contents 1 Introduction 2 Theoretical Descriptions 2.1 The Amorphous Semiconductor Zinc Tin Oxide 2.2 Schottky Barrier Diodes 2.3 Field-Effect Transistors 2.4 Inverter 2.5 Inverter Chain and Ring Oscillator 3 Methods 3.1 Growth and Structuring Techniques 3.1.1 Pulsed Laser Deposition 3.1.2 Sputtering Deposition 3.1.3 Photolithography 3.2 Characterization Techniques 3.2.1 Hall Effect Measurements 3.2.2 XRD and XRR Measurements 3.2.3 Static and Dynamic Current-Voltage Measurements 3.2.4 Further Characterization Techniques 4 Physical Properties of Amorphous Zinc Tin Oxide 4.1 Characterization of Pulsed Laser Deposited Zinc Tin Oxide Thin Films Having a Continuous Composition Spread 4.2 Properties of Schottky Barrier Diodes in Dependence on the Cation Composition 4.3 Long Term Stability of Schottky Barrier Diodes 4.4 ImportantRoleofOxygenfortheFormationofHighlyRectifyingContacts 4.5 Processes Governing the Long Term Stability 5 Demonstration and Characterization of Zinc Tin Oxide Based Devices 5.1 Implementation of a New Sputtering Recipe 5.1.1 CharacterizationandElectricalOptimizationoftheZincTinOxide Thin Films .1.2 Optimization of the Gate Contact 5.2 Devices with PtOx/Pt Gate Contact 5.2.1 Variation of the Channel Thickness 5.2.2 Influence of the Oxygen Reservoir on the Performance and Long Term Stability of Devices 5.2.3 Tuning of the Electron Mobility 5.2.4 Frequency Dependent Switching of Transistors 5.3 Devices with i-ZTO/PtOx/Pt Gate Contact 5.3.1 Transistors with Varying Channel Thickness 5.3.2 Simple Inverter 5.3.3 SDFL Inverter 5.3.4 Inverter Chain 5.3.5 Ring Oscillators 5.4 Comparison to Literature 6 Summary and Outlook Abbreviations List of Symbols Bibliography List of Own and Contributed Articles Appendix

En la presente tesis se muestra una nueva metodología de extracción "inteligente" de modelos circuitales lineales y no lineales para dispositivos MESFET y HEMT, además de efectuar numerosas aportaciones en el campo de las medidas radioeléctricas de dichos dispositivos mediante diseño del hardware y del software necesario para la automatización de las mismas. Por otro lado se presenta un novedoso modelo de Gran Señal para dispositivos HEMT de potencia que da cuenta del fenómeno de la compresión de la transconductancia y es fácilmente implementable en simuladores no lineales comerciales del tipo de MDS, LIBRA, HARMONICA, etc. Además se ha aumentado el rango de validez frecuencial de los modelos de pequeña señal mediante la obtención de las expresiones "exactas" de los modelos usuales de pequeña señal Vendelin-Dambrine, Vickes, Berroth & Bosch, etc. Otra novedad aportada por este trabajo de tesis ha sido aplicar estos modelos lineales a los transistores HEMT, evitando la obtención valores carentes de significado físico como ocurría hasta ahora. Como validación del modelo no lineal de HEMT se han llevado a cabo numerosas simulaciones del mismo en MDS que han sido comparadas con las medidas experimentales realizadas en nuestro laboratorio (Scattering, DC, Pulsadas y Pin/Pout) poniendo de manifiesto la exactitud del modelo. Para validar los modelos de pequeña señal se han efectuado simulaciones con el simulador lineal MMICAD utilizando transistores de diferentes tamaños procedentes de distintas foundries con objeto de visualizar el comportamiento del dispositivo independientemente del origen del mismo. / In this thesis a new methodology for the "intelligent" parameter extraction of linear and non-linear model for GaAs MESFET and HEMT devices is shown, besides numerous contributions in the field of Scattering and DC measurements of this kind of devices by means of hardware design and necessary software for the automation of the same have been done. On the other hand a novel Great Signal model for HEMT devices is presented. This model is capable to model the transconductance compression phenomenon and it is easily to built in commercial non-linear simulators like MDS, LIBRA, Microwave HARMONICA, etc. This work has also increased the frequency range for the usual small-signal models by means of calculate "exact" expressions of them. Another novelty contribution of this thesis is to apply for first time these linear models to HEMT transistors, avoiding the lacking of physical meaning values like it occurred up to now. To make possible the validation of non-linear HEMT model, simulations with MDS software and comparisons with experimental measurements made in our laboratory (Scattering, DC, Pulsed and Pin/ Pout) have been carried out and there was very good agreement between measured and simulated data. To validate small-signal models referred before, simulations with MMICAD software and comparisons between simulated and experimental scattering measurements using transistors of different sizes from several foundries and technological processes have been made.