Global ETD Search

141	Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications Jiang, Hongjin. January 2008 (has links) Thesis (Ph. D.)--Chemistry and Biochemistry, Georgia Institute of Technology, 2008. / Committee Chair: Dr. C. P. Wong; Committee Member: Dr. Boris Mizaikoff; Committee Member: Dr. Rigoberto Hernandez; Committee Member: Dr. Z. John Zhang; Committee Member: Dr. Z.L. Wang.
142	Effect of thermal and mechanical factors on single and multi-chip BGA packages Ng, Siu Lung. January 2007 (has links) Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
143	Investigation of the impact response of Pb-free electronic assemblies and comparison of drop with cyclic 4-point bend test Mirza, Fahad. January 2007 (has links) Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2007. / Includes bibliographical references.
144	Advanced process window design for 01005 assemblies Ramasubramanian, Arun Shrrivats. January 2008 (has links) Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, Thomas J. Watson School of Engineering and Applied Science, 2008. / Includes bibliographical references.
145	Multiscale EM and circuit simulation using the Laguerre-FDTD scheme for package-aware integrated-circuit design Srinivasan, Gopikrishna January 2008 (has links) Thesis (Ph.D.)--Electrical and Computer Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Prof. Madhavan Swaminathan; Committee Member: Prof. Andrew Peterson; Committee Member: Prof. Sungkyu Lim
146	Methodology for predicting microelectronic substrate warpage incorporating copper trace pattern characteristics McCaslin, Luke January 2008 (has links) Thesis (M. S.)--Mechanical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Sitaraman, Suresh; Committee Member: Peak, Russell; Committee Member: Ume, Charles
147	Stress relieving technique for plastic packages in a high volume manufacturing environment Batra, Ashish, January 2009 (has links) Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009. / Includes bibliographical references.
148	Signal and power integrity co-simulation using the multi-layer finite difference method Bharath, Krishna. January 2009 (has links) Thesis (M. S.)--Electrical and Computer Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Madhavan Swaminathan; Committee Member: Andrew F. Peterson; Committee Member: David C. Keezer; Committee Member: Saibal Mukhopadyay; Committee Member: Suresh Sitaraman.
149	Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead-free surface mount electronics assembly Ramkumar, S. Manian. January 2008 (has links) Thesis (Ph. D.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references (leaves 278-290).
150	Assembly, reliability, and rework of stacked CSP components Iyer, Satyanarayan Shivkumar. January 2008 (has links) Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2008. / Includes bibliographical references.

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