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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
51

Highly integrated polymer photonic switching and interconnects

Wang, Xiaolong, January 1900 (has links) (PDF)
Thesis (Ph. D.)--University of Texas at Austin, 2006. / Vita. Includes bibliographical references.
52

High-speed parallel optical receivers

Tang, Wei, 1976- January 2007 (has links)
No description available.
53

Development of thin film photodetectors and their applications: multispectral detection and high speed optical interconnections

Seo, Sang-Woo 01 December 2003 (has links)
No description available.
54

Polymer-based volume holographic grating couplers for optical interconnects

Wu, Shun-Der 03 1900 (has links)
No description available.
55

Prospects for Mirror-Enabled Polymer Pillar I/O Optical Interconnects for Gigascale Integration

Ogunsola, Oluwafemi Olusegun 27 October 2006 (has links)
Digital systems have derived performance benefits due to the scaling down of CMOS microprocessor feature sizes towards packing billions of transistors on a chip, or gigascale integration (GSI). This has placed immense bandwidth demands on chip-to-chip and chip-to-board interconnects. The present-day electrical interconnect may limit bandwidth as transmission rates grow. As such, optical interconnects have been proposed as a potential solution. A critical requirement for enabling chip-to-chip and chip-to-board optical interconnection is out-of-plane coupling for directing light between a chip and the board. Any solution for this problem must be compatible with conventional packaging and assembly requirements. This research addresses the prospects for integrating waveguides with mirrors and polymer pillar optical I/O interconnects to provide such a compatible, out-of-plane, chip-to-board packaging solution through the design, analysis, fabrication, and testing of its constituent parts and their ultimate integration.
56

A free-space optical solution for the on-chip global interconnect bottleneck experimental validation /

Nair, Rohit. January 2007 (has links)
Thesis (M.S.E.C.E.)--University of Delaware, 2007. / Principal faculty advisor: Michael W. Haney, Dept. of Electrical and Computer Engineering. Includes bibliographical references.
57

Investigation of Integrated Circuits for High Datarate Optical Links

Chun, Carl S. P.(Shun Ping) 24 November 2004 (has links)
Because of the need to move large amounts of data effienciently, optical based communications are a critical component of modern telecommunications. And as a key enabler of optical communications, electrical components play a critical role in optical data links. Optoelectronic integrated circuits provide the bridge between the optical and electrical realms. Electronic integrated circuits are also integral parts of the optical link, interfacing with post processing circuitry and compensating for any limitations along the link. In this investigation, three circuits for optical data link applications are studied. Two optoelectronic integrated circuit front-ends for freespace and long haul applications, respectively and an active filter for near end cross talk cancellation associated with high data rate transmission. The first circuit is an 8x8 monolithic receiver array for a Spatial Division Multiplexing optical link. A compact and low power 8x8 array was designed and demonstrated a channel that received data at rates of 1Gb/s. It is the first completely monolithic demonstration of a 2D receiver array within a conventional ion implanted GaAs MESFET process. The second circuit demonstrated a long wavelength (1.55 m) optoelectronic receiver for long haul applications. The circuit utilized a TWA topology, which maximizes the available bandwidth from the GaAs MESFET process. It incorporated a thin-film inverted MSM photodetector to achieve nearly monolithic integration. The final circuit is a tunable high pass active filter in 0.18 m CMOS technology. As part of a NEXT noise canceller architecture, it will provide the means to extend data transmission in FR-4 legacy backplanes into the tens of Gb/s datarate.
58

Volume Grating Couplers for Optical Interconnects: Analysis, Design, Fabrication, and Testing

Villalaz, Ricardo A. 12 July 2004 (has links)
Optical interconnects are important to the future development of microelectronics. Volume grating couplers (VGCs) provide a compact, efficient coupling mechanism that is compatible with microelectronics fabrication processes. In this dissertation, some of the performance characteristics of VGCs are investigated. Also, integration of VGCs with Sea of Polymer Pillars (SoPP), an emerging high-density input/output interconnect technology, is demonstrated and its performance quantitatively investigated. First, the polarization-dependent performance of VGCs is analyzed, and the design constraints for achieving high-efficiency polarization-dependent and polarization-independent VGCs are examined. The effects of loss on VGC performance are also presented. Then, the wavelength response of VGCs and its dependence on grating parameters is quantitatively examined. Experimental demonstrations of polarization-dependent and polarization-independent VGCs are then presented. Finally, a VGC integrated with a SoPP is demonstrated and its performance characterized.
59

Free space optic communication for Navy surface ship platforms

Timus, Oguzhan. January 2004 (has links) (PDF)
Thesis (M.S.)--Naval Postgraduate School, 2004. / Title from title screen (viewed Aug. 13, 2004). "March 2004." Includes bibliographical references (p. 71-73). Also issued in paper format.
60

Integration of thin film GaAs MSM photodetector in fully embedded board-level optoelectronic interconnects

Lin, Lei 28 August 2008 (has links)
Not available / text

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