Polycrystalline p-Cu2O were fabricated by reactive rf magnetron sputtering . we found that The electrical, optical, and crystallographical properties of films were strongly dependent on the deposition condition . Grant size increasing in the range from 10 to 45nm , A hole concentration increasing in the range from 1016 to 1017 cm-3 and a mobility increasing on the order of 10-1 cm2/V s were obtained in the cuprous oxide thin film prepared by controlling work pressure (Argon partial partial pressure ) . Fabricated thin-film heterojunction diodes consisting of a p-type cuprous oxide combined with and n-type Al-doped ZnO and ITO exhibited a rectifying current-voltage characteristic .

We analyze a toy model for p-n junction photovoltaic devices by simulating photoexcited state dynamics in silicon nanowires. One nanowire is approximately circular in cross section with a diameter of d = 1.17 nm. The other has an approximately rhombic cross-section with d1 = 1.16 nm and d2 = 1.71 nm. Both nanowires have been doped with aluminum and phosphorus atoms and capped with gold leads. We use Boltzmann transport equation (BE) that includes phonon emission, carrier multiplication (CM), and exciton transfer. BE rates are computed using non-equilibrium finite-temperature many-body perturbation theory (MBPT) based on Density Functional Theory (DFT) simulations, including excitonic effects from Bethe-Salpeter Equation. We compute total charge transfer amount generated from the initial photoexcitation and find an enhancement when CM is included. In particular, we see between 78% and 79% enhancement in the smaller wire, while we see 116% enhancement in the larger nanowire

There are many intensive researches for zinc compounds due to their wide band gaps and potential applications in visible and UV optoelectronic technologies. Zinc nitride is a n-type semiconductor material having a direct band gap, and is not widely studied. Previous papers reported that zinc nitride is a n-type semiconductor having low resistivity and high electron mobility. Its band gap varies from 1.23 eV to 3.2 eV depending on the process condition. In this work, we successfully fabricated zinc nitride p-n junction by heat treatment on zinc nitride films. The threshold voltage of p-n junction is about 1 V. The Zinc nitride films were prepared by reactive RF magnetron sputtering. The as-grown zinc nitride thin film is a n-type material. It is found that the film treated at 300¢J for 3 hours can be changed to a p-type material. The zinc nitride has a very low resistance (2.2¡Ñ10-2 £[-cm) and high carrier concentration (3.88¡Ñ1019 cm-3) after the heat treatment. The optical band gap of zinc nitride was determined as a direct band gap varying from 1.1 eV to 1.6 eV according to the temperature of heat treatment. The zinc nitride was successfully prepared with various electrical characteristics and band gaps by controlling the temperature of heat treatment.

Experimental studies presented in this thesis have shown the first realisation of resonant tunnelling transport through two impurities in a vertical double-barrier tunnelling diode; have proved the chiral nature of charge carriers in graphene by studying ballistic transport through graphene $p$-$n$ junctions; have demonstrated significant differences of $1/f$ noise in graphene compared with conventional two-dimensional systems. Magnetic field parallel to the current has been used to investigate resonant tunnelling through a double impurity in a vertical double-barrier resonant tunnelling diode, by measuring the current-voltage and differential conductance-voltage characteristics of the structure. It is shown that such experiments allow one to obtain the energy levels, the effective electron mass and spatial positions of the impurities. The chiral nature of the carriers in graphene has been demonstrated by comparing measurements of the conductance of a graphene $p$-$n$-$p$ structure with the predictions of diffusive models. This allowed us to find, unambiguously, the contribution of ballistic resistance of graphene $p$-$n$ junctions to the total resistance of the $p$-$n$-$p$ structure. In order to do this, the band profile of the $p$-$n$-$p$ structure has been calculated using the realistic density of states in graphene. It has been shown that the developed models of diffusive transport can be applied to explain the main features of the magnetoresistance of $p$-$n$-$p$ structures. It was shown that $1/f$ noise in graphene has much more complicated concentration and temperature dependences near the Dirac point than in usual metallic systems, possibly due to the existence of the electron-hole puddles in the electro-neutrality region. In the regions of high carrier concentration where no inhomogeneity is expected, the noise has an inverse square root dependence on the concentration, which is also in contradiction with the Hooge relation.

The increasing demand of renewable energy is the big driving force for the research and development of more efficient solar energy conversion solutions. Solar cells, which use the photovoltaic effect to convert the photon energy to electrical current, are an important solar energy conversion technique. One solar cell technology is thin-film solar cells. Thin-film solar cells use an absorption layer with a direct band gap. A direct band gap has the advantage that the photons will penetrate less deep until a photoexcitation occur compared to semiconductors with an indirect band gap (e.g. silicon). For this reason the thin-film solar cells can be made very thin.CIGS is a common thin-film solar cell absorber material containing copper (Cu), indium (In), gallium (Ga) and selenium (Se). One objective of this work has been to determine element concentrations of CIGS absorption layers from sample measurements. The GGI ratio determines the band gap, which is an important factor for optimising the efficiency of the solar cell.1 The copper vacancy is the main acceptor dopant in CIGS. The Cu concentration has shown to be important for the efficiency and for other properties of the absorber [2].The measuring technique used in this work has been photoelectron spectroscopy (PES). PES produces a spectrum showing distinct peaks corresponding to electron binding energy levels for specific element subshells. Measurements with different photon energies have been performed on samples with and without post deposition treatment (PDT). A great deal of the effort has been to calculate relative element concentrations based on the PES peak intensities. Two important parameters when performing the calculations are the photoionization cross section (including the angular dependence of the cross section) and the inelastic mean free path of the photoelectrons.The results show that the GGI and the corresponding band gap will be almost the same with and without PDT except for close to the surface where PDT lowers the GGI.The calculations showed that the copper concentration is lowest at the surface. Moreover, PDT with RbF results in lower copper concentration closer to the junction.The results show a discrepancy of the GGI and CGI ratios when using the angular dependent cross sections in [10] and [11] compared to using the cross sections in [6] and [7]. / Det ökande behovet av förnybar energi gör att forskning och utveckling av solenergilösningar är av största vikt. Solceller, vilka utnyttjar den fotovoltaiska effekten, är den vanligaste tekniken för omvandling av solenergi till elektricitet. Tunnfilmssolceller är en typ av solceller vars absorbent har ett direkt bandgap, till skillnad från kisel som har ett indirekt bandgap. Fördelen med ett direkt bandgap är att det ljusabsorberande materialet kan göras mycket tunt.En vanlig tunnfilmssolcell är CIGS. Det är en komposit bestående av koppar (Cu), indium (In), gallium (Ga) och selen (Se). Ett syfte med detta självständiga arbete har varit att beräkna koncentrationerna av de ingående ämnena i halvledarskiktet av CIGS. GGI-kvoten bestämmer bandgapet, vilket är en viktig faktor för solcellens verkningsgrad. Kopparvakansen är den huvudsakliga halvledaracceptorn i CIGS. Kopparkoncentrationen har visat sig vara viktig för bl.a. solcellens verkningsgrad [2].Mättekniken som används i detta arbete kallas fotoelektronspektroskopi (PES). PES-mätningar ger ett spektrum där spektrallinjerna representerar olika nivåer av elektroners bindningsenergi för olika grundämnen. Mätningar med olika fotonenergier, på prover med och utan ytbehandling (PDT), har utförts. En stor del av arbetet har varit att beräkna relativa koncentrationer av de olika grundämnena från spektrallinjerna i spektrumet. Viktiga parametrar som man behöver ta hänsyn till i uträkningarna är sannolikheten för en fotoemissionsprocess hos fotonerna, vinkelberoendet och den fria medelväglängden hos fotoelektronerna.Resultaten visar att GGI-kvot och bandgap blir nästan detsamma med eller utan PDT, förutom närmast ytan där PDT minskar GGI-kvoten.Resultaten visar också att kopparkoncentrationen är lägst på ytan och att PDT med RbF minskar kopparkoncentrationen närmast ytan.Resultaten visar att det blir skillnader mellan GGI- och CGI-kvoterna beroende på om beräkningarna baserats på vinkelberoende träffytor enligt [10] och [11] eller baserats på träffytor enligt [6] och [7].

京都大学 / 新制・課程博士 / 博士(工学) / 甲第24580号 / 工博第5086号 / 新制||工||1974(附属図書館) / 京都大学大学院工学研究科航空宇宙工学専攻 / (主査)教授 江利口 浩二, 教授 土屋 智由, 教授 平方 寛之 / 学位規則第4条第1項該当 / Doctor of Philosophy (Engineering) / Kyoto University / DFAM

No description available.

<p> This thesis presents an investigation of the electron-voltaic effect using epitaxial P-N junctions. The effect is manifested in the direct energy conversion of beta particles emitted from a radioisotope promethium^147 source by single and multi-junction devices. The purpose of the investigation is to determine the power outputs of the devices which may be combined in series and parallel combinations in the construction of an atomic battery with a small size and long lifetime (approximately 5 -10 years). </p> / Thesis / Master of Science (MSc)

No description available.

Power electronics plays an important role in many energy conversion applications in modern society including consumer electronics, data centers, electric vehicles, and power grids, etc. The key components of power electronic circuits are power semiconductor devices including diodes and transistors, which determine the performance of power electronics circuits. Traditional power devices are based on the semiconductor silicon (Si), which have already reached the silicon's material limit. Gallium nitride (GaN) is a wide bandgap semiconductor with high electron mobility and high critical electric field. GaN-based power devices promise superior device performance over the Si-based counterpart. The primary design target of a unipolar power device is to achieve low on-resistance and high breakdown voltage. Although GaN high electron mobility transistor (HEMT) is commercially available in a voltage class from 15 V to 900 V, the performance of GaN devices is still far below the GaN material limit, due to several reasons: 1) To achieve the normally-off operation in a GaN HEMT, the density of two-dimensional electron gas (2DEG) channel cannot be too high; this limits the on-resistance reduction in the access region. 2) The gate capacitance of GaN HEMT is usually low so that the carrier concentration in the channel underneath the gate is relatively low, limiting the on-resistance reduction in the gated channel region. 3) The electric-field distribution in the drift region is not uniform, resulting in a limited breakdown voltage. We proposed to use the junction-based structure in GaN power devices to address the above problems and fully exploit GaN's material properties. The first part of this dissertation characterizes nickel oxide (NiO) as a p-type material to construct the junction-based GaN power devices. Although the homogenous p-GaN/n-GaN junction is preferred in many devices, the selective-area, p-GaN regrowth can lead to excessive leakage current; in comparison, the p-NiO/n-GaN junction is stable without leakage. This section describes the optimization of NiO deposition as well as the NiO characterization. Although acceptor in NiO is not generated by impurity doping, the acceptor concentration modulation is realized by tuning the O2 partial pressure during the sputtering process. Practical breakdown electric field is also characterized and confirmed to be higher than GaN. These results provide the design guidelines for NiO-GaN junction-based power devices. The second part of this dissertation demonstrates the 3D NiO-GaN junction gate to improve the GaN HEMT's on-resistance. The 3D junction gate structure enables a high carrier concentration under the gate region in the device on-state. Meanwhile, the strong depletion effect of the junction-based gate allows for a robust normally-off operation; as a result, the GaN wafer with a higher 2DEG concentration can be used to achieve both normally-off and low on-state resistance in HEMT devices. Simulation is also performed to project the performance space of trigate GaN junction HEMTs using the p-GaN instead of NiO. The third part of this dissertation presents the application of the p-GaN/n-GaN junction in the drift region of the multi-channel lateral devices to achieve the high breakdown voltage. Here p-GaN is grown in-situ with the multi-channel AlGaN/GaN structure, and there is no leakage problem. The structure is designed to achieve charge balance between the acceptor in p-GaN and the net donor in the multichannel AlGaN/GaN. This design enables a uniform electric field distribution and breakdown voltage over 10 kV. The fourth part of this dissertation presents the application of the p-NiO/n-GaN junction in vertical superjunction (SJ) devices. We show the design and simulation of this heterojunction structure in a SJ and confirm the uniform electric field and high breakdown voltage under the charge balance. Then the device fabrication is presented in detail, which mainly comprises the deep GaN trench etch, NiO self-aligned lift off, and photoresist trench planarization. The optimized device shows a trade-off between its drift region specific on-resistance versus breakdown that exceeds the 1D GaN's limit. The last part of this dissertation is exploring the design and fabrication of p-GaN/n-GaN based SJ devices. First, the challenges in p-GaN regrowth especially the introduction of interface impurities are discussed, followed by device simulation and modeling to optimize the SJ performance considering these interface impurities. The activation of regrown p-GaN in deep trenches is more difficult than planar p-GaN, and we present the characterization and physical model for the activation of the deep buried p-GaN. Last, the results of p-GaN filling regrowth and the acceptor concentration calibration in the lightly doped p-GaN are presented and discussed. In summary, our work combines experimental device fabrication and characterization, TCAD simulation, and device modeling to demonstrate the benefit of multi-dimensional, junction-based GaN power devices as compared to the traditional GaN power devices. The junction-based structure at gate region can provides stable normally-off operation and low on-resistance. When being applied to the drift region, the multidimensional junction structure can push the device specific on-resistance versus breakdown voltage trade-off near or even exceeding the material limit. These results will advance the performance and application spaces of GaN power devices. / Doctor of Philosophy / Power electronics plays an important role in many energy conversion applications in modern society including consumer electronics, data centers, electric vehicles, and power grids, etc. The key components of power electronic circuits are power semiconductor devices including diodes and transistors, which determine the performance of power electronics circuits. Traditional power devices are based on the semiconductor silicon (Si), which have already reached the silicon's material limit. Gallium nitride (GaN) is a wide bandgap semiconductor with high electron mobility and high critical electric field. GaN-based power devices promise superior device performance over the Si-based counterpart. Currently, GaN power devices performance is still far below its material limit due to several reasons: 1) To achieve normally-off operation, the carriers at gate region need to be fully depleted at zero bias. Due to a relatively limited depletion capability of the planar gate, the normally-off operation poses an upper limit on the channel carrier density, which increases the device on-resistance. 2) The electric field distribution is not uniform when the device is blocking off-state voltage, and the crowded electric field will cause the device premature breakdown. This work proposed to use multi-dimensional, p-n junction-based device structure to overcome the above challenges. The devices with diverse structures are fabricated, characterized, and compared with the commercially available devices. The multi-dimensional, junction-based gate structure provides strong electrostatic control to realize normally-off operation and allow for higher carrier concentration and lower on-resistance. The devices with multi-dimensional, junction-based drift region enables the uniform electric field distribution at the device off-state, allowing devices to block high voltage without compromising the on-state resistance. Examples of such devices investigated in this dissertation include the tri-gate junction transistors, reduced-surface-field (RESURF) diodes, and superjunction diodes. In summary, this work demonstrates the multi-dimensional, junction-based device structure to overcome the performance limitations of planar devices and fully exploit GaN's material benefits for power devices. The multi-dimensional, junction-based devices are experimentally fabricated and characterized, manifesting the superior performance over traditional GaN devices. This work will significantly boost the performance and application space of GaN power devices.